Patents by Inventor Kazuyuki Morishita

Kazuyuki Morishita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional molding method
    Patent number: 10307964
    Abstract: A three-dimensional molding method in which a step of sintering a powder layer with a laser light or an electron beam after a flat surface has been formed by sliding of a squeegee against the powder layer is repeated in a prescribed number of times, and then the periphery is cut, in order to mold both the object 1 to be molded and a support structure 2 that supports the lower side of the object 1 from below and is intended to be removed after molding, wherein in the support structure 2, the upper parts of the struts connected to the object 1 to be molded employ truncated circular conic shapes or partial truncated circular conic shapes that are reduced in diameter toward the top.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: June 4, 2019
    Assignees: Fukui Prefectural Government, Matsuura Machinery Corporation
    Inventors: Kazuyuki Morishita, Yuya Matsuda, Tetsushi Midorikawa
  • THREE-DIMENSIONAL MOLDING METHOD
    Publication number: 20190030825
    Abstract: A three-dimensional molding method in which a step of sintering a powder layer with a laser light or an electron beam after a flat surface has been formed by sliding of a squeegee against the powder layer is repeated in a prescribed number of times, and then the periphery is cut, in order to mold both the object 1 to be molded and a support structure 2 that supports the lower side of the object 1 from below and is intended to be removed after molding, wherein in the support structure 2, the upper parts of the struts connected to the object 1 to be molded employ truncated circular conic shapes or partial truncated circular conic shapes that are reduced in diameter toward the top.
    Type: Application
    Filed: July 25, 2018
    Publication date: January 31, 2019
    Inventors: Kazuyuki Morishita, Yuya Matsuda, Tetsushi Midorikawa