Abstract: A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate.

Abstract: A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate.

Abstract: An LED device can include LED chips mounted with high density and encapsulated with a resin. The device may not be substantially affected by fluctuations in thermal stress generated in the encapsulating resin and can have reduced fluctuations in characteristics such as output power and a color tone and can have a high level of reliability which can be maintained over a long period of time. The LED device can be manufactured by a method that includes mounting LED chips with high density on a metal stem having conductive-material-made leads that extend from the metal stem, welding a lens holder having a lens temporarily fixed thereto by a silicone resin to the stem so as to enclose the LED chips, and encapsulating the LED chips and bonding wires by injecting a silicone resin serving as an encapsulating resin having translucency and flexibility into a space defined by the stem, the holder, and the lens.

Abstract: A friction material having a good balance of properties is made by molding and curing a composition which contains a fibrous base, a binder and a filler, and includes a specific combined amount of at least three types of metal oxide having Mohs hardnesses of 4 to 6.5. The friction material suppresses low-frequency noise generation, minimizes rotor and disc pad wear, and has a high and stable coefficient of friction at high speeds.

Abstract: An electronic control board assembly has a large-current control unit and a small-current control unit connected to the large-current control unit. The large-current control unit has an insert-molded board with lead frames embedded therein. The insert-molded board has a first component mounting surface and a first component soldering surface facing away therefrom. A first group of components are mounted on the first component mounting surface and have leads extending through the insert-molded board and soldered to the lead frames. The small-current control unit has a printed wiring board which has a second component mounting surface and a second component soldering surface facing away therefrom. A second group of components are mounted on the second component mounting surface and have leads extending through the printed wiring board and soldered to interconnections patterned on the second component soldering surface.