Patents by Inventor Kazuyuki Iwamura

Kazuyuki Iwamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9293684
    Abstract: An electronic component has a mounting board having a mounting surface, a SAW device mounted on the mounting surface, and a sealing part covering the SAW device and filled between the SAW device and the mounting surface. The SAW device has an element substrate, an excitation electrode provided on a major surface of the element substrate and a cover covering the excitation electrode. SAW device is mounted on the mounting surface so as to make top surfaces of the cover face the mounting surface. The sealing part contains a resin and insulating fillers having a coefficient of thermal expansion lower than that of the resin. The content of the fillers differs between an area (for example AR1) including at least a portion of an area between the cover and the mounting surface and other areas (for example AR2 and AR3).
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: March 22, 2016
    Assignee: KYOCERA Corporation
    Inventor: Kazuyuki Iwamura
  • Publication number: 20140175943
    Abstract: An electronic component has a mounting board having a mounting surface, a SAW device mounted on the mounting surface, and a sealing part covering the SAW device and filled between the SAW device and the mounting surface. The SAW device has an element substrate, an excitation electrode provided on a major surface of the element substrate and a cover covering the excitation electrode. SAW device is mounted on the mounting surface so as to make top surfaces of the cover face the mounting surface. The sealing part contains a resin and insulating fillers having a coefficient of thermal expansion lower than that of the resin. The content of the fillers differs between an area (for example AR1) including at least a portion of an area between the cover and the mounting surface and other areas (for example AR2 and AR3).
    Type: Application
    Filed: July 27, 2012
    Publication date: June 26, 2014
    Applicant: KYOCERA CORPORATION
    Inventor: Kazuyuki Iwamura
  • Patent number: 4438759
    Abstract: A heat-pipe type solar collector comprises as its principal portion a plurality of heat pipes arranged in parallel with each other and having vaporizing portions and condensing portions, and a plurality of heat collector plates traversing the heat pipes and arranged in parallel with each other, the vaporizing portion of each heat pipe penetrating through and fixedly mounted to the collector plates in intimate heat conductive relation therewith, and each collector plate having a lower portion bent substantially perpendicular to the remaining portion to cover a space between itself and an adjacent collector plate.According to this arrangement, solar heat can be effectively collected by the collector plates and transmitted to the heat pipes with a negligible heat loss. Thus the heat collecting efficiency of the water heater can be remarkably enhanced.
    Type: Grant
    Filed: December 10, 1981
    Date of Patent: March 27, 1984
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Soichi Kitajima, Kazuyuki Iwamura, Yasuhiko Takeda