Abstract: A wire bonding device is disclosed. The device has a capillary which causes a wire to make press-contact to a bonding face, a driving motor for raising and lowering the capillary, a storage, means for storing data on a capillary height when making contact to the bonding face or a capillary height with respect to a reference height when making contact to the bonding face, and a control unit for effecting control so that the capillary is lowered at a predetermined velocity down to a height corresponding to the data stored therein and is further lowered at a lower velocity than the predetermined velocity till impinging on the bonding face, the control means further functioning such that the storage means stores the data on the capillary height when impinging on the bonding face at a first bonding cycle.