Patents by Inventor Kazuyuki Makita

Kazuyuki Makita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140026602
    Abstract: Any one of heat medium, hot water, steam, and high-temperature gas generated by solar heat collected in a solar thermal collector (68), and geotherm, or waste heat from co•generation system or other power plant is used as the driving heat source of a multiple-effect absorption chiller (58) of triple effects or more. The multiple-effect absorption chiller includes at least an absorber, an evaporator, a condenser, a solution heat exchanger, and n stages (n?3) of regenerators, and has multiple effects. By constructing in this manner, the invention presents a system of generating chilled water for air-conditioning reduced in the CO2 emission by utilizing solar heat, earth's heat, and waste heat from co•generation system or power plant.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 30, 2014
    Applicant: Kawasaki Thermal Engineering Co., Ltd.
    Inventors: Hajime Yabase, Kazuyuki Makita, Shinji Sasaki, Yosuke Goto
  • Publication number: 20120111924
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: January 18, 2012
    Publication date: May 10, 2012
    Applicant: FUJI ELECTRIC SYSTEMS CO., LTD.
    Inventors: Kazuyuki MAKITA, Masaki ICHINOSE, Taketo WATASHIMA, Masayuki SOUTOME, Mitsuo YAMASHITA, Takeshi ASAGI, Masatoshi HIRAI, Toru MURATA
  • Publication number: 20090286093
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: July 2, 2009
    Publication date: November 19, 2009
    Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
    Inventors: Kazuyuki MAKITA, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata
  • Publication number: 20070029678
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 8, 2007
    Inventors: Kazuyuki Makita, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata
  • Patent number: 5361973
    Abstract: A solder is disposed outside a joint area without putting a solder foil in an area to be joined or performing preparatory soldering, and soldering is performed by making the melted solder permeate the joint area by a capillary phenomenon. Further, one member is supported by a solder, and a joint solder layer of desired thickness is obtained by use of a jig for supporting the one and the other member at a predetermined distance therebetween when the solder is melted. Further, if a solder outside a joint area is made to stand vertically in its longitudinal direction, and melted at such a state, pressure caused by self-weight is given to the melted solder, and oxide of the solder surface is separated from the melted solder, so that it is possible to further reduce the generation of voids.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: November 8, 1994
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Tadayoshi Ishii, Katsumi Yamada, Kazuyuki Makita