Abstract: Provided is a digital switch including: a plurality of input-side memories, which are arranged in a one-to-one correspondence with a plurality of input ports, and are configured to accumulate time-division multiplexed data; a plurality of output-side memories, which are arranged in a one-to-one correspondence with a plurality of output ports, and are configured to accumulate time-division multiplexed data; and a switch matrix configured to receive, as input, the time-division multiplexed data read out in every cycle from each of the plurality of input-side memories, and execute routing for selecting, in accordance with a connection control signal received from outside, any one of the plurality of output-side memories such that the time-division multiplexed data read out in every cycle is output from each of the plurality of output ports without causing a difference in delay, to output the time-division multiplexed data.

Abstract: Provided is a digital switch including: a plurality of input-side memories, which are arranged in a one-to-one correspondence with a plurality of input ports, and are configured to accumulate time-division multiplexed data; a plurality of output-side memories, which are arranged in a one-to-one correspondence with a plurality of output ports, and are configured to accumulate time-division multiplexed data; and a switch matrix configured to receive, as input, the time-division multiplexed data read out in every cycle from each of the plurality of input-side memories, and execute routing for selecting, in accordance with a connection control signal received from outside, any one of the plurality of output-side memories such that the time-division multiplexed data read out in every cycle is output from each of the plurality of output ports without causing a difference in delay, to output the time-division multiplexed data.

Abstract: An antenna control device controls a plurality of antennas used for communicating with a mobile station that moves along a predetermined path in a radio communication system that includes a plurality of linear cells, each of which is formed by the antennas and in each of which each of the antennas sets a directionality in a same direction as a path of the mobile station and transmits an identical signal at an identical frequency, and that has two frequencies recurrently allocated in such a manner that adjacent linear cells use different frequencies for transmission. The antenna control device adjusts, in each of the linear cells, power distribution to each of the antennas that form the linear cell so as to be gradually decreased with distance in a direction of antenna directionality of each of the antennas.

Abstract: A semiconductor device includes semiconductor elements, a housing for accommodating the semiconductor elements, a resin material arranged in the housing for enclosing the semiconductor elements, and leads connected to the semiconductor elements. Each lead is divided into two portions, that is, an inner portion embedded in the resin material and an outer portion protruding from the resin material. The outer portion of the lead is provided with an enlarged part having a barrier surface directed toward the resin material.

Abstract: A light emitting display device is provided which can be manufactured from a leadframe and which may be mounted with other such light emitting display devices in close side-by-side relationship. The light emitting display device includes a casing (3) of a predetermined height having an obverse surface formed with a plurality of display segments (4a, 4b) each of which is provided at an end of a light guide (41). A plurality of light emitting elements (2) are disposed in the casing so as to positionally correspond to the display segments. Each of plural leads (1) has a first end (11) electrically connected to a respective light emitting element (2) and a second end (12) extending toward a bottom side of the casing. A resin (6) is filled in the light guides (41) for sealing the first ends (11) of the leads and the light emitting elements (2).

Abstract: A lead frame is fabricated by a stamping system, and the lead frame 1 having a predetermined pattern is fabricated by blanking a lead frame material by a progressive stamping die apparatus while the lead frame material is being consecutively transferred. A pressing force is applied to burrs occurring during the fabrication of the lead frame 1 so as to squeeze the burrs, thereby forming coined portions 6 and 7. Next, a coined groove 8 is formed horizontally on the surface of the lead frame 1 at a position slightly above a resin liquid level 4. Resin climbing 5 in which the resin rises from the liquid level due to a capillary phenomenon is stopped at the position of the coined groove 8 thus formed, thereby allowing soldering of the lead frame 1 to be effected without a hindrance.

Abstract: A light emitting portion is formed in such a manner that LED chips 2 are provided on the one ends of the leads 1 for the respective segments of a numeral which is a part of a display image. A reflecting case in which light conducting portions are provided so as to correspond to the parts of the display image is formed so that the LED chips are encircled by the respective light conducting portions. Light permeable resin 4 is filled in the reflecting case so that the interior of the reflecting case 3 and the one ends of the plurality of leads are fixed. An uneven portion is formed at least a portion of an outer peripheral side wall of the reflecting case.

