Abstract: To fabricate a plurality of piezoelectric vibrating pieces while firmly preventing a defect, a crack, or a breakage from being brought about at a wafer in the midst of fabrication, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a plurality of piezoelectric vibrating pieces from a wafer S, the method including a film forming step of respectively forming metal films M on both faces of the wafer, a patterning step of removing a region of the metal film on an inner side of an outer peripheral end of the wafer by a constant distance H, thereafter, patterning the metal film M to outer shapes of the plurality of piezoelectric vibrating pieces, an outer shape forming step of forming outer shapes of the plurality of piezoelectric vibrating pieces at the wafer a size of which is reduced by an amount of the constant distance by selectively removing the wafer by wet etching by constituting a mask by the patterned metal film, and a removing step of removing the m

Abstract: Provided is a method of manufacturing a piezoelectric vibrator of the invention, the piezoelectric vibrator including a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to each of the pair of vibration arm portions, the piezoelectric vibrator being capable of regulating a degree of vacuum in the package more than a certain level by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method includes a gettering process of irradiating a laser in symmetrical positions via a center axis of the pair of vibration arm portions in the pair of regulation films.

Abstract: A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

Abstract: A glass substrate polishing method having polishing processes for polishing a glass substrate surface while supplying a polishing agent. The glass substrate polishing method is characterized in that the polishing processes include a first polishing process in which the surface of the glass substrate is polished using a first polishing pad made from a polishing cloth and a second polishing process in which the surface of the glass substrate is polished using a second polishing pad made from urethane foam.

Abstract: A package and method for manufacturing the package using a rivet having a head portion and a core portion protruding from a rear surface of the head portion. The package includes a plurality of substrates bonded to each other and a cavity that houses an object in a sealed state. The core portion is disposed in a through hole in a base substrate and electrically connects the object with the outside. The core portion is inserted into the through hole and a glass frit is formed between the through hole and the core portion and seals the rivet in the through hole. A gas relief passage is formed leading from a base end of the core portion to a surface of the head portion.

Abstract: A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.

Abstract: Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured.

Abstract: A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel and is mounted on the base substrate within the cavity; and a getter material of a metallic film that is formed on the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. A restriction portion, which is arranged in the cavity and restricts a scattering direction of the getter material evaporated by the heating to suppress a scattering amount scattering toward the vibration arm portion, is formed in the base substrate or the lid substrate.

Abstract: A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members 8 are disposed, on a penetration electrode forming board wafer made of a second glass material; an electrode member disposing step of disposing the electrode members in the holes formed on the wafer; a welding step of heating the wafer and the electrode members so as to be welded to each other; and a cooling step of cooling the wafer and the electrode members.

Abstract: An anodic bonding apparatus includes a first intermediate member that is disposed between an upper surface (an outer surface) of a lead substrate wafer and a first heater, has heat conductivity, and can be flexible; and a second intermediate member that is disposed between a lower surface (an outer surface) of a base substrate wafer and a second heater, has conductivity and heat conductivity, and can be flexible, wherein the first intermediate member is formed so that a central portion thereof bulges toward the base substrate wafer further than a periphery portion thereof, and the second intermediate member is formed so that a central portion thereof bulges toward the lead substrate wafer further than a periphery portion thereof, and, the first intermediate member and the second intermediate member are evenly deformed.

Abstract: Providing a piezoelectric vibrator and a manufacturing method thereof which is capable of achieving gettering in a state where the frequency change of the piezoelectric vibrating reed is suppressed. Providing a piezoelectric vibrator 1 including: a package 9 having a base board 2 and a lid board 3 which are bonded in a superimposed state and a cavity C formed between both boards 2, 3; and a piezoelectric vibrating reed 4 and a gettering material 27 which are accommodated in the same cavity C, wherein a shielding wall 21 is provided in the cavity C so as to shield the piezoelectric vibrating reed 4 from the gettering material 27, and the shielding wall 21 is connected to both the base board 2 and the lid board 3.

Abstract: A piezoelectric oscillator is provided, which has a through electrode providing reliable conduction between a piezoelectric vibrating piece and an external electrode with rare occurrence of a large stress caused by temperature variation in processing or deformation of a mounted base substrate, while the hermeticity of a cavity is maintained. A piezoelectric oscillator having a piezoelectric vibrating piece sealed in a cavity defined between a base substrate and a lid substrate includes a through electrode disposed in a through hole penetrating through the base substrate, and the through electrode has a glass frit filled in the through hole and fired and a core formed of a material containing only iron and nickel and disposed in the through hole together with the glass frit. The values of the thermal expansion coefficients of the base substrate, the glass frit, and the core are set as: base substrate glass?frit>core.

Abstract: To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holes 40 and forming outer shapes of a plurality of piezoelectric plates 10 simultaneously with the through holes by constituting reference points G by centers of the through holes by etching the wafer by a photolithography technology, a step of preparing a jig for a wafer having inserting pins formed to project by a number the same as a number of the through holes from above a flat plate portion, thereafter, mounting the wafer on the flat plate portion in a state of inserting the inserting pin into the through hole, a step of forming an electrode on outer surfaces of the plurality of piezoelectric plates, and a step of cutting to separate the plurality of piezoelectric plates from the wafer to fragment, and

Abstract: Provided is a manufacturing method of a package including a plurality of substrates that are bonded to each other, a cavity that is formed inside the plurality of substrates, and through electrodes that conduct current between the inside of the cavity and the outside of the plurality of substrates. The through electrodes are each formed such that a conductive core portion made of a metal material is arranged in a hole portion of a through electrode forming substrate made of a glass material. The manufacturing method includes: a hole portion forming step of forming the hole portion, into which the core portion is inserted, in a through electrode forming substrate wafer; a core portion inserting step of inserting the core portion into the hole portion formed in the through electrode forming substrate wafer; a welding step of heating the through electrode forming substrate wafer and welding it to the core portion; and a cooling step of cooling the through electrode forming substrate wafer.

Abstract: This package manufacturing method is a method for manufacturing a package using a rivet having a flat plate-shaped head portion and a core portion protruding from a rear surface of the head portion. The package includes: a plurality of substrates that are bonded to each other: a cavity that houses an object to be housed in an airtightly sealed state; the core portion which is disposed in a through hole that penetrates a base substrate and which electrically connects the object to be housed with the outside; and a glass frit that is filled between the through hole and the core portion and is fired to form a seal between the through hole and the core portion.

Abstract: A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

Abstract: A method of manufacturing a package capable of sealing an electronic component in a cavity formed between a plurality of substrates bonded to each other includes a penetration electrode forming step of forming a penetration electrode which passes through a first substrate of the plurality of substrates in the thickness direction and which electrically connects the inside of the cavity and the outside of the package to each other. The package manufacturing method is characterized in that the penetration electrode forming step includes a through hole forming step of forming a through hole for disposing the penetration electrode in the first substrate and a filling step of filling a filler into the through hole under a decompressed atmosphere.