Patents by Inventor Kazuyuki Fujii
Kazuyuki Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084382Abstract: An information processing device includes a control unit configured to determine whether to include a regenerative brake in specifications of a proposed vehicle based on regenerative brake operation data acquired while a first vehicle including the regenerative brake is traveling in a predetermined area. The proposed vehicle is a vehicle proposed as a vehicle for a customer to drive in the predetermined area.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Shunsuke Tanimori, Ryota Nakabayashi, Osamu Izumida, Takeshi Kanou, Naoki Yamada, Kazuyuki Inoue, Shin Sakurada, Hiromitsu Fujii
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Publication number: 20210317111Abstract: The present invention relates to a medicament for treating and/or preventing inflammatory bowel disease, comprising a quinolone compound of the formula shown below as an active ingredient.Type: ApplicationFiled: August 9, 2019Publication date: October 14, 2021Inventors: Isao SHIBUYA, Daisuke OKA, Kazuyuki FUJII, Hiroko TAKAGI, Masayoshi SATO, Takako NAKASHIMA, Fusako IWATA, Makoto MATSUMOTO
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Publication number: 20180286731Abstract: In order to avoid cracking of a semiconductor wafer when separating the semiconductor wafer from an electrostatic chuck, there is provided a manufacturing method of a semiconductor device including a step of monitoring the potential of the electrostatic chuck from the adsorption starting state of the semiconductor wafer by the electrostatic chuck to the adsorption finishing state thereof. The above step further includes a step of determining the semiconductor wafer to be in the adsorption finishing state when the potential of the electrostatic chuck is within a predetermined range.Type: ApplicationFiled: January 5, 2018Publication date: October 4, 2018Inventors: Yohei HAMAGUCHI, Kazuyuki FUJII, Yosuke INOUE
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Publication number: 20170076919Abstract: An abnormal part (component) is identified for a short time. A method of manufacturing a semiconductor device according to one embodiment includes a step of performing a plasma treatment on a semiconductor substrate by using plasma equipment, and a step of inspecting the plasma equipment. The inspection step includes a step of measuring impedance or reflection intensity at each frequency by varying a frequency of an input signal while regarding a RF power supplying line of the plasma equipment as an electrical circuit. Further, the inspection step includes a step of calculating characteristics of impedance or reflection intensity in an arrival location of the signal with respect to an arrival time of the signal by performing an inverse Fourier transform on a measurement result.Type: ApplicationFiled: September 14, 2016Publication date: March 16, 2017Inventors: Kazuyuki FUJII, Yosuke INOUE
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Patent number: 8338298Abstract: The present inventors have found that a wafer process of VLSI (Very Large Scale Integration) has the following problem, that is, generation of foreign matters due to moisture from a wafer as a result of degassing when a barrier metal film or a first-level metal interconnect layer is formed by sputtering as a preliminary step for the formation of a tungsten plug in a pre-metal step. To overcome the problem, the present invention provides a manufacturing method of a semiconductor integrated circuit device including, in a plasma process, in-situ monitoring of moisture in a processing chamber by receiving an electromagnetic wave generated from plasma.Type: GrantFiled: September 9, 2009Date of Patent: December 25, 2012Assignee: Renesas Electronics CorporationInventors: Kazuyuki Fujii, Toshihiko Minami, Hideaki Kanazawa
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Patent number: 7815958Abstract: The present invention provides a carotenoids color preparation which itself has a high emulsion stability, so that there are no problems such as precipitation of an insoluble matter or neck ring formation even when this preparation is used in water-based products. The preparation is obtained by emulsifying a carotenoids color of natural origin, which has an acid value of 10 or less and an acetone-insoluble content of 5 wt % or less when adjusted so that the color value E10%1cm is 2550.Type: GrantFiled: November 14, 2007Date of Patent: October 19, 2010Assignee: San-Ei Gen F.F.I., Inc.Inventors: Kazuyuki Fujii, Norihiko Inada
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Patent number: 7790478Abstract: In remote plasma cleaning, it is difficult to locally excite a plasma because the condition is not suitable for plasma excitation different from that at the time of film formation and a method using light has a problem of fogginess of a detection window that cannot be avoided in a CVD process and is not suitable for a mass production process.Type: GrantFiled: July 25, 2008Date of Patent: September 7, 2010Assignee: Renesas Technology Corp.Inventors: Kazuyuki Fujii, Minoru Hanazaki, Gen Kawaharada, Masakazu Taki, Mutsumi Tsuda
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Publication number: 20100087064Abstract: The present inventors have found that a wafer process of VLSI (Very Large Scale Integration) has the following problem, that is, generation of foreign matters due to moisture from a wafer as a result of degassing when a barrier metal film or a first-level metal interconnect layer is formed by sputtering as a preliminary step for the formation of a tungsten plug in a pre-metal step. To overcome the problem, the present invention provides a manufacturing method of a semiconductor integrated circuit device including, in a plasma process, in-situ monitoring of moisture in a processing chamber by receiving an electromagnetic wave generated from plasma.Type: ApplicationFiled: September 9, 2009Publication date: April 8, 2010Applicant: RENESAS TECHNOLOGY CORP.Inventors: Kazuyuki FUJII, Toshihiko MINAMI, Hideaki KANAZAWA
