Abstract: A resin composition for a seamless air bag cover or a resin composition for a seamless instrument panel having an air bag cover which comprises (A) 50 to 90% by mass of polypropylene, (B) 0 to 20% by mass of a thermoplastic elastomer and (C) 10 to 30% by mass of talc having an average particle diameter of 15 to 25 ?m and a distribution of a particle diameter such that the content of particles having a diameter of 5 ?m or smaller is 10% by mass or smaller and the content of particles having a diameter exceeding 40 ?m is 10% by mass or smaller. The resin composition exhibits sufficient properties when an instrument panel is molded. A seamless instrument panel having an air bag cover can be obtained as an integrally molded product, which can be treated as a single article in recycling.

Abstract: A resin composition for a seamless air bag cover or a resin composition for a seamless instrument panel having an air bag cover which comprises (A) 50 to 90% by mass of polypropylene, (B) 0 to 20% by mass of a thermoplastic elastomer and (C) 10 to 30% by mass of talc having an average particle diameter of 15 to 25 ?m and a distribution of a particle diameter such that the content of particles having a diameter of 5 ?m or smaller is 10% by mass or smaller and the content of particles having a diameter exceeding 40 ?m is 10% by mass or smaller. The resin composition exhibits sufficient properties when an instrument panel is molded. A seamless instrument panel having an air bag cover can be obtained as an integrally molded product, which can be treated as a single article in recycling.

Abstract: A resin composition for a component of an air intake system of an internal combustion engine including the following components (1), (2), and (3): [Components] (1) polypropylene-based resin: 67 to 89 wt % (2) acid-modified polypropylene-based resin: 1 to 3 wt % (3) carbon fiber and graphite powder: 10 to 30 wt %, the relationship between the thickness and the resonance frequency of a test specimen formed of the resin composition satisfying the following expression: [Relationship between thickness and resonance frequency]resonance frequency (Hz)?(98.5×thickness (mm))+15.

Abstract: In designing integrated circuits such as FPGAs, a design support environment including the quality of design data is improved and the design efficiency is improved. An integrated-circuit design support apparatus that supports designing of an integrated circuit having a plurality of pins is provided. The apparatus includes a processor (a central processing unit) that forms a pin layout matrix (a matrix sheet) by unifying pin layout information of the integrated circuit using a common format and arranging the pin layout information in coordinates. The processor creates an integrated-circuit design library from the pin layout matrix.

Abstract: A resin composition for a seamless air bag cover or a resin composition for a seamless instrument panel having an air bag cover which comprises (A) 50 to 90% by mass of polypropylene, (B) 0 to 20% by mass of a thermoplastic elastomer and (C) 10 to 30% by mass of talc having an average particle diameter of 15 to 25 ?m and a distribution of a particle diameter such that the content of particles having a diameter of 5 ?m or smaller is 10% by mass or smaller and the content of particles having a diameter exceeding 40 ?m is 10% by mass or smaller. The resin composition exhibits sufficient properties when an instrument panel is molded. A seamless instrument panel having an air bag cover can be obtained as an integrally molded product, which can be treated as a single article in recycling.

Abstract: A resin composition for a component of an air intake system of an internal combustion engine including the following components (1), (2), and (3): [Components] (1) polypropylene-based resin: 67 to 89 wt % (2) acid-modified polypropylene-based resin: 1 to 3 wt % (3) carbon fiber and graphite powder: 10 to 30 wt %, the relationship between the thickness and the resonance frequency of a test specimen formed of the resin composition satisfying the following expression: [Relationship between thickness and resonance frequency]resonance frequency (Hz)?(98.5×thickness (mm))+15.

Abstract: A fuel cell member-forming resin composition including (1) 67 to 89 wt % of a polypropylene-based resin, (2) 1 to 3 wt % of an acid-modified polypropylene-based resin, and (3) 10 to 30 wt % of carbon fibers and a high-purity ultrathin graphite powder having an ash content of less than 0.5 wt %.

Abstract: In designing integrated circuits such as FPGAs, a design support environment including the quality of design data is improved and the design efficiency is improved. An integrated-circuit design support apparatus that supports designing of an integrated circuit having a plurality of pins is provided. The apparatus includes a processor (a central processing unit) that forms a pin layout matrix (a matrix sheet) by unifying pin layout information of the integrated circuit using a common format and arranging the pin layout information in coordinates.

Abstract: A document search method for extracting document information similar in content to given document information, from a document database with high accuracy and efficiency. A first document database is searched based on a search query which is input by a user. First document information extracted by the search of the first document database is formatted into a format of a second document database. The second document database is searched by using the formatted first document information. Second document information which is similar in content to the formatted first document information is extracted. A degree of similarity between the formatted first document information and the second document information is calculated. The calculated degree of similarity is corrected in accordance with a condition of correction which is preset. The first and second document information and the corrected degree of similarity are output.

