Abstract: Falling of a substrate and deformation or breakage of the substrate are inhibited. A substrate holder includes a hole portion in which a disk-shaped substrate is placed upright, and at least four supporting members attached elastically-deformably on a periphery of the hole portion. Two of the four supporting members support disk-shaped substrate at first- and second-side circumferential end portions of disk-shaped substrate positioned at vertical-direction upper positions of disk-shaped substrate. Remaining two of the four supporting members support disk-shaped substrate at third- and fourth-side circumferential end portions of disk-shaped substrate positioned at vertical-direction lower positions of disk-shaped substrate. Central angle in disk-shaped substrate between either first- or second-side circumferential end portion and uppermost end portion of disk-shaped substrate is from 15° through 40°.

Abstract: The substrate for surface protective sheet of the present invention is a substrate for surface protective sheet including a support film and an antistatic layer provided on one face of the support film, wherein a stress relaxation rate of the substrate for surface protective sheet is 60% or more; the antistatic layer is one formed by curing an antistatic layer-forming composition containing a curing component and a metal filler; and the content of a metal filler is 55 mass % or more relative to the total mass of the curing component and the metal filler, and the curing component includes a urethane acrylate oligomer.

Abstract: A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

Abstract: A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

Abstract: The substrate for surface protective sheet of the present invention is a substrate for surface protective sheet including a support film and an antistatic layer provided on one face of the support film, wherein a stress relaxation rate of the substrate for surface protective sheet is 60% or more; the antistatic layer is one formed by curing an antistatic layer-forming composition containing a curing component and a metal filler; and the content of a metal filler is 55 mass % or more relative to the total mass of the curing component and the metal filler, and the curing component includes a urethane acrylate oligomer.

Abstract: The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Abstract: To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

Abstract: The present invention relates to a back grinding sheet (BG sheet) (1a, 1b, 1c) having an unevenness-absorbing layer (12) on a substrate (11), in which the unevenness-absorbing layer is a layer formed of a film-forming composition containing (A) a urethane (meth)acrylate and (B) a polymerizable monomer except component (A) and the layer satisfies the following requirements (a) to (c): (a) a loss tangent at 70° C. measured at a frequency of 1 Hz is 1.5 or more, (b) a relaxation rate 300 seconds after a square (1 cm×1 cm) of the unevenness-absorbing layer is compressed at 25° C. and a compressive load of 10 N is 30% or less, and (c) a storage elastic modulus at 25° C. measured at a frequency of 1 Hz is 1.0 to 10.0 MPa.

Abstract: The network relay apparatus is provided. The network relay apparatus includes: a main controller; a relay processor; and, a network interface unit configured to include: a plurality of line interfaces to which physical lines are respectively connected and send and receive a packet to and from outside of the network relay apparatus; a data storage configured to store circuit data; a programmable logic device by with a logic circuit having a predetermined function is realized; a configuration circuit configured to direct the programmable logic device to configure the logic circuit using the circuit data; and a state controller provided in a circuit structure other than the programmable logic device to control state of each of the plurality of line interfaces to one of an active state which allows data transmission and reception and a standby state which prohibits data transmission and reception.

Abstract: The present invention relates to a back grinding sheet (BG sheet) (1a, 1b, 1c) having an unevenness-absorbing layer (12) on a substrate (11), in which the unevenness-absorbing layer is a layer formed of a film-forming composition containing (A) a urethane (meth)acrylate and (B) a polymerizable monomer except component (A) and the layer satisfies the following requirements (a) to (c): (a) a loss tangent at 70° C. measured at a frequency of 1 Hz is 1.5 or more, (b) a relaxation rate 300 seconds after a square (1 cm×1 cm) of the unevenness-absorbing layer is compressed at 25° C. and a compressive load of 10 N is 30% or less, and (c) a storage elastic modulus at 25° C. measured at a frequency of 1 Hz is 1.0 to 10.0 MPa.

Abstract: To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

Abstract: The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Abstract: An adhesive sheet includes a base film, an anchor coat layer including a compound having an energy ray polymerizable group, and an energy ray curable adhesive layer that are stacked in this order.

