Abstract: The purpose of the invention is to compensate for the radiation tolerance of a semiconductor memory. An apparatus (10) for compensating for radiation tolerance comprises: a voltage value acquisition unit (11) that acquires a data retention voltage value that is a maximum voltage value at which data is inverted when a power supply voltage of a semiconductor memory having a latch circuit is lowered; a correction value determination unit (12) that determines a voltage correction value on the basis of a difference between the data retention voltage value and a reference voltage value; and a voltage adjustment unit (13) that adjusts at least one among the power supply voltage and a substrate bias voltage by using the voltage correction value. The reference voltage value is set to be equal to or lower than the data retention voltage value that satisfies a required radiation tolerance.

Abstract: A semiconductor device includes first to N-th PLL circuits configured to operate in synchronization with a common reference clock signal to output first to N-th clock signals, respectively; a majority circuit that performs a majority operation on the first to N-th clock signals to generate a majority clock signal; and a filter circuit to which the majority clock signal is provided, the filter circuit operating as a low-pass filter to output an output clock signal. N is an odd number of three or more.

Abstract: The purpose of the invention is to compensate for the radiation tolerance of a semiconductor memory. An apparatus (10) for compensating for radiation tolerance comprises: a voltage value acquisition unit (11) that acquires a data retention voltage value that is a maximum voltage value at which data is inverted when a power supply voltage of a semiconductor memory having a latch circuit is lowered; a correction value determination unit (12) that determines a voltage correction value on the basis of a difference between the data retention voltage value and a reference voltage value; and a voltage adjustment unit (13) that adjusts at least one among the power supply voltage and a substrate bias voltage by using the voltage correction value. The reference voltage value is set to be equal to or lower than the data retention voltage value that satisfies a required radiation tolerance.

Abstract: A semiconductor device includes first to N-th PLL circuits configured to operate in synchronization with a common reference clock signal to output first to N-th clock signals, respectively; a majority circuit that performs a majority operation on the first to N-th clock signals to generate a majority clock signal; and a filter circuit to which the majority clock signal is provided, the filter circuit operating as a low-pass filter to output an output clock signal. N is an odd number of three or more.

Abstract: An operation adjustment method of an SOI device comprises steps of: (a) obtaining a drain current-substrate bias voltage characteristic of an NMOS transistor for a source-gate voltage of 0V; (b) obtaining a lowest substrate bias voltage which turns on the NMOS transistor from the drain current-substrate bias voltage characteristic; (c) determining an upper limit of a substrate bias voltage of a PMOS transistor as a voltage obtained by subtracting a built-in potential of a pn junction from the lowest substrate bias voltage; and (d) determining the substrate bias voltage of the PMOS transistor as a positive voltage lower than the upper limit. Reduction in the power consumption and maintenance of the radiation tolerance are both achieved for the SOI device.

Abstract: An operation adjustment method of an SOI device comprises steps of: (a) obtaining a drain current-substrate bias voltage characteristic of an NMOS transistor for a source-gate voltage of 0V; (b) obtaining a lowest substrate bias voltage which turns on the NMOS transistor from the drain current-substrate bias voltage characteristic; (c) determining an upper limit of a substrate bias voltage of a PMOS transistor as a voltage obtained by subtracting a built-in potential of a pn junction from the lowest substrate bias voltage; and (d) determining the substrate bias voltage of the PMOS transistor as a positive voltage lower than the upper limit. Reduction in the power consumption and maintenance of the radiation tolerance are both achieved for the SOI device.

Abstract: A hydraulic brake actuation device is provided that basically includes a housing, a master piston, a push rod, an actuation lever, a contact member and a support member. The housing includes a master cylinder. The master piston is slidably disposed in the master cylinder. The push rod is coupled to the master piston. The actuation lever is pivotally attached to the housing. The contact member contacts the actuation lever. The contact member also contacts the push rod that pushes the master piston. The support member is attached to the housing. The support member is a separate piece from the housing that guides the contact member.

Abstract: A hydraulic brake lever apparatus is provided with a brake lever housing, a piston, a mounting structure, a brake lever and a fluid reservoir. The brake lever housing includes a cylinder having the piston movably disposed within the cylinder. The mounting structure mounts the brake lever housing to a bicycle handlebar. The brake lever pivotally is mounted to the brake lever housing and moves the piston within the cylinder in response to pivotal movement of the brake lever relative to the brake lever housing. The fluid reservoir fluidly communicates with the cylinder via a port that communicates hydraulic fluid therebetween. The fluid reservoir has a cylindrical shape and lies in a side by side relationship with the cylinder to prevent gas bubbles that have moves from the cylinder to the fluid reservoir via the port from flowing back to the cylinder.

Abstract: A hydraulic brake lever apparatus is provided with a brake lever housing, a piston, a mounting structure, a brake lever, a fluid reservoir and a diaphragm. The brake lever housing includes a cylinder having the piston movably disposed within the cylinder. The mounting structure mounts the brake lever housing to a bicycle handlebar. The brake lever pivots relative to the brake lever housing to move the piston within the cylinder. The fluid reservoir fluidly communicates hydraulic fluid with the cylinder via a port. The fluid reservoir has a cylindrical shape and lies in a side by side relationship with the cylinder. The diaphragm is disposed within the fluid reservoir, and includes a substantial arrowhead shaped portion that allows the volume of the diaphragm to change smoothly while ensuring the volume of the hydraulic fluid chamber within the fluid reservoir.

