Abstract: A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.

Abstract: A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.

Abstract: A semiconductor IC used for synthesizer having a phase locked loop PLL, a voltage controlled oscillator (VCO) and a mixer (MIX) for intermediate frequency is formed on a one chip silicon wafer. A semiconductor IC used for synthesizer having a VCO portion and an internal circuit such as PLL on a silicon wafer chip includes a differential buffer circuit which separates the VCO portion from the internal circuit. A capacitor (C1) is connected to an output of the VCO portion. A constant voltage source (V1) may be connected to respective input of the differential transistors (Q4, Q5). Transistors (Q6,Q7) provide emitter follower output circuits in the differential buffer. Respective emitters of the transistors (Q6,Q7) are connected to corresponding constant current sources (I1,I2).