Abstract: A method of press-working an inorganic substrate, which method uses a vacuum press machine having an air plunger type pressurization system and comprises bringing upper and lower heat plates which have been heated up to a predetermined temperature into contact with a combination set disposed between the upper and lower heat plates after or before the initiation of pressure reduction of a press atmosphere or under a reduced pressure and then carrying out a low pressure loading of from the initiation of pressurization to 0.05 Mpa over 10 seconds or longer and a press machine which is suitable for the above press-working method and which can set and control a low-pressure of 0.02 MPa or lower and comprises an air plunger that works as an air damper when the upper heat plate descends.

Abstract: An LED lamp manufacturing process comprising manufacturing a multi-layer printed wiring board having a large number of LED lamp portions, each comprising a depressed portion whose side wall reflects light and has a mounted LED chip sealing resin container function and whose inner bottom has an LED chip mounting pattern, and a terminal pattern which is made conductive with the LED chip mounting pattern and formed on the outer under surface or outer side surface of the depressed portion, mounting predetermined LED chips on the LED chip mounting patterns, sealing the depressed portions with a resin and cutting the board into individual LED lamps, wherein the process comprises:

Abstract: A tray for a vapor phase step in which a heat-resistant thermosetting resin is intimately bonded and impregnated to/into surfaces, including inner pore wall surfaces, of an inorganic continuously porous sintered body having a thickness of 0.5 to 10 mm and an open porosity of 5 to 50% and a thin film of a super heat-resistant thermoplastic resin is formed thereon, and a process for the production thereof.

Abstract: A process for the production of an electric part, comprising performing a circuit-parts-forming step including the introduction of impurities on one surface (surface A) of a semiconductor substrate, then bonding the surface A to a holding substrate, performing a back surface treatment step essentially including a polishing of an exposed surface (surface B) of the semiconductor substrate to a thickness of 100 &mgr;m or less to obtain an electric-part-formed thinned substrate and separating the thinned substrate from the holding substrate, wherein a resin composition containing a swelling inorganic compound (WC) is used for an adhesion layer and in the separating step the thinned substrate is separated from the holding substrate after decreasing the adhesive strength of the thinned substrate and the holding substrate by swelling the swelling inorganic compound (WC).

Abstract: A process for the production of a composite ceramic printed wiring board, comprising (1) making a penetration hole having a diameter of 0.1 to 0.8 mm in a ceramic board having an open porosity of at least 5% and a thickness of 0.1 to 10 mm, (2) fixing metal (M) to the penetration hole such that the metal (M) penetrates through the penetration hole, (3) impregnating a heat-resistant resin precursor (R) under vacuum, polymerizing the heat-resistant resin precursor (R) and polishing both surfaces of the resultant board to produce a resin composite ceramic substrate (MRA) having a conductive portion for conduction between both surfaces in a predetermined portion, and (4) forming printed wiring networks on one or both surfaces of the resin composite ceramic substrate (MRA).

Abstract: A thermally conductive adhesive sheet which has electric insulation, a high conductivity and a small thermal expansion coefficient, obtained by impregnating an inorganic continuously porous sintered substrate having a thermal conductivity of 20 W/(mk) or more and a thickness of 0.1 to 2 mm with an organometallic compound, heat-treating the organometallic compound to decompose the organometallic compound and to form an oxide or a complex oxide on continuous pore surfaces, then impregnating a resin liquid into the inorganic continuously porous sintered substrate.

Abstract: A process for the production of electric parts, comprising

Abstract: A process for the production of an electric part, comprising performing a circuit-parts-forming step including the introduction of impurities on one surface (surface A) of a semiconductor substrate, then bonding the surface A to a holding substrate, performing a back surface treatment step essentially including a polishing of an exposed surface (surface B) of the semiconductor substrate to a thickness of 100 &mgr;m or less to obtain an electric-part-formed thinned substrate and separating the thinned substrate from the holding substrate,

Abstract: A process for the production of a thinned wafer, comprising bonding the circuit surface (surface A) of a semiconductor wafer (a) to a holding substrate (b) with an adhesive film (c), grinding and polishing the back surface (surface B) of the semiconductor wafer to thin the semiconductor wafer, carrying out the metallization of the back surface (surface B) and the like as required, and then separating the thinned wafer from the holding substrate (b),

Abstract: A separating machine for a thinned semiconductor substrate, which separating machine separates a thinned semiconductor substrate from a holding substrate after a semiconductor substrate is bonded to the holding substrate with a thermoplastic resin and a back surface treatment including the thinning of the semiconductor substrate is carried out and which separating machine comprises a pair of vacuum adsorption heads for adsorbing the holding substrate-bonded thinned semiconductor substrate respectively from the holding substrate side and from the thinned semiconductor substrate side opposite to the holding substrate side, wherein at least one of the vacuum adsorption heads has a moving means for adsorbing and holding the holding substrate-bonded thinned semiconductor substrate in a predetermined position together with the other vacuum adsorption head and at least one of the vacuum adsorption heads has a system for moving in a single swing direction for separation after the above adsorption and holding, and a s