Abstract: A bicycle operating device is provided with a first operating unit, a second operating unit and a connecting member. The first operating unit includes a clamp portion for attaching the bicycle operating device to a bicycle and a first operating member. The second operating unit includes a housing and a second operating member. The connecting member includes a first portion detachably coupled to an outwardly facing surface of the clamp portion and a second portion coupled to the second operating unit. The first portion includes a retaining part with an outwardly facing surface that faces an inwardly facing surface of the clamp portion when the connecting member is attached to the clamp portion.

Abstract: A hydraulic brake actuation device is provided that basically includes a housing, a master piston, a push rod, an actuation lever, a contact member and a support member. The housing includes a master cylinder. The master piston is slidably disposed in the master cylinder. The push rod is coupled to the master piston. The actuation lever is pivotally attached to the housing. The contact member contacts the actuation lever. The contact member also contacts the push rod that pushes the master piston. The support member is attached to the housing. The support member is a separate piece from the housing that guides the contact member.

Abstract: A hydraulic brake lever apparatus is provided with a brake lever housing, a piston, a mounting structure, a brake lever, a fluid reservoir and a diaphragm. The brake lever housing includes a cylinder having the piston movably disposed within the cylinder. The mounting structure mounts the brake lever housing to a bicycle handlebar. The brake lever pivots relative to the brake lever housing to move the piston within the cylinder. The fluid reservoir fluidly communicates hydraulic fluid with the cylinder via a port. The fluid reservoir has a cylindrical shape and lies in a side by side relationship with the cylinder. The diaphragm is disposed within the fluid reservoir, and includes a substantial arrowhead shaped portion that allows the volume of the diaphragm to change smoothly while ensuring the volume of the hydraulic fluid chamber within the fluid reservoir.

Abstract: A hydraulic brake lever apparatus is provided with a brake lever housing, a piston, a mounting structure, a brake lever and a fluid reservoir. The brake lever housing includes a cylinder having the piston movably disposed within the cylinder. The mounting structure mounts the brake lever housing to a bicycle handlebar. The brake lever pivotally is mounted to the brake lever housing and moves the piston within the cylinder in response to pivotal movement of the brake lever relative to the brake lever housing. The fluid reservoir fluidly communicates with the cylinder via a port that communicates hydraulic fluid therebetween. The fluid reservoir has a cylindrical shape and lies in a side by side relationship with the cylinder to prevent gas bubbles that have moves from the cylinder to the fluid reservoir via the port from flowing back to the cylinder.

Abstract: A bicycle operating device is provided with a first operating unit, a second operating unit and a connecting member. The first operating unit includes a clamp portion for attaching the bicycle operating device to a bicycle and a first operating member. The second operating unit includes a housing and a second operating member. The connecting member includes a first portion detachably coupled to an outwardly facing surface of the clamp portion and a second portion coupled to the second operating unit. The first portion includes a retaining part with an outwardly facing surface that faces an inwardly facing surface of the clamp portion when the connecting member is attached to the clamp portion.

Abstract: A bicycle component fixing band is provided with a first base part, a second base part, a hinge structure, a releasable connecting structure and a lock pin. The base parts are pivotally connected together at their pivot ends by the hinge structure. The releasable connecting structure releasably couples fastening ends of the base parts together. The lock pin is movable between a locking position and an unlocking position. The lock pin is engaged with both of the pivot ends of the base parts when the lock pin is in the locking position to prevent relative movement of the base parts. The lock pin is disengaged from one of the pivot ends of the base parts when the lock pin is in the unlocking position to permit relative movement of the base parts.

Abstract: A bicycle component fixing band is provided with a first base part, a second base part, a hinge structure, a releasable connecting structure and a lock pin. The base parts are pivotally connected together at their pivot ends by the hinge structure. The releasable connecting structure releasably couples fastening ends of the base parts together. The lock pin is movable between a locking position and an unlocking position. The lock pin is engaged with both of the pivot ends of the base parts when the lock pin is in the locking position to prevent relative movement of the base parts. The lock pin is disengaged from one of the pivot ends of the base parts when the lock pin is in the unlocking position to permit relative movement of the base parts.

Abstract: A semiconductor device includes at least one hole formed on a semiconductor substrate. A barrier method is formed on at least one portion in contact with the semiconductor substrate in the hole. A metal interconnection is constituted by two layers including a first Al-containing metal film formed on the barrier metal, and a second Al-containing metal film formed on the first Al-containing metal film and having a melting point lower than the melting point of the first Al-containing metal film.

Abstract: A method of burying a conductive metal into a contact hole formed in an insulation film formed over a silicon substrate. Within the contact hole a refractory metal silicide layer has been formed on the silicon substrate and a barrier metal layer has been formed on the refractory metal silicide layer and further a conductive metal film has been formed on the barrier metal layer.

Abstract: A semiconductor device includes at least one hole formed on a semiconductor substrate. A barrier metal is formed on at least one portion in contact with the semiconductor substrate in the hole. A metal interconnection is constituted by two layers including a first Al-containing metal film formed on the barrier metal, and a second Al-containing metal film formed on the first Al-containing metal film and having a melting point lower than the melting point of the first Al-containing metal film.