Abstract: A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

Abstract: A method for manufacturing a semiconductor device is disclosed. The method for manufacturing a semiconductor device includes preparing a base material, preparing a plurality of semiconductor elements each having a connection terminal, preparing a wiring board provided with a first wiring, arranging the plurality of semiconductor elements on the base material, covering the plurality of semiconductor elements on the base material with an insulating material, arranging the wiring board on at least one of the plurality of semiconductor elements so that the first wiring is connected to at least some of the connection terminals of the plurality of semiconductor elements covered with the insulating material, and forming a second wiring around the first wiring. The first wiring has finer wiring than the second wiring.

Abstract: A method for manufacturing a wiring board including: providing a laminate including an insulating material layer and a copper layer provided on a surface of the insulating material layer, and in which the copper layer is an electroless copper plating layer; forming a resist pattern including a groove reaching a surface of the copper layer on the surface of the copper layer; and filling the groove with a conductive material containing copper by electrolytic copper plating. The thickness of the electroless copper plating layer is, for example, 20 nm to 200 nm.

Abstract: A layered plate including a copper layer having a thickness of 5 ?m or less, and a resin layer provided on a surface of the copper layer, in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours.

Abstract: A method for manufacturing a wiring board includes preparing a structure body in which a resin sheet having a glass cloth arranged in an organic resin is attached onto a support body having a metal layer provided on a surface thereof or onto a built-in wiring layer provided on the support body, forming a recess by excimer laser in a first resin layer region in which the glass cloth does not exist on a surface side of the resin sheet, forming an opening portion reaching the metal layer on the support body from the surface of the resin sheet, and forming a wiring layer in the recess and the opening portion.

Abstract: A method for producing a wiring board, including: a step of pretreating the surface of a metal layer exposed into an opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and a step of forming a copper plating layer on the metal layer by electrolytic plating. The resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is ?2.0% by mass or more. The mass change rate is a value calculated by Expression: Mass change rate (% by mass)={(W1?W0)/W0}×100. W1 is the mass of the resist layer after a laminated body including a resist layer 3 and a copper foil is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes.

Abstract: An organic core material including a first layer having a first fiber cloth and a first resin layer formed from a first resin component and having the first fiber cloth embedded therein, and a second layer having a second fiber cloth and a second resin layer formed from a second resin component and having the second fiber cloth embedded therein. The organic core material has a laminated structure including the second layer, a plurality of the first layers, and the second layer in order, and a content percentage of the second resin component based on a mass of the second resin layer is higher than a content percentage of the first resin component based on a mass of the first resin layer.

Abstract: A method for manufacturing a substrate material for a semiconductor package, including a step of increasing a temperature of a laminated body in which a metal foil, one or more prepregs, and a metal foil are laminated in this order to a hot-press temperature while pressurizing the laminated body. The prepreg contains an inorganic fiber base material and a thermosetting resin composition. A content of the thermosetting resin composition is 40 to 80% by mass on the basis of a mass of the prepreg. In the step of increasing the temperature of the laminated body to the hot-press temperature while pressurizing the laminated body, the laminated body is heated in a condition in which the lowest melt viscosity of the prepreg is 5000 Pa·s or less.

Abstract: A photosensitive resin composition used for forming an insulating layer includes a resin including an aromatic polyester imide structure, a photopolymerization initiator and a thermal radical polymerization initiator, and when the resin including an aromatic polyester imide structure does not include a (meth)acryl group, the resin composition includes a (meth)acryloyl compound.

Abstract: A method for producing a wiring board according to the present disclosure includes: (A) forming a first insulating material layer on a supporting substrate; (B) forming a first opening part in the first insulating material layer; (C) forming a seed layer on the first insulating material layer; (D) providing a resist pattern on a surface of the seed layer; (E) forming a wiring part including a pad and wiring; (F) removing the resist pattern; (G) removing the seed layer; (H) applying a first surface treatment to the surface of the pad; (I) forming a second insulating material layer; (J) forming a second opening part in the second insulating material layer; (K) applying a second surface treatment to the surface of the pad; and (L) heating the second insulating material layer to a temperature equal to or higher than the glass transition temperature of the second insulating material layer.