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Publication number: 20090035945Abstract: In remote plasma cleaning, it is difficult to locally excite a plasma because the condition is not suitable for plasma excitation different from that at the time of film formation and a method using light has a problem of fogginess of a detection window that cannot be avoided in a CVD process and is not suitable for a mass production process.Type: ApplicationFiled: July 25, 2008Publication date: February 5, 2009Inventors: Kazuyuki FUJII, Minoru Hanazaki, Gen Kawaharada, Masakazu Taki, Mutsumi Tsuda
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Patent number: 6852655Abstract: The invention is to offer such a dielectric ceramic enabling to simultaneously sinter with the low resistant conductor of Ag based metals and Cu based metals, having the excellent mechanical strength and exhibiting the excellent dielectric characteristics in the GHz zone. Mixed powders of Si: 20 to 30 weight %, B: 5 to 30 weight %, Al: 20 to 30 weight %, Ca: 10 to 20 weight %, and Zn: 10 to 20 weight % are prepared, melted, and rapidly cooled to produce glass frits. The glass frits are granulated and mixed with gahnite filler and titania filler which are inorganic filler powders. Subsequently, a binder is thrown into the powders to produce a composition of dielectric ceramic, and then is formed, followed by sintering. The mixed powders may contain at least one kind of alkali metal of Li, K and Na.Type: GrantFiled: January 30, 2003Date of Patent: February 8, 2005Assignee: NGK Spark Plug Co., Ltd.Inventors: Eiji Kodera, Kazuyuki Fujii, Makoto Baba, Hidetoshi Mizutani, Manabu Sato
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Publication number: 20040170734Abstract: The present invention provides a carotenoids color preparation which itself has a high emulsion stability, so that there are no problems such as precipitation of an insoluble matter or neck ring formation even when this preparation is used in water-based products. The preparation is obtained by emulsifying a carotenoids color of natural origin, which has an acid value of 10 or less and an acetone-insoluble content of 5 wt % or less when adjusted so that the color value E10%1cm is 2550.Type: ApplicationFiled: December 12, 2003Publication date: September 2, 2004Inventors: Kazuyuki Fujii, Norihiko Inada
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Publication number: 20030216240Abstract: The invention is to offer such a dielectric ceramic enabling to simultaneously sinter with the low resistant conductor of Ag based metals and Cu based metals, having the excellent mechanical strength and exhibiting the excellent dielectric characteristics in the GHz zone. Mixed powders of Si: 20 to 30 weight %, B: 5 to 30 weight %, Al: 20 to 30 weight %, Ca: 10 to 20 weight %, and Zn: 10 to 20 weight % are prepared, melted, and rapidly cooled to produce glass frits. The glass frits are granulated and mixed with gahnite filler and titania filler which are inorganic filler powders. Subsequently, a binder is thrown into the powders to produce a composition of dielectric ceramic, and then is formed, followed by sintering. The mixed powders may contain at least one kind of alkali metal of Li, K and Na.Type: ApplicationFiled: January 30, 2003Publication date: November 20, 2003Applicant: NGK SPARK PLUG CO., LTD.Inventors: Eiji Kodera, Kazuyuki Fujii, Makoto Baba, Hidetoshi Mizutani, Manabu Sato
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Publication number: 20030049993Abstract: A method of detecting an end point improved to enable proper detection of end points of polishing so as to improve throughput and stability of the entire polishing process is provided. A semiconductor polishing apparatus is provided in which a wafer held by a polishing head is brought into contact with a polishing pad adhered on a polishing table, with a prescribed pressure. The apparatus includes a dresser for dressing the polishing pad arranged opposing to the polishing pad, and a sound sensor for detecting sound generated by the friction between the polishing head and the wafer.Type: ApplicationFiled: June 6, 2002Publication date: March 13, 2003Applicant: Mitsubishi Denki Kabushiki KaishaInventor: Kazuyuki Fujii
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Patent number: 6213852Abstract: A method of manufacturing a semiconductor device using a polishing apparatus is provided. A top ring holding a wafer is arranged on a pad. A polishing chemical liquid supply line for supplying a polishing chemical liquid is arranged above the pad in a direction ahead of rotation with respect to the top ring. Around the center of rotation of the pad, a partition plate having a columnar side surface is arranged. Above the pad on a side which goes away from the top ring when the pad is rotated, a polishing chemical liquid draining mechanism is arranged extending continuously from the partition plate to the outer periphery of the pad. Accordingly, a polishing apparatus is obtained by which the amount of polishing of the surface to be polished of the semiconductor substrate is stabilized and generation of microscratches on the surface to be polished can be suppressed.Type: GrantFiled: July 12, 1999Date of Patent: April 10, 2001Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kazuyuki Fujii, Takanori Sasaki, Mahito Sawada, Kouichiro Tsutahara
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Patent number: D580436Type: GrantFiled: May 28, 2008Date of Patent: November 11, 2008Assignees: Teac Corporation, YE Data Inc.Inventors: Masaaki Kiyomiya, Kazuyuki Fujii, Yukio Iikura
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Patent number: D580437Type: GrantFiled: May 28, 2008Date of Patent: November 11, 2008Assignees: Teac Corporation, YE Data Inc.Inventors: Masaaki Kiyomiya, Kazuyuki Fujii, Yukio Iikura