Patents by Inventor Ke-Chun CHOU

Ke-Chun CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Smart USB modules and method of making
    Patent number: 10251293
    Abstract: A system and method for data storage are disclosed. In a first aspect, the system comprises a printed circuit board, a central processing unit (CPU) coupled to the printed circuit board, an USB connector coupled to the CPU, and an USB receptacle connector coupled to the CPU. In a second aspect, the system is a smart USB device that includes a smart USB module and a USB drive coupled to the smart USB module.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: April 2, 2019
    Assignee: Kingston Digital, Inc.
    Inventors: Choon-Tak Tang, Ke-Chun Chou
  • SMART USB MODULES AND METHOD OF MAKING
    Publication number: 20150289402
    Abstract: A system and method for data storage are disclosed. In a first aspect, the system comprises a printed circuit board, a central processing unit (CPU) coupled to the printed circuit board, an USB connector coupled to the CPU, and an USB receptacle connector coupled to the CPU. In a second aspect, the system is a smart USB device that includes a smart USB module and a USB drive coupled to the smart USB module.
    Type: Application
    Filed: April 3, 2014
    Publication date: October 8, 2015
    Applicant: Kingston Digital, Inc.
    Inventors: Choon-Tak TANG, Ke-Chun CHOU
  • USB device with solderless connector interface
    Patent number: 8651897
    Abstract: The present invention includes a USB3 device with solderless USB3 connector interfaces, which comprises: a USB3 device main body that houses a carrier body made of rigid material; four interface pins in the outer row that conform to the USB2.0 standard; five interface pins in the inner row that conform to the USB3.0 standard; and a substrate and electronic circuitry; and a USB3 device sub-body that houses: a carrier body made of rigid material; and five interface pins that conform to the USB3.0 standard wherein each interface pin has an upper convex part and a lower concave part; the upper convex part and the lower concave part forms a spring coil pin; and the spring coil pin can withstand multiple times of compression; a top casing; a bottom casing; and a case assembly.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: February 18, 2014
    Assignee: Kingston Digital, Inc.
    Inventors: Ben Wei Chen, Chin-Tang Yen, Ke-Chun Chou
  • USB DEVICE WITH SOLDERLESS CONNECTOR INTERFACE
    Publication number: 20130337701
    Abstract: The present invention includes a USB3 device with solderless USB3 connector interfaces, which comprises: a USB3 device main body that houses a carrier body made of rigid material; four interface pins in the outer row that conform to the USB2.0 standard; five interface pins in the inner row that conform to the USB3.0 standard; and a substrate and electronic circuitry; and a USB3 device sub-body that houses: a carrier body made of rigid material; and five interface pins that conform to the USB3.0 standard wherein each interface pin has an upper convex part and a lower concave part; the upper convex part and the lower concave part forms a spring coil pin; and the spring coil pin can withstand multiple times of compression; a top casing; a bottom casing; and a case assembly.
    Type: Application
    Filed: June 14, 2012
    Publication date: December 19, 2013
    Applicant: Kingston Digital Inc.
    Inventors: Ben Wei CHEN, Chin-Tang YEN, Ke-Chun CHOU