Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: An apparatus comprises a flexible substrate including a modular electrode array disposed on the flexible substrate. The modular electrode array includes a plurality of electrode modules, where an electrode module includes a plurality of electrodes. The flexible substrate also includes a spatial separation between the electrode modules of the modular electrode array, and conductive interconnect coupled to the electrodes of the plurality of electrodes.

Abstract: The neural interface system of one embodiment includes a cylindrical shaft, a lateral extension longitudinally coupled to at least a portion of the shaft and having a thickness less than a diameter of the shaft, and an electrode array arranged on the lateral extension and radially offset from the shaft, including electrode sites that electrically interface with their surroundings. The method of one embodiment for making the neural interface system includes forming a planar polymer substrate with at least one metallization layer, patterning on at least one metallization layer an electrode array on a first end of the substrate, patterning conductive traces on at least one metallization layer, rolling a portion of the substrate toward the first end of the substrate, and securing the rolled substrate into a shaft having the first end of the substrate laterally extending from the shaft and the electrode array radially offset from the shaft.

Abstract: An implantable optical electrode having a thin film electrode array including a plurality of electrodes, a light source associated with the thin film electrode array, and a passive bioactive agent delivery module associated with the thin film electrode array. Also disclosed are methods of manufacturing the array and a neural interface system with passive fluid delivery.

Abstract: A neural interface array including an optical waveguide, a thin film electrode array associated with the optical waveguide, the thin film electrode array having a plurality of electrodes, and a fluid delivery channel attached to at least one of the optical waveguide and the thin film electrode array. Also disclosed are methods for optical stimulation and a neural interface system with active fluid delivery.

Abstract: An apparatus comprises a flexible substrate. The flexible substrate includes a first substrate surface, a surface electrode array that includes a plurality of electrodes disposed on the first substrate surface, one or more flexible neural probes substantially orthogonal to the first substrate surface and insertable into biological tissue, and a penetrating electrode array that includes a plurality of electrodes formed on the one or more flexible neural probes, wherein electrodes of the surface electrode array and the penetrating electrode array are configured to one or both of receive a neural signal from a neural signal source and provide electrical stimulation energy to a neural stimulation target.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.