Abstract: A vehicle door seal includes a first wall portion and a second wall portion extending from the first wall portion, the first wall portion and second wall portion combining to define a flow passage. A projection extends from an exterior surface of the second wall portion along an entire length of the second wall portion. The projection is structured to convey excess moisture from a relatively higher portion of the seal downwardly toward another, relatively lower portion of the seal for drainage.

Abstract: A vehicle door seal includes a first wall portion and a second wall portion extending from the first wall portion, the first wall portion and second wall portion combining to define a flow passage. A projection extends from an exterior surface of the second wall portion along an entire length of the second wall portion. The projection is structured to convey excess moisture from a relatively higher portion of the seal downwardly toward another, relatively lower portion of the seal for drainage.

Abstract: A display panel provided with a protective film includes a display panel and the protective film that is provided on a display surface of the display panel, in which the display panel is provided with a first through-hole passing through the display panel in a thickness direction, the protective film includes a first protective film, the first protective film is provided with a second through-hole passing through the first protective film in the thickness direction, the first through-hole and the second through-hole are in communication with each other and form a through-hole, the first protective film includes a first grip portion at a peripheral edge portion of the first protective film, and the first protective film includes a dividing portion that continues from the second through-hole to an end side of the first grip portion.

Abstract: A display device includes a display panel, a lighting device includes a light-emitting member for back illuminating the display panel and a frame-shaped portion surrounding the light-emitting member from an outer side, a housing accommodating the display panel and the lighting device and having an opening on a display surface side, and a sealing member closing the opening. The frame-shaped portion is fixed to the housing with a fixing member and extends from the lighting device to the sealing member, includes an end disposed adjacent to the sealing member and bonded to the sealing member with an adhesive.

Abstract: A lighting device for illuminating an illuminated body with light includes a light source, a light guide plate, and an optical sheet. The light guide plate is configured to guide light from the light source. The optical sheet is configured to impart an optical effect to light exiting from the light guide plate. The optical sheet includes at least one communicating groove that communicates from an outer peripheral end face of the optical sheet to a surface opposed to the illuminated body.

Abstract: A display device includes a display panel, a lighting device, a housing, and a sealing member. The display panel is configured to display an image. The lighting device is disposed behind a back surface of the display panel. The lighting device includes a light-emitting member that emits light to the display panel a frame-shaped portion surrounding the light-emitting member from an outer side. The housing accommodates the display panel and the lighting device therein and includes an opening on a display surface side of the display panel. The sealing member seals the opening. The frame-shaped portion is fixed to the housing with a fixing member and extends from the lighting device to the sealing member. The frame-shape portion includes an end disposed adjacent to the sealing member and bonded to the sealing member with an adhesive.

Abstract: A display panel provided with a protective film includes a display panel and the protective film that is provided on a display surface of the display panel, in which the display panel is provided with a first through-hole passing through the display panel in a thickness direction, the protective film includes a first protective film, the first protective film is provided with a second through-hole passing through the first protective film in the thickness direction, the first through-hole and the second through-hole are in communication with each other and form a through-hole, the first protective film includes a first grip portion at a peripheral edge portion of the first protective film, and the first protective film includes a dividing portion that continues from the second through-hole to an end side of the first grip portion.

Abstract: A lighting device for illuminating an illuminated body with light includes a light source, a light guide plate, and an optical sheet. The light guide plate is configured to guide light from the light source. The optical sheet is configured to impart an optical effect to light exiting from the light guide plate. The the optical sheet includes at least one communicating groove that communicates from an outer peripheral end face of the optical sheet to a surface opposed to the illuminated body.

Abstract: A liquid crystal display device (100) in an embodiment according to the present invention includes an optical switch panel (30) that is provided between a liquid crystal display panel (10) and a backlight unit (20) or on an observer side of the liquid crystal display panel, and transmits and blocks light in a switched manner in one vertical scanning period. The optical switch panel includes a first substrate (31), a second substrate (32) and a liquid crystal layer (33) provided between the first substrate and the second substrate The first substrate includes a plurality of transparent electrodes (34). The second substrate includes a second transparent electrode (35) facing the plurality of first transparent electrodes. The first substrate further includes a plurality of metal lines (36) that are formed of a metal material and are each electrically connected with a corresponding first transparent electrode among the plurality of first transparent electrodes.

Abstract: A manual machine for attaching an insulation displacement connector (10) has housing stoppers (34A,34B) for positioning it on a rest (33), a housing holder (35) for holding the connector on the rest, and a set block (36) disposed near the rest in order to position electric wires (11) at their ends or middle portions. The machine further has a wire holder (37) near the housing holder (35) so as to guide and hold the wires at a given pitch, and a wire stopper (38) pivoted to the set block (36) so as to swivel between an active position close to this block and an idle position remote from it. The wire stopper (38) has a collision portion (61) on which the wire ends (11) will impinge to be aligned one with another, and a biasing portion (63) that will urge the wires' middle portions towards the set block (36).

Abstract: A manual machine for attaching an insulation displacement connector (10) has housing stoppers (34A,34B) for positioning it on a rest (33), a housing holder (35) for holding the connector on the rest, and a set block (36) disposed near the rest in order to position electric wires (11) at their ends or middle portions. The machine further has a wire holder (37) near the housing holder (35) so as to guide and hold the wires at a given pitch, and a wire stopper (38) pivoted to the set block (36) so as to swivel between an active position close to this block and an idle position remote from it. The wire stopper (38) has a collision portion (61) on which the wire ends (11) will impinge to be aligned one with another, and a biasing portion (63) that will urge the wires' middle portions towards the set block (36).

