Patents by Inventor Kazuyuki Kawashima

Kazuyuki Kawashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-strength solder joint
    Patent number: 6919137
    Abstract: A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: July 19, 2005
    Assignee: NEC Corporation
    Inventors: Kazuyuki Kawashima, Yasunori Tanaka
  • High-strength solder joint
    Publication number: 20040058192
    Abstract: A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.
    Type: Application
    Filed: September 22, 2003
    Publication date: March 25, 2004
    Applicant: NEC CORPORATION
    Inventors: Kazuyuki Kawashima, Yasunori Tanaka
  • High-strength solder joint
    Patent number: 6669077
    Abstract: A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: December 30, 2003
    Assignee: NEC Corporation
    Inventors: Kazuyuki Kawashima, Yasunori Tanaka
  • Trouble releasing system and method for ATM logic IP subnetwork
    Patent number: 6195329
    Abstract: The present invention provides a trouble releasing system wherein, in operation of an ATM logic IP subnetwork, interruption of communication by a stop of an address solution server is prevented. When a currently used NHS 4 which performs address solution in a logic IP subnetwork stops a server operation because of a trouble thereof, a standby NHS control unit 63 in a standby NHS 6 issues an instruction for change-over to a server operation, and consequently, the standby NHS 6 operates as a server for address solution. Further, an NHC control unit 53 in an NHC 5a retrieves an address of the standby NHS 6 registered in a server address database 51 and causes the standby NHS 6 to switchably perform communication of an address solution request.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: February 27, 2001
    Assignee: NEC Corporation
    Inventor: Kazuyuki Kawashima