Abstract: A ceramic block with a built in electrode, including a first insulating ceramic sheet having a bearing surface, a sheet electrode having an inner edge and extending generally parallel to the bearing surface, a second insulating ceramic sheet disposed to enclose the sheet electrode between the second insulating ceramic sheet and the first insulating ceramic sheet, and a cylindrical, thin film shaped drawn-out conductor perpendicularly connected to the inner edge of the sheet electrode to supply voltage to the sheet electrode. The drawn-out conductor is attached to the inner wall of a through hole of the second insulating ceramic sheet, and an insulating ceramic shaft is packed into the through hole.

Abstract: A ceramic block with a built in electrode, including a first insulating ceramic sheet having a bearing surface, a sheet electrode having an inner edge and extending generally parallel to the bearing surface, a second insulating ceramic sheet disposed to enclose the sheet electrode between the second insulating ceramic sheet and the first insulating ceramic sheet, and a cylindrical, thin film shaped drawn-out conductor perpendicularly connected to the inner edge of the sheet electrode to supply voltage to the sheet electrode. The drawn-out conductor is attached to the inner wall of a through hole of the second insulating ceramic sheet, and an insulating ceramic shaft is packed into the through hole.

Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

Abstract: A controller for a wound-rotor induction motor includes a first voltage-type converter connected to a secondary winding of the motor, a capacitor for smoothing DC output thereof, a second voltage-type converter to supply an AC power supply with regenerated secondary power, a speed detector of the motor, a secondary current detector of the motor, a DC voltage detector applied to the capacitor, a speed controller for controlling the speed by the speed detector and outputting a secondary referential current, a first PWM controller to control the secondary current in response to the referential current, and to output a voltage signal by witch switching elements of the first voltage-type converter are controlled by PWM, and a second PWM controller to control a voltage output from the voltage detector in response to a referential voltage, and to control by PWM switching elements of the second voltage-type converter.

Abstract: A controller for a wound-rotor induction motor includes a first voltage-type converter connected to a secondary winding of the motor, a capacitor for smoothing DC output thereof, a second voltage-type converter to supply an AC power supply with regenerated secondary power, a speed detector of the motor, a secondary current detector of the motor, a DC voltage detector applied to the capacitor, a speed controller for controlling the speed by the speed detector and outputting a secondary referential current, a first PWM controller to control the secondary current in response to the referential current, and to output a voltage signal by witch switching elements of the first voltage-type converter are controlled by PWM, and a second PWM controller to control a voltage output from the voltage detector in response to a referential voltage, and to control by PWM switching elements of the second voltage-type converter.

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.