Patents by Inventor Kazuyoshi Togashi

Kazuyoshi Togashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230384465
    Abstract: A detection device for detecting radiation includes a container including a first portion, a second portion facing the first portion in a first direction, and a side portion extending from the first portion toward the second portion, where a gas is contained in the container, an electron detector located inside the container, where the electron detector detects an electron generated by Compton scattering, a drift electrode located inside the container closer to the second portion than the electron detector and facing the electron detector, and a radiation detector located closer to the second portion than the drift electrode, where the radiation detector detects scattered radiation.
    Type: Application
    Filed: September 30, 2021
    Publication date: November 30, 2023
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Osamu SHIMADA, Hiroki MAEDA, Toru TANIMORI, Atsushi TAKADA, Kazuyoshi TOGASHI, Tomohisa MOTOMURA
  • Publication number: 20190041246
    Abstract: A sensor module is provided in which a sensor which can be more easily attached to a structure than conventionally and can also suppress variation in attachment quality. The sensor module includes an elastic layer, a sensor arranged above at last one part of the elastic layer and configured to detect a physical quantity related to the properties of a structure, and a film layer arranged above the elastic layer and attached with the sensor.
    Type: Application
    Filed: September 11, 2018
    Publication date: February 7, 2019
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazuyoshi TOGASHI, Ryoichi OHIGASHI, Tsukasa YONEKAWA
  • Patent number: 6621210
    Abstract: A front plate for a field-emission display includes a transparent substrate, and a conductive black matrix provided with a plurality of apertures and formed on one of surfaces of the transparent substrate. Barriers are formed of conductive inorganic material on predetermined positions of the black matrix, adjacent to the apertures. Fluorescent layers are formed in the apertures of the black matrix on the transparent substrate.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: September 16, 2003
    Assignees: Sony Corporation, Dai Nippon Printing Co., Ltd.
    Inventors: Haruo Kato, Tsunenari Saito, Shinzo Hirata, Kazuyoshi Togashi
  • Publication number: 20020043924
    Abstract: A front plate for a field-emission display includes a transparent substrate, and a conductive black matrix provided with a plurality of apertures and formed on one of surfaces of the transparent substrate. Barriers are formed of conductive inorganic material on predetermined positions of the black matrix, adjacent to the apertures. Fluorescent layers are formed in the apertures of the black matrix on the transparent substrate.
    Type: Application
    Filed: July 13, 2001
    Publication date: April 18, 2002
    Inventors: Haruo Kato, Tsunenari Saito, Shinzo Hirata, Kazuyoshi Togashi
  • Patent number: 6025640
    Abstract: There is disclosed a resin-sealed semiconductor device which comprises plural terminal portions integrally having inner terminals on surfaces and outer terminals on back surfaces and being disposed electrically independent of one another in such a manner that inner terminal surfaces are positioned on substantially the same plane; a die pad integrally provided with plural inner terminals on a surface and plural outer terminals on a back surface and being disposed electrically independently in a substantially center portion of the plane in which the plural terminal portions are arranged two-dimensionally; a semiconductor element electrically insulated and mounted on a surface of the die pad; and wires for connecting the inner terminals of the terminal portions and terminals of the semiconductor element. The whole is sealed with a resin in such a manner that the outer terminals of the terminal portions are partially exposed to the outside.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: February 15, 2000
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Masato Sasaki, Kazuyoshi Togashi