Abstract: A semiconductor device includes semiconductor elements, a housing for accommodating the semiconductor elements, a resin material arranged in the housing for enclosing the semiconductor elements, and leads connected to the semiconductor elements. Each lead is divided into two portions, that is, an inner portion embedded in the resin material and an outer portion protruding from the resin material. The outer portion of the lead is provided with an enlarged part having a barrier surface directed toward the resin material.

Abstract: A lead frame is fabricated by a stamping system, and the lead frame 1 having a predetermined pattern is fabricated by blanking a lead frame material by a progressive stamping die apparatus while the lead frame material is being consecutively transferred. A pressing force is applied to burrs occurring during the fabrication of the lead frame 1 so as to squeeze the burrs, thereby forming coined portions 6 and 7. Next, a coined groove 8 is formed horizontally on the surface of the lead frame 1 at a position slightly above a resin liquid level 4. Resin climbing 5 in which the resin rises from the liquid level due to a capillary phenomenon is stopped at the position of the coined groove 8 thus formed, thereby allowing soldering of the lead frame 1 to be effected without a hindrance.

Abstract: A lead frame is fabricated by a stamping system, and the lead frame 1 having a predetermined pattern is fabricated by blanking a lead frame material by a progressive stamping die apparatus while the lead frame material is being consecutively transferred. A pressing force is applied to burrs occurring during the fabrication of the lead frame 1 so as to squeeze the burrs, thereby forming coined portions 6 and 7. Next, a coined groove 8 is formed horizontally on the surface of the lead frame 1 at a position slightly above a resin liquid level 4. Resin climbing 5 in which the resin rises from the liquid level due to a capillary phenomenon is stopped at the position of the coined groove 8 thus formed, thereby allowing soldering of the lead frame 1 to be effected without a hindrance.

Abstract: A light emitting portion is formed in such a manner that LED chips 2 are provided on the one ends of the leads 1 for the respective segments of a numeral which is a part of a display image. A reflecting case in which light conducting portions are provided so as to correspond to the parts of the display image is formed so that the LED chips are encircled by the respective light conducting portions. Light permeable resin 4 is filled in the reflecting case so that the interior of the reflecting case 3 and the one ends of the plurality of leads are fixed. An uneven portion is formed at least a portion of an outer peripheral side wall of the reflecting case.

Abstract: An illuminator with a light-emitting surface includes a light-conducting plate made of a transparent or translucent resin and a light source device for projecting light into this light-conducting plate through its side surface. There is an engagement mechanism by which the light source device can be automatically attached to the side surface of the light-conducting plate by merely pressing the light source device against the side surface of the light-conducting plate. The engaging mechanism may include protrusions formed at both end parts of the light source device and a flexible and deformable hook formed on the side surface of the light-conducting plate so as to prevent the light source device from becoming removed from or moving perpendicularly relative to the light-conducting plate when they are in engaged relationship.

Abstract: A light source device has an elongated rectangular boxed-shaped reflective case with a bottom wall, frame walls which protrude forward from this bottom wall to form an open front surface. A plurality of terminal plates are disposed on the bottom part of this reflective case, and LED chips are bonded onto these terminal plates. Lead terminals extend from the terminal plates and penetrate and reach the outer surface of one of the frame walls. Thickened parts with increased thickness are formed on the inner surface of the frame walls at positions corresponding to these lead terminals.

Abstract: An axial lead frame including two side rails arranged opposite to each other and plural pairs of lead terminals separated from each other and located opposite to each other, in which a longer lead terminal and a shorter lead terminal of a pair of the lead terminals are alternately arranged to extend in parallel with each other in the equally spaced relationship between both side rails. And, a buffer member is formed at the substantially central part between both the side rails so as to allow the longer lead terminals extending from both the side rails toward the buffer member to be jointed to each other along the buffer member. A die pad is die-bonded to the foremost end of each of the longer lead terminal, while a pad is placed at the foremost end of each of the shorter lead terminal. Dam bars are bridged between adjacent lead terminals in order to prevent molten resin from flowing out during molding operation.