Patents by Inventor Ke-Hao Pan

Ke-Hao Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10680145
    Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: June 9, 2020
    Assignee: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Ke-Hao Pan, Sheng-Wei Chou, Yi-Sheng Lan, Chia-Fong Chou, Chung-Chuan Hsieh, Jen-Hao Pan, Hao-Yu Yang, Chieh-Yu Kang, Tzu-Lun Tseng
  • Publication number: 20190044036
    Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 7, 2019
    Inventors: KE-HAO PAN, SHENG-WEI CHOU, YI-SHENG LAN, CHIA-FONG CHOU, CHUNG-CHUAN HSIEH, JEN-HAO PAN, HAO-YU YANG, CHIEH-YU KANG, TZU-LUN TSENG
  • Publication number: 20160225959
    Abstract: An LED package having a substrate, an LED chip, a phosphor sheet and a first resin is provided. The LED chip is disposed on the substrate. The phosphor sheet has a first area, and is affixed on a first surface of the LED chip. The first resin is disposed on the substrate for covering the LED chip along with the phosphor sheet, with at least a part of the phosphor sheet being exposed.
    Type: Application
    Filed: February 3, 2016
    Publication date: August 4, 2016
    Inventors: Ke-Hao Pan, Chi-Ming Wu
  • Patent number: 9263647
    Abstract: Various examples of a light emitting diode (LED) package structure and a manufacturing method thereof are described. In one aspect, a LED package structure includes a carrier, a LED chip, a first annular barricade, a second annular barricade and a fluorescent encapsulant. The LED chip is electrically connected to the carrier. The first annular barricade and the second annular barricade are disposed around the LED chip, with the second annular barricade disposed between the LED chip and the first annular barricade. The fluorescent encapsulant is disposed on the carrier and at least covers the LED chip and the second annular barricade. The fluorescent encapsulant includes at least a type of phosphor and at least a type of gel with the phosphor distributed over a surface of the LED chip.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: February 16, 2016
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Robert Yeh, Ke-Hao Pan
  • Publication number: 20130334553
    Abstract: Various examples of a light emitting diode (LED) package structure and a manufacturing method thereof are described. In one aspect, a LED package structure includes a carrier, a LED chip, a first annular barricade, a second annular barricade and a fluorescent encapsulant. The LED chip is electrically connected to the carrier. The first annular barricade and the second annular barricade are disposed around the LED chip, with the second annular barricade disposed between the LED chip and the first annular barricade. The fluorescent encapsulant is disposed on the carrier and at least covers the LED chip and the second annular barricade. The fluorescent encapsulant includes at least a type of phosphor and at least a type of gel with the phosphor distributed over a surface of the LED chip.
    Type: Application
    Filed: June 10, 2013
    Publication date: December 19, 2013
    Inventors: Robert Yeh, Ke-Hao Pan
  • Patent number: 8378364
    Abstract: Multi-chip light emitting diodes and method for fabricating the same are provided. The multi-chip light emitting diode includes a lead frame including a carrier part. A plurality of chips is disposed on the carrier part, wherein the plurality of chips includes a first chip and a second chip. A first scattering layer is conformally covering the first chip to expose electrodes thereof, wherein the first scattering layer consists of a first scattering material. A second scattering layer is conformally covering the second chip to expose electrodes thereof, wherein the second scattering layer consists of a second scattering material.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: February 19, 2013
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Ke-Hao Pan, Chun-Cheng Lin
  • Publication number: 20100200876
    Abstract: Multi-chip light emitting diodes and method for fabricating the same are provided. The multi-chip light emitting diode includes a lead frame including a carrier part. A plurality of chips is disposed on the carrier part, wherein the plurality of chips includes a first chip and a second chip. A first scattering layer is conformally covering the first chip to expose electrodes thereof, wherein the first scattering layer consists of a first scattering material. A second scattering layer is conformally covering the second chip to expose electrodes thereof, wherein the second scattering layer consists of a second scattering material.
    Type: Application
    Filed: February 4, 2010
    Publication date: August 12, 2010
    Inventors: Ke-Hao Pan, Chun-Cheng Lin
  • Publication number: 20100133580
    Abstract: A light emitting diode package structure includes a frame, a light emitting diode chip electrically coupled to the frame, an upper packing portion covering the light emitting diode chip on the frame, and a lower packing portion circumferentially disposed on the frame for fixation and next to the upper packing portion. Lights from the light emitting diode chip are outwardly emitted through the upper packing portion. The lower packing portion is extended from and partially covered by the upper packing portion.
    Type: Application
    Filed: January 29, 2010
    Publication date: June 3, 2010
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventor: Ke-Hao Pan