Patents by Inventor Kazuyuki Kitakura

Kazuyuki Kitakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6207272
    Abstract: A peelable heat-conductive and pressure-sensitive adhesive is disclosed, which comprises: (a) 100 parts by weight of a polymer produced from a monomer mixture comprising from 70 to 100% by weight of one or more alkyl (meth)acrylates in which the alkyl groups on the average have 2 to 14 carbon atoms and from 0 to 30% by weight of one or more monoethylenic monomers copolymerizable therewith, each based on the amount of the monomer mixture; (b) from 20 to 400 parts by weight of a plasticizer having a boiling point of 150° C. or higher; and (c) from 10 to 1,000 parts by weight of a heat-conductive filler. Also disclosed is an adhesive sheet comprising a substrate and, formed on one or each side thereof, a layer of the adhesive. The pressure-sensitive adhesive can exhibit tight adhesion during use and easy peeling after use.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: March 27, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Hitoshi Takahira, Masahiro Oura, Kazuyuki Kitakura, Takao Yoshikawa, Shigeki Muta
  • Patent number: 6194063
    Abstract: The present invention provides a heat-conductive and pressure-sensitive adhesive sheet comprising an electrical insulating plastic film having formed on one or both of the surfaces thereof (1) at least one thin layer composed of an inorganic material selected from the group consisting of ceramics, metals and metal oxides other than ceramics, and (2) a pressure-sensitive adhesive composition layer formed on the thin layer. The heat-conductive and pressure-sensitive adhesive sheet is excellent in heat-conductivity and pressure-sensitivity, results in no trouble such as complicated procedures in the production process or worsened working environment, exhibits good adhesion between the base material and the pressure-sensitive adhesive composition layer, scarcely undergoes anchoring fracture between the base material even after allowing to stand at high temperatures for a long time, and has good heat resistance.
    Type: Grant
    Filed: January 5, 1999
    Date of Patent: February 27, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Masahiro Oura, Kazuyuki Kitakura, Takao Yoshikawa
  • Patent number: 6086994
    Abstract: Heat-conductive and pressure-sensitive adhesive sheets which are excellent in heat resistance, scarcely undergo anchoring fracture between the base material and the adhesive layer and, therefore, are usable in fixing electronic parts to heat-radiating members or fixing members in various fields including constructive materials, vehicles, aircrafts and ships. the heat-conductive and pressure-sensitive adhesive sheets are in the form of sheets, tapes, etc. wherein a layer of a heat-conductive and pressure-sensitive adhesive composition, which contains an alkyl (meth)acrylate polymer having hydrophilic groups, is formed on the high frequency sputter-etched surface(s) of a plastic film containing 2 to 50% by volume of a heat-conductive, electrical insulating filler.
    Type: Grant
    Filed: April 16, 1998
    Date of Patent: July 11, 2000
    Assignee: Nitto Denko Corporation
    Inventors: Masahiro Oura, Kazuyuki Kitakura, Shigeki Muta, Takao Yoshikawa