Patents by Inventor Kazuyoshi Mego

Kazuyoshi Mego has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal print head
    Patent number: 4636813
    Abstract: The lead wires extending from heating resistors to a driver IC for the heating resistors are arranged in the space under the driver IC. These lead wires are constructed in that they become narrower in wire width as approaching the driver IC so as to lie within the width of the driver IC, and the lead wires positioned under the driver IC are constructed in that they become broader in wire width as approaching the connecting terminals of the driver IC. Connection of the lead wires and the driver IC is carried out by the face-down bonding using Controlled Collapse Bonding.By providing the construction as mentioned above, a thermal print head of higher density and definition can be obtained.
    Type: Grant
    Filed: October 28, 1985
    Date of Patent: January 13, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Kazuyoshi Mego, Shigetoshi Hiratsuka, Eiichi Hara