Abstract: This invention relates to a printed wiring board having two electrically conductive circuit layers on an insulating laminate. The insulating laminate includes a first insulating layer having a thickness of 0.01 to 0.5 mm, and metal foils are provided on both sides of the first insulating layer. Metal foil circuit layers of predetermined patterns are formed by printing and etching the metal foils. Thereafter, through holes are formed in the first insulating layer across the facing metal foil circuit layers, and then electrically conductive members are applied over the through holes and the metal foil circuit layers at their ends. After that, a second insulating layer is attached onto one of the sides of the first insulating layer on which the connected metal foil circuit layers are provided.