Patents by Inventor Kazuyuki Akaishi
Kazuyuki Akaishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10665754Abstract: A side-view type light emitting device has a bottom surface thereof as a light emission surface and a first lateral surface thereof as a mounting surface for mounting on a mounting substrate, and includes a semiconductor layered structure including a first semiconductor layer, an active layer and a second semiconductor layer; a first connecting electrode exposed from the first lateral surface and electrically connected to the first semiconductor layer; a first electrode disposed between the first semiconductor layer and the first connecting electrode; a second connecting electrode exposed from the first lateral surface; a metal wire electrically connecting an upper surface of the second semiconductor layer to the second connecting electrode; and a resin layer. In a direction perpendicular to the light emission surface, the active layer does not overlap with the first connecting electrode, and the active layer does not overlap with the second connecting electrode.Type: GrantFiled: June 5, 2017Date of Patent: May 26, 2020Assignee: NICHIA CORPORATIONInventors: Akinori Yoneda, Yoshiyuki Aihara, Shinji Nakamura, Akiyoshi Kinouchi, Kazuki Kashimoto, Kazuyuki Akaishi
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Publication number: 20170271559Abstract: A side-view type light emitting device has a bottom surface thereof as a light emission surface and a first lateral surface thereof as a mounting surface for mounting on a mounting substrate, and includes a semiconductor layered structure including a first semiconductor layer, an active layer and a second semiconductor layer; a first connecting electrode exposed from the first lateral surface and electrically connected to the first semiconductor layer; a first electrode disposed between the first semiconductor layer and the first connecting electrode; a second connecting electrode exposed from the first lateral surface; a metal wire electrically connecting an upper surface of the second semiconductor layer to the second connecting electrode; and a resin layer. In a direction perpendicular to the light emission surface, the active layer does not overlap with the first connecting electrode, and the active layer does not overlap with the second connecting electrode.Type: ApplicationFiled: June 5, 2017Publication date: September 21, 2017Applicant: NICHIA CORPORATIONInventors: Akinori YONEDA, Yoshiyuki AIHARA, Shinji NAKAMURA, Akiyoshi KINOUCHI, Kazuki KASHIMOTO, Kazuyuki AKAISHI
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Patent number: 9698307Abstract: A side-view type light emitting device having a bottom surface thereof as a light emission surface and one side surface thereof as amounting surface for mounting on amounting substrate includes a stacked semiconductor layer having a first semiconductor layer, an active layer, and a second semiconductor layer which are stacked in that order from a side of the bottom surface; a first connecting electrode exposed from the one side surface and electrically connected to the first semiconductor layer; a metal wire having one end thereof electrically connected to an upper surface of the second semiconductor layer; a second connecting electrode exposed from the one side surface and electrically connected to the other end of the metal wire; and a resin layer which covers at least a part of each of the first semiconductor layer, the second semiconductor layer, the first connecting electrode, the second connecting electrode and the metal wire and which is configured to form an upper surface and side surfaces of the lighType: GrantFiled: September 4, 2014Date of Patent: July 4, 2017Assignee: NICHIA CORPORATIONInventors: Akinori Yoneda, Yoshiyuki Aihara, Shinji Nakamura, Akiyoshi Kinouchi, Kazuki Kashimoto, Kazuyuki Akaishi
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Publication number: 20150060934Abstract: A side-view type light emitting device having a bottom surface thereof as a light emission surface and one side surface thereof as amounting surface for mounting on amounting substrate includes a stacked semiconductor layer having a first semiconductor layer, an active layer, and a second semiconductor layer which are stacked in that order from a side of the bottom surface; a first connecting electrode exposed from the one side surface and electrically connected to the first semiconductor layer; a metal wire having one end thereof electrically connected to an upper surface of the second semiconductor layer; a second connecting electrode exposed from the one side surface and electrically connected to the other end of the metal wire; and a resin layer which covers at least a part of each of the first semiconductor layer, the second semiconductor layer, the first connecting electrode, the second connecting electrode and the metal wire and which is configured to form an upper surface and side surfaces of the lighType: ApplicationFiled: September 4, 2014Publication date: March 5, 2015Inventors: Akinori YONEDA, Yoshiyuki AIHARA, Shinji NAKAMURA, Akiyoshi KINOUCHI, Kazuki KASHIMOTO, Kazuyuki AKAISHI
