Patents by Inventor Kazuyuki Kuwada

Kazuyuki Kuwada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and process for producing semiconductor device
    Publication number: 20040140482
    Abstract: A semiconductor device which comprises a substrate and a semiconductor element mounted thereon through bumps by the so-called flip chip method, and in which the semiconductor element has been encapsulated more easily and with higher certainty. A semiconductor device comprising a substrate and a semiconductor element mounted thereon through bumps, wherein the semiconductor element has been encapsulated by coating the back and the edges of the semiconductor element with a thermosetting sheet material having tackiness. Preferably, the tackiness of the sheet material as measured at time of use is from 2 to 15 in terms of ball tack.
    Type: Application
    Filed: January 8, 2004
    Publication date: July 22, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuyuki Kuwada, Kazuki Uwada, Yuji Hotta, Akiko Matsumura