Abstract: Disclosed is a method for manufacturing a wiring structure including a step of forming a wiring on an insulating resin layer. The step of forming the wiring includes: forming a modified region including pores in a surface layer of the insulating resin layer by treating a surface of the insulating resin layer with a treatment method including surface modification; forming a seed layer on the surface of the insulating resin layer by sputtering; and forming the wiring on the seed layer by electrolytic copper plating. The disclosed method may include, in this order: a step of forming a surface treatment agent layer that covers a surface of the wiring by treating the surface of the wiring with a surface treatment agent for improving adhesion; and a step of forming a modified region including pores in a surface layer of a first layer of the insulating resin layer by treating the surface of the first layer of the insulating resin layer with a treatment method including surface modification.

Abstract: An organic interposer includes: a first organic insulating layer including a groove; a first metal wire located in the groove; a barrier metal material covering the first metal wire; and a second metal wire located above the first metal wire, wherein the barrier metal material includes: a first barrier metal film interposed between the first metal wire and an inner surface of the groove; and a second barrier metal film located on the first metal wire, and wherein the second metal wire is in contact with both of the first barrier metal film and the second barrier metal film.

Abstract: The present disclosure relates to a method for selecting a photosensitive resin composition, the method including: exposing a resin film of a photosensitive resin composition at 100 to 2000 mJ/cm2 and heat-treating the resin film at 150° C. to 250° C. for 1 to 3 hours under nitrogen to produce a strip sample of a cured film having a film thickness of 10 ?m and a width of 10 mm; performing a fatigue test of repeatedly pulling the strip sample under condition (1) in which the set temperature is 25° C., the distance between chucks is 20 mm, the testing rate is 5 mm/min, and the cyclic load stress is 100 MPa, or under condition (2) in which the set temperature is ?55° C., the distance between chucks is 20 mm, the testing rate is 5 mm/min, and the cyclic load stress is 120 MPa; and selecting a photosensitive resin composition satisfying the following condition: the number of times of pulling required until the strip sample breaks in the fatigue test is 100 or more cycles.

Abstract: An organic interposer includes: a first organic insulating layer including a groove; a first metal wire located in the groove; a barrier metal material covering the first metal wire; and a second metal wire located above the first metal wire, wherein the barrier metal material includes: a first barrier metal film interposed between the first metal wire and an inner surface of the groove; and a second barrier metal film located on the first metal wire, and wherein the second metal wire is in contact with both of the first barrier metal film and the second barrier metal film.

Abstract: A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

Abstract: A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

Abstract: An organic interposer includes: a first organic insulating layer including a groove; a first metal wire located in the groove; a barrier metal material covering the first metal wire; and a second metal wire located above the first metal wire, wherein the barrier metal material includes: a first barrier metal film interposed between the first metal wire and an inner surface of the groove; and a second barrier metal film located on the first metal wire, and wherein the second metal wire is in contact with both of the first barrier metal film and the second barrier metal film.

Abstract: There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposer 10 is provided with: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, and each of the wires 13 and each of the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a each having each of the wires 13 disposed therein; and a second organic insulating layer 22 laminated to the first organic insulating layer 21 in such a way as to embed the wires 13.

Abstract: One aspect of the present invention relates to a resin composition comprising a curable resin and a curing agent, which is used for forming an inter-wiring layer insulating layer in contact with a copper wiring.

Abstract: The present invention provides a photosensitive resin composition comprising: an alkali-soluble resin having a phenolic hydroxyl group as an end group (A); a radiation-polymerizable compound (B); and a photoinitiator (C), a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device using the photosensitive resin composition.