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Patent number: 7679097Abstract: A semiconductor light emitting device having a semiconductor stacking structure bonded onto the support member and having excellent characteristics is provided by a preferable electrode structure. The semiconductor light emitting device comprising; a semiconductor stacking structure having a first semiconductor layer and a second semiconductor layer of conductivity types different from each other, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer, wherein one principal surface of the first electrode has a portion that makes contact with the first semiconductor layer so as to establish electrical continuity and an external connection section.Type: GrantFiled: October 20, 2005Date of Patent: March 16, 2010Assignee: Nichia CorporationInventor: Kazuyuki Akaishi
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Publication number: 20060124954Abstract: A semiconductor light emitting device having a semiconductor stacking structure bonded onto the support member and having excellent characteristics is provided by a preferable electrode structure. The semiconductor light emitting device comprising; a semiconductor stacking structure having a first semiconductor layer and a second semiconductor layer of conductivity types different from each other, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer, wherein one principal surface of the first electrode has a portion that makes contact with the first semiconductor layer so as to establish electrical continuity and an external connection section.Type: ApplicationFiled: October 20, 2005Publication date: June 15, 2006Applicant: NICHIA CORPORATIONInventor: Kazuyuki Akaishi
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Patent number: 6882672Abstract: To provide a point emission type light emitting element that restricts the light emitting area within a sufficiently tiny region and can be manufactured at a low cost, the point emission type light emitting element is a light emitting element that has stripe ridge comprising an n-type layer, an active layer and a p-type layer that are formed from semiconductors on a substrate, so as to emit light from one end face of the stripe ridge, wherein the stripe ridge has a protruding portion on the end face described above and the surface of the light emitting element is covered with an shading film except for the tip of the protruding portion.Type: GrantFiled: March 18, 2002Date of Patent: April 19, 2005Assignee: Nichia CorporationInventors: Yukitoshi Marutani, Akira Kitano, Susumu Harada, Kazuyuki Akaishi, Masahiko Sano, Koji Honjo, Hitoshi Maegawa
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Publication number: 20020167983Abstract: To provide a point emission type light emitting element that restricts the light emitting area within a sufficiently tiny region and can be manufactured at a low cost, the point emission type light emitting element is a light emitting element that has stripe ridge comprising an n-type layer, an active layer and a p-type layer that are formed from semiconductors on a substrate, so as to emit light from one end face of the stripe ridge, wherein the stripe ridge has a protruding portion on the end face described above and the surface of the light emitting element is covered with an shading film except for the tip of the protruding portion.Type: ApplicationFiled: March 18, 2002Publication date: November 14, 2002Inventors: Yukitoshi Marutani, Akira Kitano, Susumu Harada, Kazuyuki Akaishi, Masahiko Sano, Koji Honjo, Hitoshi Maegawa
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Patent number: RE44163Abstract: A semiconductor light emitting device having a semiconductor stacking structure bonded onto the support member and having excellent characteristics is provided by a preferable electrode structure. The semiconductor light emitting device comprising; a semiconductor stacking structure having a first semiconductor layer and a second semiconductor layer of conductivity types different from each other, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer, wherein one principal surface of the first electrode has a portion that makes contact with the first semiconductor layer so as to establish electrical continuity and an external connection section.Type: GrantFiled: March 16, 2012Date of Patent: April 23, 2013Assignee: Nichia CorporationInventor: Kazuyuki Akaishi