Abstract: A mount apparatus according to this invention has a mount head for pressing a semiconductor chip on a mount substrate through an adhesive layer. A position sensor for discretely detecting the position of the mount head in a pressing process every predetermined time interval is arranged in the mount head. A non-defect/defect determination unit is also arranged, and the non-defect/defect determination unit performs non-defect/defect determination of the adhesive layer on the basis of the position detected by the position sensor.

Abstract: A lead shape measurement apparatus includes a first perspective imaging device for photographing external leads to be measured, from an oblique direction; a second perspective imaging device for photograping external leads to be measured, from an oblique direction different from that of the first perspective imaging device and so as to include a same photographic field of vision as the first perspective device; a first measurement point determination element for determining a center point of two intersecting virtual straight lines which intersect two ridges of the external leads to be measured in an image plane by photography of the first perspective imaging device; a second measurement point determination element for setting epipolar line in the image plane by the second perspective imaging device on the basis of sight lines when a measurement sampling point of the first perspective imaging device is photographed, and for determining a center point of two intersecting virtual straight lines which intersect t

Abstract: An inner lead bonding inspecting method comprises the steps of: irradiating an illumination light onto the planar surface of a bonding portion between an electrode bump provided on a semiconductor pellet and an inner lead, measuring the quantity of reflected light from the surface, and judging whether the bonding state of the inner lead bonding is good or bad on the basis of the measured result. According to another aspect, an inner lead bonding inspecting apparatus comprises any irradiation device for irradiating a light onto a planar surface of a bonding portion between an electrode bump provided on a semiconductor pellet and an inner lead; a light quantity measurement device for measuring the quantity of reflected light from the inner lead surface, and a judging device for comparing the measured quantity of reflected light with a reference light quantity, to judge the quality of the bonding state.

Abstract: To eliminate complicated adjustment of the mutual positional relationships between cameras and an object to be measured in the method of measuring a three dimensional shape of an object, images of an object to be measured are taken from different directions by use of three or more imaging devices; a combination of at least two imaging devices is selected in such a way that an angle between an obtained object image and an epipolar line becomes close to a right angle; and image information generated by the selected imaging devices are used as measuring image information. The method is particularly suitable when line-shaped objects extending in various directions are automatically measured three-dimensionally.

Abstract: A bonded portion of a bonding wire jointed to a semiconductor chip, for example, is inspected by utilizing a image pickup device by a method which comprises the steps of image picking up a bonded portion plastically deformed, extracting the bonded portion as a mass of pixels each having predetermined brightness from an image picked up by the image pickup device, decreasing a size of the mass of the extracted pixels by carrying out, by at least one step, logical brightness conversion, i.e. filtering, operation on the basis of the relationship in brightness of one of the pixels with respect to other pixels which surround the one of the pixels, and repeating the brightness conversion operation till the mass of the extracted pixels is extinguished. A size of the bonded portion is detected in dependency on the number of times of the brightness conversion operations carried out till the mass of the pixels is extinguished to thereby evaluate the quality of the bonded portion.

Abstract: To inspect the wire bonding of semiconductor chips of different sizes and with a broader allowability of chip mislocation on an inspection table, the inspecting apparatus includes an inspection base on which a chip is mounted; an illuminator for illuminating the wires to be inspected; an optical cylinder for forming an optical image of the wires; a video unit for generating video signals; an image processing unit for recognizing wire shapes and measuring wire bonded positions; a storage unit for storing inspection criteria; a main controller for comparing the recognized wire shapes and the measured wire bonded positions with the stored criteria to decide on chip acceptance or unacceptance; and, in particular, an x-y table for moving the optical cylinder relative to the inspection base or vice versa; and a controller for controlling the relative positional relationship between the two, so that an inspection area can be image-formed by the optical cylinder at a correct inspection position.

Abstract: Wire-bonding of a semiconductor device designed in accordance with the CAD system is implemented on the basis of bonding data obtained by making use of the design data in the CAD system For the design data in the CAD system, coordinate data of the bonding pads and the lead frames and wiring information therebetween are used. Since ordinarily the coordinate system in the CAD system and the coordinate system in the wire-bonding apparatus are not equal to each other, coordinate transformation is applied to the bonding data obtained from the CAD system. The data thus transformed is delivered to the bonding unit. Since there is employed a scheme to utilize the design data in the CAD system, the necessity of inputting bonding data by an operator is eliminated, thus making it possible to carry out bonding work free from an error in a short time.

Abstract: A wire bonding device including a camera for producing image signals corresponding to a field of view including an object having plural target patterns on which wire bonding is to be performed, a displacement device for altering the field view of the camera by varying the relative positioning between the camera and the object, a monitor for displaying an image of the object to be wire bonded, a reference mark display generation circuit coupled to the camera and the monitor for combining reference mark signals with the image signals so that an image of a reference mark is superimposed on the image of each target displayed by said monitor, a reference mark generation circuit for storing data corresponding to plural reference marks and for producing reference mark signals defining a selected reference mark and applying the reference mark signals to the reference mark display generation circuit, and an input selection and control device coupled to the reference mark generation circuit for selecting a reference ma