Patents by Inventor Kazuyori Takagi
Kazuyori Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11986909Abstract: The present invention uses a flux containing a rosin, a solvent, a thixo agent, and an activator. The thixo agent contains a polyamide and a compound represented by general formula (1). The polyamide is a condensate between an amine and at least one selected from aliphatic carboxylic acids and hydroxy group-containing aliphatic carboxylic acids, and has an endothermic peak at a temperature of 120-200° C. In the general formula, R11 represents a hydrocarbon group having 11-30 carbon atoms. R0a represents a hydrogen atom or a hydrocarbon group having 12-31 carbon atoms. R0b represents an n-valent hydrocarbon group having 4-12 carbon atoms. R21 represents an alkylene group having 2-6 carbon atoms. R0c represents a single bond or an alkylene group having 2-6 carbon atoms. n represents 1 or 2. When n represents 1, m represents an integer of 1-3. When n represents 2, m represents 1.Type: GrantFiled: November 17, 2021Date of Patent: May 21, 2024Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Kenta Inoue, Nanako Miyagi, Tomoko Nagai, Kazuyori Takagi, Akiko Takaki
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Patent number: 11986910Abstract: The present invention employs a flux which contains rosin, a solvent, a thixotropic agent and an activator. The thixotropic agent contains a polyamide (PA2). The PA2 is a condensation product of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid and an aliphatic amine having from 3 to 10 carbon atoms; and the aliphatic carboxylic acid includes an aliphatic dicarboxylic acid having from 11 to 20 carbon atoms. With respect to the endothermic amount calculated from the peak area of the differential scanning calorimetry curve of PA2 as obtained by differential scanning calorimetry measurement, the ratio of the endothermic amount within the range of from 50° C. to 190° C. to the total endothermic amount within the range of from 50° C. to 200° C. is 90% or more.Type: GrantFiled: November 17, 2021Date of Patent: May 21, 2024Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Kenta Inoue, Nanako Miyagi, Tomoko Nagai, Kazuyori Takagi, Akiko Takaki
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Patent number: 11833620Abstract: Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.Type: GrantFiled: January 16, 2019Date of Patent: December 5, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Yutaka Hashimoto, Kazuyori Takagi, Tomoko Nagai, Nanako Miyagi, Kazuya Kitazawa, Akiko Takaki, Kazuhiro Minegishi, Teppei Otsuki, Rina Horikoshi, Ryuichi Tsuda, Hiroyoshi Kawasaki, Masato Shiratori
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Publication number: 20230321767Abstract: The present invention uses a flux containing a rosin, a solvent, a thixo agent, and an activator. The thixo agent contains a polyamide and a compound represented by general formula (1). The polyamide is a condensate between an amine and at least one selected from aliphatic carboxylic acids and hydroxy group-containing aliphatic carboxylic acids, and has an endothermic peak at a temperature of 120-200° C. In the general formula, R11 represents a hydrocarbon group having 11-30 carbon atoms. R0a represents a hydrogen atom or a hydrocarbon group having 12-31 carbon atoms. R0b represents an n-valent hydrocarbon group having 4-12 carbon atoms. R21 represents an alkylene group having 2-6 carbon atoms. R0c represents a single bond or an alkylene group having 2-6 carbon atoms. n represents 1 or 2. When n represents 1, m represents an integer of 1-3. When n represents 2, m represents 1.Type: ApplicationFiled: November 17, 2021Publication date: October 12, 2023Inventors: Kenta INOUE, Nanako MIYAGI, Tomoko NAGAI, Kazuyori TAKAGI, Akiko TAKAKI
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Publication number: 20230321768Abstract: The present invention employs a flux which contains rosin, a solvent, a thixotropic agent and an activator. The thixotropic agent contains a polyamide (PA2). The PA2 is a condensation product of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid and an aliphatic amine having from 3 to 10 carbon atoms; and the aliphatic carboxylic acid includes an aliphatic dicarboxylic acid having from 11 to 20 carbon atoms. With respect to the endothermic amount calculated from the peak area of the differential scanning calorimetry curve of PA2 as obtained by differential scanning calorimetry measurement, the ratio of the endothermic amount within the range of from 50° C. to 190° C. to the total endothermic amount within the range of from 50° C. to 200° C. is 90% or more.Type: ApplicationFiled: November 17, 2021Publication date: October 12, 2023Inventors: Kenta INOUE, Nanako MIYAGI, Tomoko NAGAI, Kazuyori TAKAGI, Akiko TAKAKI
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Publication number: 20230302586Abstract: The present invention employs a flux containing a resin component, an activator, and a solvent. The resin component contains a copolymer (A) having an alkene-derived repeating unit (al), and an acrylic acid-derived repeating unit (a2) in which a hydrogen atom bonded to a carbon atom at an a-position may be substituted with a substituent, and contains a rosin (B). A mixing ratio of the copolymer (A) and the rosin (B) is 1 or more as a mass ratio represented by copolymer (A)/rosin (B).Type: ApplicationFiled: March 3, 2023Publication date: September 28, 2023Inventors: Mutsuki KANEKO, Ryuichi TSUDA, Kazuyori TAKAGI
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Publication number: 20210060715Abstract: Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.Type: ApplicationFiled: January 16, 2019Publication date: March 4, 2021Inventors: Yutaka HASHIMOTO, Kazuyori TAKAGI, Tomoko NAGAI, Nanako MIYAGI, Kazuya KITAZAWA, Akiko TAKAKI, Kazuhiro MINEGISHI, Teppei OTSUKI, Rina HORIKOSHI, Ryuichi TSUDA, Hiroyoshi KAWASAKI, Masato SHIRATORI
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Patent number: 9844837Abstract: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.Type: GrantFiled: March 23, 2012Date of Patent: December 19, 2017Assignee: Senju Metal Industry Co., Ltd.Inventors: Masato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka, Masayuki Suzuki, Toru Hayashida, Seiko Ishibashi, Shunsaku Yoshikawa, Yoshie Yamanaka
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Publication number: 20170304961Abstract: Provided is a flux for a solder paste that can prevent peeling from electrode, which is seen in a component, a thickness of which is reduced, such a semiconductor package like BGA. Rosin, a glycol-ether-based solvent, an organic acid, a thixotropic agent, a halogen compound, and an imidazole compound are contained and the halogen compound is either an amine hydrohalide or an organohalogen compound or a combination of them. Their addition amounts stay within a range satisfying a formula of 2.5-X-0.625Y?0 in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %). However, the addition amount X of the amine hydrohalide and the addition amount Y of the organohalogen compound are such that 0?X?2.5 and 0?Y?4, excluding a range of 0?X<0.02 and 0?Y<0.1.Type: ApplicationFiled: November 6, 2015Publication date: October 26, 2017Inventors: Kazuyori Takagi, Toru Hayashida, Yutaka Hashimoto, Tetsu Takemasa, Nanako Miyagi, Ko Inaba
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Publication number: 20140141273Abstract: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.Type: ApplicationFiled: March 23, 2012Publication date: May 22, 2014Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Masato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka, Masayuki Suzuki, Toru Hayashida, Seiko Ishibashi, Shunsaku Yoshikawa, Yoshie Yamanaka