Patents by Inventor Kazuyuki Sakata
Kazuyuki Sakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9905517Abstract: Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, the first wiring and the second wiring respectively have first portions that extend in parallel with each other with a first clearance and second portions that are formed on the same wiring layer as the first portions, and extend in parallel with each other with a second clearance and third portions that are installed between the first portions and the second portions and designed to detour in such directions as to allow the mutual clearance to become greater than the first clearance and the second clearance.Type: GrantFiled: January 21, 2016Date of Patent: February 27, 2018Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Kazuhiko Hiranuma, Kazuyuki Sakata
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Patent number: 9673142Abstract: A semiconductor device with enhanced reliability. The semiconductor device has a wiring substrate which includes a first terminal electrically connected with a power supply potential supply section of a semiconductor chip, a first wiring coupling the power supply potential supply section with the first terminal, a second terminal electrically connected with a reference potential supply section of the semiconductor chip, and a second wiring coupling the reference potential supply section with the second terminal. The first terminal and second terminal are arranged closer to the periphery of the wiring substrate than the semiconductor chip. The second wiring is extended along the first wiring.Type: GrantFiled: July 12, 2016Date of Patent: June 6, 2017Assignee: Renesas Electronics CorporationInventors: Kazuyuki Sakata, Takafumi Betsui
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Publication number: 20170062322Abstract: A semiconductor device with enhanced reliability. The semiconductor device has a wiring substrate which includes a first terminal electrically connected with a power supply potential supply section of a semiconductor chip, a first wiring coupling the power supply potential supply section with the first terminal, a second terminal electrically connected with a reference potential supply section of the semiconductor chip, and a second wiring coupling the reference potential supply section with the second terminal. The first terminal and second terminal are arranged closer to the periphery of the wiring substrate than the semiconductor chip. The second wiring is extended along the first wiring.Type: ApplicationFiled: July 12, 2016Publication date: March 2, 2017Applicant: Renesas Electronics CorporationInventors: Kazuyuki SAKATA, Takafumi BETSUI
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Publication number: 20160240487Abstract: Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, the first wiring and the second wiring respectively have first portions that extend in parallel with each other with a first clearance and second portions that are formed on the same wiring layer as the first portions, and extend in parallel with each other with a second clearance and third portions that are installed between the first portions and the second portions and designed to detour in such directions as to allow the mutual clearance to become greater than the first clearance and the second clearance.Type: ApplicationFiled: January 21, 2016Publication date: August 18, 2016Inventors: Kazuhiko Hiranuma, Kazuyuki Sakata
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Publication number: 20150250167Abstract: The present invention relates to a composition for noxious organisms-controlling agent having a synergistic effect and a method for using said composition, which comprises, as active ingredients thereof, one or more compounds selected from the phthalamide derivatives represented by general formula (I) being useful as an insecticide or acaricide and one or more compounds selected from the compounds having insecticidal, acaricidal or nematocidal activity: wherein R1, R2 and R3 may be the same or different and each represent hydrogen atom, C3-C6 cycloalkyl, -A1-Qp, etc., each of X and Y may be the same or different and represents hydrogen atom, halogen atom, etc., n is an integer of 1 to 4, m is an integer of 1 to 5, and each of Z1 and Z2 represents O or S.Type: ApplicationFiled: February 23, 2015Publication date: September 10, 2015Inventors: Kazuyuki SAKATA, Masayuki MORIMOTO, Hiroshi KODAMA, Tetsuyosi NISHIMATSU
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Publication number: 20130005712Abstract: The present invention relates to a composition for noxious organisms-controlling agent having a synergistic effect and a method for using said composition, which comprises, as active ingredients thereof, one or more compounds selected from the phthalamide derivatives represented by general formula (I) being useful as an insecticide or acaricide and one or more compounds selected from the compounds having insecticidal, acaricidal or nematocidal activity: wherein R1, R2 and R3 may be the same or different and each represent hydrogen atom, C3-C6 cycloalkyl, -A1--Qp, etc., each of X and Y may be the same or different and represents hydrogen atom, halogen atom, etc., n is an integer of 1 to 4, m is an integer of 1 to 5, and each of Z1 and Z2 represents O or S.Type: ApplicationFiled: September 11, 2012Publication date: January 3, 2013Inventors: Kazuyuki Sakata, Masayuki Morimoto, Hiroshi Kodama, Tetsuyosi Nishimatsu
