Patents by Inventor Kazuyoshi Tomikawa

Kazuyoshi Tomikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6819116
    Abstract: In a terminal crimped state testing method, in step S1, a reference waveform is created on the basis of a load when a terminal in a good crimped state is obtained, and the reference waveform is divided into plural reference waveform segments to set singular points. In step S2, the reference waveform segments containing singular points of the segments are integrated. In step S3, a characteristic waveform is created on the basis of the load when a crimping terminal to be tested is obtained. The characteristic waveform thus created is divided into plural sample waveform segments and the waveform segments corresponding to the reference waveform segments are integrated. In step S4, the integrated values of the reference waveform segments are compared with those of the sample waveform segments, thereby deciding whether the crimped state of the crimping terminal is good or not.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: November 16, 2004
    Assignee: Yazaki Corporation
    Inventors: Teruyuki Ishibashi, Kazuyoshi Tomikawa
  • Publication number: 20020130669
    Abstract: In a terminal crimped state testing method, in step S1, a reference waveform is created on the basis of a load when a terminal in a good crimped state is obtained, and the reference waveform is divided into plural reference waveform segments to set singular points. In step S2, the reference waveform segments containing singular points of the segments are integrated. In step S3, a characteristic waveform is created on the basis of the load when a crimping terminal to be tested is obtained. The characteristic waveform thus created is divided into plural sample waveform segments and the waveform segments corresponding to the reference waveform segments are integrated. In step S4, the integrated values of the reference waveform segments are compared with those of the sample waveform segments, thereby deciding whether the crimped state of the crimping terminal is good or not.
    Type: Application
    Filed: February 22, 2002
    Publication date: September 19, 2002
    Applicant: Yazaki Corporation
    Inventors: Teruyuki Ishibashi, Kazuyoshi Tomikawa
  • Patent number: 5604440
    Abstract: A connector formed with a first portion on the connector positioned differently according to a kind of the connector. The first portion is, for example, the forward end of a terminal or a cutout formed on the housing of the connector. At least one multicontact switch pin is fixedly arranged on a carriage base in a direction such that the probe pin of the multicontact pin extends towards the first portion. The switch pin has at least two contacts and a probe pin projecting outwardly of the multicontact switch pin. Each of the contacts is connected to a corresponding test circuit. The probe pin is adapted to move into and/or out of contact with the contacts when the probe pin is pushed inwardly into the multicontact switch pin. The carriage base is moved by a predetermined distance towards the connector to allow the probe pin to engage the first portion so that the probe pin moves into and/or out of contact with said contacts.
    Type: Grant
    Filed: July 20, 1995
    Date of Patent: February 18, 1997
    Assignee: Yazaki Corporation
    Inventors: Kazuyoshi Tomikawa, Toshinori Igura, Takayuki Tsuchiya
  • Patent number: 5570191
    Abstract: Connector housings having plural kinds of terminals (plated with different materials, e.g.) are mounted at predetermined locations, positioned and secured by a drive means. A sensor probe which receives a light, of a color detection device, is transferred successively to the locations opposite to the terminals. A color sensor senses a level of a specific color component of the light received by the sensor probe. The sensed level is compared with a predetermined reference level and it can be determined based upon whether the sensed level is higher than the reference level, the kind of the terminals in the connector housings.
    Type: Grant
    Filed: October 6, 1994
    Date of Patent: October 29, 1996
    Assignee: Yazaki Corporation
    Inventors: Hitoshi Uesugi, Tsutomu Maki, Kazuyoshi Tomikawa, Tatsuya Maeda, Yoshimi Masuda