Abstract: A process for the production of a composite ceramic printed wiring board, comprising

Abstract: A method of supporting a semiconductor substrate according to the present invention can be applied to the step of processing the semiconductor substrate at a high temperature of 350° C. or higher, and there is provided a process for the production of electronic parts, comprising the steps of forming semiconductor circuits on one surface (surface A) of a semiconductor substrate (SEC) having a thickness of at least 0.2 mm, supporting the semiconductor substrate on a supporting substrate (BP) by bonding (AS) of said surface A to the supporting substrate (BP), grinding and polishing the exposed other surface (surface B) of the semiconductor substrate (SEC) by a physical method, a chemical method or a method of combination of these methods, to decrease the thickness of the semiconductor substrate (SEC) to less than 0.

Abstract: A method of preparing a high-heat-resistance resin composite ceramic that can be used at a high temperature of over 400° C., the high-heat-resistance composite ceramic exhibiting remarkably high heat resistance, excellent in processability, durability against chemicals and durability against plasma, further, exhibiting “outgassing” to a lesser degree at a high temperature under high vacuum. The method comprises the steps of impregnating an inorganic continuously porous sintered body (I) having an open porosity of at least 0.5% with an organometallic compound (M), heat-treating the impregnated inorganic continuously porous sintered body (I) to decompose the organometallic compound (M) and thereby forming a metal compound which is a carbide, a nitride, an oxide or a composite oxide on an inner wall plane of each of open pores, and filling a heat-resistant silicone resin (R) in the open pores by impregnation under vacuum and thermally curing the heat-resistant silicone resin (R).

Abstract: A metal-foil-clad composite ceramic board produced by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-imprgnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

Abstract: A composite ceramic board having a low dielectric constant and a low heat expansion coefficient and being suitable for use as a heat-resistant material having a high dimensional accuracy and a low dielectric constant, which is formed of a sintered substrate (II) having a thickness of 0.2 to 10 mm and a thermosetting resin (R) which is integrated into the sintered substrate (II) by being impregnated into pores of the sintered substrate (II) under vacuum and cured, the sintered substrate (II) being a substrate obtained from an inorganic continuous porous sintered body (I) produced by sintering a spherical inorganic powder having an average particle diameter of 0.1 to 10 .mu.m in the presence of a sintering aid, the sintered inorganic powder substantially retaining the spherical forms, the inorganic continuously porous sintered body (I) having an average pore diameter of 0.1 to 10 .mu.m, a true porosity of 8 to 35% and a closed porosity of 2% or less.

Abstract: An aromatic hydrocarbon formaldehyde resin novolak, useful as a raw phenolic compound for producing a curing agent and an epoxy resin, an epoxy resin composition which contains a novolak type epoxy resin derived from the above novolak resin and an epoxy resin and is therefore excellent in heat resistance, adhesion and humidity resistance, and a process for the production of a phenolic resin, which comprises reacting an aromatic hydrocarbon formaldehyde resin, phenol and formaldehyde in a novolak-forming reaction in the presence of a catalyst to prepare an aromatic hydrocarbon formaldehyde resin novolak, and treating the reaction product with steam while maintaining the temperature of a reaction mixture at 120.degree. to 195.degree. C. to remove unreacted substances and to decompose high-molecular-weight polymers.

Abstract: A metal-foil-clad composite ceramic board produced by impregnating by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-impregnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

Abstract: An asbestos-free high performance clutch facing which exhibits a less decrease in the friction coefficient as well as a less wearing during long-term repeated cycles of loading at high temperatures is disclosed.The clutch facing is a disk-shaped clutch facing produced by molding a composition for a friction material with heating and under pressure, the composition comprising:15-50 parts by weight of (I) a binder composition comprising 95-30% by weight of (a) an aromatic hydrocarbon-formaldehyde resin-modified novolak type epoxy resin, and 5-70% by weight of a cyanate ester resin consisting essentially of (b) a polyfunctional cyanate ester, or a prepolymer of the cyanate ester, or (b) and (c) a monofunctional or polyfunctional maleimide;20-70 parts by weight of (II) a fibrous reinforcing substrate with a fiber diameter of 0.2 .mu.m or more;2-20 parts by weight of (III) a metallic fiber substrate with a fiber diameter of 10 .mu.m or more; and5-40 parts by weight of (IV) a friction wear regulator.

Abstract: A process is provided for the production of a base board for printed wiring. The process involves the steps of wrapping a block inorganic continuous porous material with a cloth, impregnating the wrapped block inorganic continuous porous material with a thermosetting resin under reduced pressure, curing the thermosetting resin to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of .+-.5 .mu.

Abstract: An asbestos-free friction material with improved water resistance which is used in automobiles, vehicles, and industrial machinery is disclosed. The friction material comprises a fibrous reinforcing substrate other than asbestos, a binder and a friction wear regulator, the fibrous reinforcing substrate partly containing a fibrillated pulp of an aromatic liquid crystal polyester resin.