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Patent number: 8329733Abstract: The present invention relates to a composition for noxious organisms-controlling agent having a synergistic effect and a method for using said composition, which comprises, as active ingredients thereof, one or more compounds selected from the phthalamide derivatives represented by general formula (I) being useful as an insecticide or acaricide and one or more compounds selected from the compounds having insecticidal, acaricidal or nematocidal activity: wherein R1, R2 and R3 may be the same or different and each represent hydrogen atom, C3-C6 cycloalkyl, -A1-Qp, etc., each of X and Y may be the same or different and represents hydrogen atom, halogen atom, etc., n is an integer of 1 to 4, m is an integer of 1 to 5, and each of Z1 and Z2 represents O or S.Type: GrantFiled: February 6, 2008Date of Patent: December 11, 2012Assignee: Nihon Nohyaku Co., Ltd.Inventors: Kazuyuki Sakata, Masayuki Morimoto, Hiroshi Kodama, Tetsuyosi Nishimatsu
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Patent number: 8205277Abstract: In the upper part and the lower part of a micro-nano bubble generation section 34 in a micro-nano bubble bathtub 1, two kinds of micro-nano bubbles different in a size distribution are generated by first and second micro-nano bubble generators (submerged pump-type micro-nano bubble generator 2 and spiral flow-type micro-nano bubble generator 10) of two kinds, so that bathtub water containing micro-nano bubbles in a wide size distribution can be produced in a large amount. Some of the water containing micro-nano bubbles generated in the lower part is thrown into the first micro-nano bubble generator (spiral flow-type micro-nano bubble generator 10) in the upper part, so that the spiral flow-type micro-nano bubble generator 10 can generate micro-nano bubbles in a smaller size. Therefore, in this bathtub, micro-nano bubbles abundant in size and large in amount can be produced economically.Type: GrantFiled: September 4, 2007Date of Patent: June 26, 2012Assignee: Sharp Kabushiki KaishaInventors: Kazuyuki Yamasaki, Kazuyuki Sakata, Kazumi Chuhjoh, Masaki Kataoka
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Patent number: 8183688Abstract: There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip.Type: GrantFiled: February 8, 2011Date of Patent: May 22, 2012Assignee: Renesas Electronics CorporationInventors: Yasuhiro Yoshikawa, Motoo Suwa, Kazuyuki Sakata
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Patent number: 8057676Abstract: Drainage water containing an organofluorine compound is introduced into a raw tank (1) and then filtered through a filtration device (4). Next, a microorganism, a micro-nanobubbling auxiliary agent and a nutrient are added thereto in a first transit tank (5) while micro-nanobubbles are generated thereinto by a micro-nanobubbling machine (7), thereby giving treated water. This treated water is then fed into an active carbon column (14) and then the above-described organofluorine compound contained in the treated water is decomposed by the microorganism as described above.Type: GrantFiled: May 17, 2007Date of Patent: November 15, 2011Assignee: Sharp Kabushiki KaishaInventors: Kazuyuki Yamasaki, Kazuyuki Sakata, Kazumi Chuhjoh, Masaki Kataoka
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Patent number: 8043848Abstract: In a bioreactor, a culture solution derived from a cultivation tank is separated into bacteria cells and filtrate by a bacteria cell filter. The filtrate is introduced from the bacteria cell filter into a micro-nano bubble generation tank where micro-nano-bubbles are mixed with the filtrate. The filtrate containing micro-nano-bubbles is returned to the cultivation tank to activate the microorganisms therein, so that a biological reaction time is reduced by the activated microorganisms.Type: GrantFiled: April 11, 2007Date of Patent: October 25, 2011Assignee: Sharp Kabushiki KaishaInventors: Kazuyuki Yamasaki, Kazuyuki Sakata, Kazumi Chuhjoh, Masaki Kataoka
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Patent number: 8034931Abstract: A process for producing a substituted aminoquinazolinone derivative of formula (I), characterized by reducing a substituted iminoquinazolinone derivative of formula (II) with hydrogen in the presence of a catalyst and either of a halogen compound and a sulfur compound; a substituted iminoquinazolinone derivative of formula (II?); and a pest control agent containing the derivative of formula (II?) or a salt thereof as an active ingredient and a method of using the same (in the formulae, R represents hydrogen, formyl, (C1-C6) alkyl, (C1-C6)alkoxy(C1-C3)alkyl, (C1-C6) alkylsulfonyl, optionally substituted phenylcarbonyl, etc.; R1 represents an optionally substituted, 5- or 6-membered heterocycle having one to three heteroatoms selected among oxygen, sulfur, and nitrogen; R2 represents hydrogen or (C1-C3) alkyl; X and X? may be the same or different and each represents (C1-C6) haloalkyl, (C1-C6) haloalkoxy, etc.; n is an integer of 0; and n? is an integer of 1-4).Type: GrantFiled: May 11, 2004Date of Patent: October 11, 2011Assignee: Nihon Nohyaku Co., Ltd.Inventors: Osamu Sanpei, Masahiro Uehara, Nobuyuki Niino, Hiroki Kodama, Kazuyuki Sakata
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Publication number: 20110127671Abstract: There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip.Type: ApplicationFiled: February 8, 2011Publication date: June 2, 2011Inventors: Yasuhiro Yoshikawa, Motoo Suwa, Kazuyuki Sakata
