Abstract: In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C.

Abstract: According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include die bonding to bond a semiconductor element to a first position of a base member via a bonding layer provided on one surface of the semiconductor element. The method can include wire bonding to connect a terminal formed on the semiconductor element to a terminal formed on the base member by a bonding wire. In addition, the method can include sealing to seal the semiconductor element and the bonding wire. Viscosity of the bonding layer in the bonding is controlled not to exceed the viscosity of the bonding layer in the sealing.

Abstract: A flame detector is provided. A circuit board is disposed in a housing. A first light source emits first light. A light guide member comprised of translucent material guides the first light from the first light source to a light emission portion of the light guide member. A first light receiving element detects second light having a predetermined wavelength unique to the flames. A second light source emits third light to a translucent cover which is disposed between an opening of the housing and the first light receiving element. A second light receiving element detects the third light passed through the translucent cover to test the translucency. The first light source, the second light source and the second light receiving element are mounted on the circuit board. The light emission portion is formed into a substantially annular shape which encloses the first light receiving element at a front side of the housing to limit a field of view of the first light receiving element to a predetermined range.

Abstract: In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C.

Abstract: According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include die bonding to bond a semiconductor element to a first position of a base member via a bonding layer provided on one surface of the semiconductor element. The method can include wire bonding to connect a terminal formed on the semiconductor element to a terminal formed on the base member by a bonding wire. In addition, the method can include sealing to seal the semiconductor element and the bonding wire. Viscosity of the bonding layer in the bonding is controlled not to exceed the viscosity of the bonding layer in the sealing.

Abstract: A flame detector is provided. A circuit board is disposed in a housing. A first light source emits first light. A light guide member comprised of translucent material guides the first light from the first light source to a light emission portion of the light guide member. A first light receiving element detects second light having a predetermined wavelength unique to the flames. A second light source emits third light to a translucent cover which is disposed between an opening of the housing and the first light receiving element. A second light receiving element detects the third light passed through the translucent cover to test the translucency. The first light source, the second light source and the second light receiving element are mounted on the circuit board. The light emission portion is formed into a substantially annular shape which encloses the first light receiving element at a front side of the housing to limit a field of view of the first light receiving element to a predetermined range.

Abstract: A fire detector which can be observed an operating state thereof from every direction and decrease a cost thereof as possible. The fire detector (10) comprises: the circuit board (32) in which the circuit for detecting a fire is formed; the LED (35) which is surface-mounted on the circuit board (32); and the indication lamp for indicating the fire detector being under detection by emitting the light emitted from the LED (35), wherein the indication lamp comprises the light guide member (20) for introducing the light emitted from the LED (35) to the indication lamp with a ring shape, the light guide member (20) comprises the light incident parts (21) and (21) and the ring member (22), notches (23) and (23) are formed in the vicinity of the light incident parts (21) and (21) of the ring member (22), and a plurality of small grooves (24), and (24) . . . are formed in the bottom surface (22d) of the ring member (22).

Abstract: The fire detector for sensing a fire, comprises; a smoke chamber, a light emitting element, and a light detecting element for detecting a scattered light caused by scattering a light emitted by the light emitting element with a smoke which enters in the smoke chamber, wherein a wall part of the smoke chamber is formed in a shape based on a circle having a predetermined size, and comprises a projecting portion which projects from at least a part of the circle to an outside of the circle, the light emitting element is disposed on the projecting portion of the smoke chamber, and the light detecting element is arranged out of the smoke chamber and an optical axis thereof is approximately perpendicular to a plane including the circle.

Abstract: An ionization smoke detector comprising: an inner electrode; an intermediate electrode having an electrode body and an electrode piece extending from the electrode body, facing the inner electrode and connected to a field effect transistor; an outer electrode provided in an opposite side to the inner electrode with respect to the intermediate electrode; and an insulating supporter for supporting the intermediate electrodes to face the inner electrode.