Patents by Inventor Kazuyoshi Toya
Kazuyoshi Toya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200241988Abstract: An information processing apparatus includes: a plurality of control processing devices and a plurality of information processing devices. The control processing devices control operations compatibly with each other. The information processing devices perform various types of information processing through an interface shared by the control processing devices under control of any of the control processing devices. Before a first control processing device, which controls the information processing devices, is switched to a second control processing device among the control processing device, the second control processing device is set as a copy of the first control processing device. The information processing devices are sequentially switched to be controlled by the second control processing device in a period where the information processing devices do not execute tasks constituting the information processing.Type: ApplicationFiled: December 12, 2019Publication date: July 30, 2020Applicant: FUJITSU CLIENT COMPUTING LIMITEDInventor: Kazuyoshi Toya
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Patent number: 8519907Abstract: An interface adjustment support system that adjusts a display environment of a first display device (standard device)'s user interface used by a user to adapt to a second display device (device used), via a network, inputs setting information of a customized user interface of the standard device, stores the display information thereof, and adapts setting values, optimized based on the stored setting information of the standard device, to the device used when using the device used, thereby providing interfaces that have the same operational feel to the user, regardless of the device and location.Type: GrantFiled: June 16, 2006Date of Patent: August 27, 2013Assignee: Fujitsu LimitedInventor: Kazuyoshi Toya
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Patent number: 8225854Abstract: A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.Type: GrantFiled: January 11, 2006Date of Patent: July 24, 2012Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Akira Yamada, Takeshi Tanaka, Akihiro Murahashi, Kazuyoshi Toya, Hideo Okayama
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Patent number: 8107241Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules having cooling units for cooling heat-generating elements by coolant and radiation units for radiating heat from the coolant heated in the cooling units, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units and the cooling units by the coolant being boiled in the cooling units, the radiation units being arranged side by side, and a cooling fan for generating wind blowing the radiation units.Type: GrantFiled: March 31, 2006Date of Patent: January 31, 2012Assignee: Mitsubishi Electric CorporationInventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi
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Patent number: 7907408Abstract: A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header.Type: GrantFiled: April 12, 2007Date of Patent: March 15, 2011Assignee: Mitsubishi Electric CorporationInventors: Shigetoshi Ippoushi, Tetsuya Takahashi, Kazuyoshi Toya, Fumiharu Yabunaka, Kunihiko Kaga
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Patent number: 7881086Abstract: A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.Type: GrantFiled: March 8, 2007Date of Patent: February 1, 2011Assignee: Mitsubishi Electric CorporationInventors: Yasushi Nakayama, Takeshi Oi, Kazuyoshi Toya, Akihiro Murahashi
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Publication number: 20100232110Abstract: A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header.Type: ApplicationFiled: April 12, 2007Publication date: September 16, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi Ippoushi, Tetsuya Takahashi, Kazuyoshi Toya, Fumiharu Yabunaka, Kunihiko Kaga
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Publication number: 20090219696Abstract: A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.Type: ApplicationFiled: March 8, 2007Publication date: September 3, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasushi Nakayama, Takeshi Oi, Kazuyoshi Toya, Akihiro Murahashi
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Publication number: 20090080155Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.Type: ApplicationFiled: March 31, 2006Publication date: March 26, 2009Applicant: Mitsubishi Electric CorporationInventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi
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Publication number: 20090080159Abstract: A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.Type: ApplicationFiled: January 11, 2006Publication date: March 26, 2009Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Shigetoshi Ippoushi, Akira Yamada, Takeshi Tanaka, Akihiro Murahashi, Kazuyoshi Toya, Hideo Okayama
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Publication number: 20090065182Abstract: There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.Type: ApplicationFiled: March 31, 2006Publication date: March 12, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi
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Publication number: 20070222702Abstract: An interface adjustment support system that adjusts a display environment of a first display device (standard device)'s user interface used by a user to adapt to a second display device (device used), via a network, inputs setting information of a customized user interface of the standard device, stores the display information thereof, and adapts setting values, optimized based on the stored setting information of the standard device, to the device used when using the device used, thereby providing interfaces that have the same operational feel to the user, regardless of the device and location.Type: ApplicationFiled: June 16, 2006Publication date: September 27, 2007Applicant: FUJITSU LIMITEDInventor: Kazuyoshi Toya