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Patent number: 7945801Abstract: A memory interface circuit is connectable to a DDR-SDRAM which outputs read data in synchronization with a data strobe signal together with the data strobe signal. A clock generator generates internal clock signals and memory clock signals supplied to the DDR-SDRAM. The memory interface circuit determines a delay of arrival of the data strobe signal relative to the corresponding internal clock signal by using a data strobe signal inputted in a read cycle with respect to the DDR-SDRAM, samples the arrived read data, based on a signal obtained by shifting the phase of the arrived data strobe signal, and synchronizes the sampled read data to the corresponding internal clock signal on the basis of the result of determination of the arrival delay.Type: GrantFiled: July 9, 2008Date of Patent: May 17, 2011Assignee: Renesas Electronics CorporationInventors: Shigezumi Matsui, Takashi Sato, Kazuyuki Sakata, Tsuyoshi Yaguchi, Kenzo Kuwabara, Atsushi Nakamura, Motoo Suwa, Ryoichi Sano, Hisashi Shiota
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Patent number: 7914677Abstract: Water (23) that contains micro-nano bubbles generated in a micro-nano bubble generation tank (6) is introduced and treated in a charcoal water tank (ii) which is filled with a charcoal (15) and in which an air diffusing pipe (12) is placed and thereafter introduced and treated in a membrane device (21). Thus, activities of microorganisms propagating in the charcoal (15) are increased by the micro-nano bubbles, markedly increasing ability of decomposing organic matters in the water. Therefore, a clogging phenomenon due to the organic matters can be prevented by reducing organic loads on the membrane device (21). Moreover, a very small amount of alcohols or salts are added as a micro-nano bubble generation aid to the micro-nano bubble generation tank (6), improving an incidence rate of the micro-nano bubbles. The alcohols and salts are easily decomposed by the charcoal water tank (ii) and easily removed by the membrane device (21).Type: GrantFiled: February 28, 2006Date of Patent: March 29, 2011Assignee: Sharp Kabushiki KaishaInventors: Kazuyuki Yamasaki, Kazuyuki Sakata, Kazumi Chuhjoh
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Patent number: 7888795Abstract: There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip.Type: GrantFiled: June 7, 2010Date of Patent: February 15, 2011Assignee: Renesas Electronics CorporationInventors: Yasuhiro Yoshikawa, Motoo Suwa, Kazuyuki Sakata
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Patent number: 7844934Abstract: According to the present invention, a method for designing a semiconductor integrated circuit layout comprises the steps of: arranging basic logic cells which are circuit patterns corresponding to logic components of a semiconductor integrated circuit; arranging wiring between the basic logic cells; searching for a blank area in which none of the basic logic cells is arranged; extracting a rectangular region from the blank area; if the rectangular region is larger than a specified size, arranging fill cells in the rectangular region according to a predetermined rule and grouping the fill cells into pseudo-hierarchical cells according to a predetermined rule to form a hierarchy; arranging fill cells in the remaining blank areas; and performing optical proximity effect correction on the semiconductor integrated circuit pattern.Type: GrantFiled: July 14, 2006Date of Patent: November 30, 2010Assignees: Renesas Electronics Corporation, Panasonic Corporation, Fujitsu Microelectronics Limited, Kabushiki Kaisha ToshibaInventors: Yusaku Ono, Osamu Suga, Kazuyuki Sakata, Hirofumi Taguchi, Yushi Okuno, Toshiaki Sugioka, Daisuke Kondo
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Publication number: 20100244238Abstract: There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip.Type: ApplicationFiled: June 7, 2010Publication date: September 30, 2010Inventors: Yasuhiro Yoshikawa, Motoo Suwa, Kazuyuki Sakata
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Patent number: 7803272Abstract: A first treatment tank (1) to a fourth treatment tank are installed prior to ultrapure water production apparatus (5), dilute wastewater recovering apparatus (34), general service water recovering apparatus and wastewater treatment apparatus. The treatment tanks (1, 2, . . . ) each have a micro-nano bubble generation tank (6, 23, . . . ) and an anaerobic measuring tank (7, 24, . . . ). Accordingly, microbes within the respective anaerobic measuring tanks (7, 24, . . . ) are activated by micro-nano bubbles generated in each micro-nano bubble generation tank (6, 23, . . . ) to thereby enhance the treatment efficiency of low-concentration organic matter. Further, when the value measured by dissolved oxygen meter (13, 30, . . . ) or oxidation-reduction potentiometer (14, 31, . . . ) of each anaerobic measuring tank (7, 24, . . . ) exceeds an individually determined given range, the rotational speed of a circulating pump (9, 26, . . . ) is controlled to thereby decrease the generation of micro-nano bubbles.Type: GrantFiled: February 28, 2006Date of Patent: September 28, 2010Assignee: Sharp Kabushiki KaishaInventors: Kazuyuki Yamasaki, Kazuyuki Sakata, Kazumi Chuhjoh
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Patent number: 7750464Abstract: There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip.Type: GrantFiled: January 25, 2008Date of Patent: July 6, 2010Assignee: Renesas Technology Corp.Inventors: Yasuhiro Yoshikawa, Motoo Suwa, Kazuyuki Sakata