Abstract: Provided is an electron donating dye precursor represented by the following formula (1), (2), (3) or (4) as defined in the specification which each singly develops two colors upon color forming reaction with one kind of an electron accepting color developer depending on change in the heat energy applied. Furthermore, a heat-sensitive recording material comprising a support and a recording layer containing said electron donating dye precursor and an electron accepting color developer is provided. Moreover, a method for heat sensitive recording of multi-color images using said heat-sensitive recording material is provided.

Abstract: A wiring device and wiring method suitable for designing LSIs or printed boards or the like. The wiring device includes a wiring pattern editing unit for editing wiring patterns; a noise analyzing unit for analyzing a noise occurring when a circuit is operated according to the wiring patterns edited by the wiring editing unit; and a noise occurring spot specifying unit for specifying a spot when noise occurs in the wiring pattern, based on the solution analyzed by the noise analyzing unit and the wiring pattern edited in the wiring pattern editing unit The man-hours of an operator can be reduced by interlocking the crosstalk noise analysis with the wiring pattern editing function and then by reducing the number of man-hours needed to correct a wiring pattern by an operator.

Abstract: The object of the present invention is to provide a reversible heat sensitive recording material capable of formation and erasion of images with a clear contrast and capable of retaining stable images with time under the conditions of daily living. A reversible heat sensitive recording material comprising a support and, provided thereon, a normally colorless or light colored dye precursor and a reversible color developer which causes reversible change of color tone in the dye precursor due to the difference in cooling rate after heating, characterized in that said reversible heat sensitive recording material contains at least one specific color erasion accelerator containing a long chain alkyl group.

Abstract: This invention is directed to a method and apparatus to find out an optimum solution in automatic routing or automatic placement with certainty and at a high-speed to improve a routing rate, and to realize automatic routing in a high-density. To these end, a routing approach is selected in a conversational mode while routing efficiency is consulted to compose routing processing procedure so as to generate a routing program. Besides, component placement processing procedures designated according to placement control information are combined to generate the placement program. A straight line between component pins adjacent to each other is defined as a chord, a wave for maze method routing is generated from a start point toward an end point of a routing path and propagated between the chords adjacent to each other.

Abstract: A wiring CAD apparatus wherein a situation of a noticed event can be identified at a moment on a screen. The wiring CAD apparatus comprises a searching timing detection section for detecting a new displaying processing/deletion processing timing as a searching timing for a non-wired pin, a non-wired pin searching section operable in response to the searching timing detected by said searching timing detection section for searching the non-wired pin, and a display data production section for producing display data in accordance with which the non-wired pin searched out by said non-wired pin searching section is to be displayed on a display section in a visually distinguishable condition from another already wired part pin. The display data produced by said display data production section is displayed on the display section under the control of a displaying control section.

Abstract: A semiconductor circuit element device with an arrangement for testing the device including a plurality of first logic circuits provided in correspondence with internal line groups which are formed by grouping the internal lines into a plurality of groups, a plurality of internal lines belonging to a group in question constituting the input lines of the plurality of first logic circuits, for outputting an active output signal when all of the inputs represent active signals and outputting an inactive output signal when at least one of the inputs represents an inactive signal; and a second logic circuit constituted by one or more stages of circuit structures, for receiving the outputs of the first logic circuits and sending out an output signal such that the output signal in the case where all of the inputs are inactive output signals is different from the output signal in the case where at least one of the inputs is an active output signal.

Abstract: Disclosed is a reversible heat-sensitive recording material comprising a substrate and a recording layer formed thereon, said recording layer comprising a colorless or light-colored, electron-donating dye precursor and a specific electron-accepting compound capable of causing a reversible color tone change of the dye precursor on heating.

Abstract: As a reversible heat-sensitive recording material which contains a normally colorless or palely colored electron donating dye precursor and an electron accepting compound capable of causing said dye precursor to change reversibly in color density due to the difference in cooling rate after heating, one in which images can be formed and erased with good contrast and images high in time stability can be maintained under environment of everyday life can be obtained by using a phenolic compound having at least one aliphatic hydrocarbon group of 6 or more carbon atoms as the said electron donating compound.

Abstract: A stabilizer composition for synthetic resin is described comprising a piperazine derivative represented by the following formula (I): ##STR1## wherein R.sub.1 and R.sub.2 each represents an alkyl group having from 12 to 20 carbon atoms or a 2,2,6,6-tetramethyl-4-piperidyl group; R.sub.3 and R.sub.4 each represents a hydrogen atom or a methyl group; and n and m each represents 2 or 3.A synthetic resin composition is also described comprising polyolefin and the aforesaid piperazine derivative.