Abstract: A deposition method of depositing a nitride film, including steps of introducing one or more nitrogen supplying gas selected from hydrazine and nitrogen oxides into a catalyst reaction apparatus; enabling a reactive gas generated by contacting the nitrogen supplying gas with catalyst to be spouted out from the catalyst reaction apparatus; and reacting the reactive gas with a compound gas, thereby depositing a nitride film on a substrate is disclosed.

Abstract: A packet transfer apparatus includes a data analyzing unit, a memory control unit, and a control unit that holds a copy condition table and has a control information comparing unit. The data analyzing unit refers to a header of a received packet to analyze control information and transmits an analysis result to the control unit. The control unit searches the copy condition table on the basis of the analysis result and transmits a search result to the memory control unit. The memory control unit generates a record of a copy packet whose packet length is shortened in a memory calling management table on the basis of the search result.

Abstract: A substrate bonding method in which a pair of masks which were prepared by forming a recessed section at a center part of each flat plate are placed on upper and lower stages, respectively, so that the recessed sections face a CF substrate and a TFT substrate, the CF substrate and TFT substrate are positioned one upon another and bonded together by sandwiching them between the masks. With this method, not only the CF substrate and TFT substrate are protected by the recessed sections from both sides, but also the dimensions of a region of each of the CF substrate and TFT substrate protected by the recessed sections are easily changed by replacing the masks. It is thus possible to provide a substrate bonding method that can readily meet the manufacture of bonded substrates of a variety of dimensions.

Abstract: A box-shaped plastic housing of integrally molded resin comprises a flat-shaped bottom wall having a peripheral edge and an upright wall extending upwardly from the peripheral edge of the bottom wall. The bottom wall and the upright wall cooperatively define an integral box-shaped molded product. The thickness of the bottom wall is in the range of two-thirds to one-third with respect to the thickness of the upright wall. The bottom wall is provided with at least one rib on its inner surface. The housing is produced by an injection molding process using a mold having a mold cavity which is provided with a groove on the inner surface of the cavity corresponding to each rib.

Abstract: A pendulum acceleration sensor includes a plate-like pendulum, at least a pair of detection sensors, and a holder unit. The pendulum swings about a shaft in a direction parallel to the side surfaces of the pendulum in accordance with an acceleration. The pair of detection sensors are arranged to oppose each other with the pendulum interposed therebetween to detect the displacement amount of the pendulum upon swing. The holder unit is constituted by sensor storing members for storing the detection sensors and positioning the detection sensors with respect to the pendulum, and shaft support members integrally formed with the sensor storing members to pivotally support two ends of the shaft of the pendulum and define a swing space for the pendulum.

Abstract: An injection molding process for producing an integrally molded box-shaped plastic housing of a resin material. The housing includes integral portions of a bottom wall of a first thickness and an upright wall of a second thickness, the first thickness being in the range of from one-third to two-thirds of the second thickness and the bottom wall portion including at least one integral rib structure. A cavity is formed in a mold having cavity portions, respectively corresponding to the bottom and upright wall portions and the rib structure, in fluid communication. Fluid resin is injected through respective injection gates directly communicating with the rib structure cavity portion and the upright wall cavity portion, which provide passageways for flow of the liquid resin therethrough, thereby completely filling all cavity portions.

Abstract: A bone mineral content measuring apparatus for obtaining the bone mineral content of an object to be examined by irradiating X-rays onto the object and measuring the X-rays which have passed through the object. An X-ray generating device generates X-rays having a continuous spectrum. The X-rays generated pass through an X-ray filter before the irradiation of the object or after the transmission of the object. The X-ray filter is composed of a substance having an X-ray absorbing characteristic with the K-absorption edge at a predetermined energy value. The X-rays which have passed through the X-ray filter and the object are detected by the X-ray detector. A data analyzer inputs the detected X-ray detection data and analyzes the bone mineral content of the object on the basis of the X-ray absorbing characteristic of the X-ray filter.