Abstract: There is provided a film-type edible oral mucosal patch comprising a main ingredient, a fentanyl compound, contained in a base comprising (A) a semi-synthetic water-insoluble polymer compound, (B) a semi-synthetic water-soluble polymer compound, (C) a synthetic water-soluble polymer compound, (D) a water-soluble polyhydric alcohol and (E) a pH-adjusting agent. The oral mucosal patch consists of substances accepted as the food additives or pharmaceutical additives approved for oral administration, and is industrially efficiently produced and easily and safely used.

Abstract: Disclosed is a rapidly soluble film preparation mainly comprising a drug, an edible polymer and a saccharide, a manufacturing method of which is simple, and having high elution rate.

Abstract: There is provided a film-type edible oral mucosal patch comprising a main ingredient, a fentanyl compound, contained in a base comprising (A) a semi-synthetic water-insoluble polymer compound, (B) a semi-synthetic water-soluble polymer compound, (C) a synthetic water-soluble polymer compound, (D) a water-soluble polyhydric alcohol and (E) a pH-adjusting agent. The oral mucosal patch consists of substances accepted as the food additives or pharmaceutical additives approved for oral administration, and is industrially efficiently produced and easily and safely used.

Abstract: Disclosed is a rapidly soluble film preparation mainly comprising a drug, an edible polymer and a saccharide, a manufacturing method of which is simple, and having high elution rate.

Abstract: The present invention provides a semiconductor device of the BGA (ball grid array) package type comprising: a semiconductor chip 1; a plurality of wiring layers 1B arranged on the semiconductor chip via an insulation layer 1A, each of the wiring layers having a chip-side land block 1C as a signal I/O region; a circuit substrate having a plurality of wiring lines; and a plurality of solder balls 2 each to be arranged on the chip-side land block for connecting the wiring layers to corresponding wiring lines on the circuit substrate; wherein each of the chip-side land blocks 1C has a land protrusion block 3 extending into the solder ball 2. The land protrusion block 3 increases the attachment strength between the chip-side land block 1C and the solder ball 2 and suppresses growth of a crack generated in the solder ball 2 due to a thermal stress.