Patents by Inventor Ke Hong
Ke Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130693Abstract: A system and method for generating a computed tomography (CT) image of an object includes establishing a narrow-spectrum high-energy bin and other bins with wider-spectrum and lower-energies and acquiring a first dataset using the narrow-spectrum high-energy bin. The method also includes acquiring second or more datasets using the wide-spectrum, low-energy bins, reducing data attributable to scatter from the second or more datasets using the first dataset to create reduced-scatter datasets, and reconstructing CT images of the object from the reduced-scatter datasets.Type: ApplicationFiled: October 22, 2022Publication date: April 25, 2024Inventors: Guang-Hong Chen, Ran Zhang, Ke Li
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Patent number: 11910571Abstract: The present invention relates to a housing part, a housing and an electronic device. The housing part according to this invention comprises a first layer, said first layer being molded from a first composition comprising a1) 50-90 wt. % of a first amorphous polymer and b1) 10-50 wt. % of a first thermally conductive filler, the first composition having a thermal conductivity (TC1) of 4-40 W/(m*K), a second layer, said second layer being molded from a second composition comprising a2) 50-90 wt. % of a second amorphous polymer and b2) 10-50 wt. % of a second thermally conductive filler, the second composition having a thermal conductivity (TC2) of 0.Type: GrantFiled: July 13, 2020Date of Patent: February 20, 2024Assignee: Covestro Intellectual Property GmbH & Co. KGInventors: Guanghui Wu, Fan Yang, Ke Hong
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Publication number: 20230167261Abstract: The present application relates to a polycarbonate composite article, a preparation method therefor, and use thereof. The polycarbonate composite article includes a foamed polycabonate layer and a non-foamed polycarbonate film layer on the foamed polycarbonate layer. The polycarbonate composite article according to the present invention has a reduced weight and improved signal penetration performance, and can be used as an antenna housing.Type: ApplicationFiled: April 9, 2021Publication date: June 1, 2023Inventors: Jiru Meng, Hua Han, Ke Hong, Paula Xiong
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Publication number: 20230036181Abstract: Disclosed herein are antibodies and compositions used for binding to Gal3. Some embodiments allow for disrupting interactions between Galectin-3 (Gal3) and cell surface markers and/or proteins associated with neurological diseases and/or proteopathies, such as Alzheimer's disease. Additionally, disclosed herein are methods of treatment and uses of the antibodies or binding fragments thereof for the treatment of fibrosis, liver fibrosis, kidney fibrosis, cardiac fibrosis, pulmonary fibrosis, non-alcoholic fatty liver disease, non-alcoholic steatohepatitis, sepsis, atopic dermatitis, psoriasis, cancer, brain cancer, breast cancer, colorectal cancer, kidney cancer, liver cancer, lung cancer, pancreatic cancer, bladder cancer, stomach cancer, hematological malignancy, neurological diseases and/or proteopathies. Furthermore, some embodiments provided herein can cross the blood-brain barrier and can be conjugated or otherwise associated with one or more payloads for the treatment of a neurological disease.Type: ApplicationFiled: July 12, 2022Publication date: February 2, 2023Inventors: Dongxu Sun, Suhail Rasool, Catherine A. Gordon, Ke Hong, Fan Chen, Sara Matilda Bolin, Ksenya Shchors, Yadong Yu, Tsung-Huang Tsai, Samuel A.F. Williams, Karan Lala, Heng Wu, Yan Wang
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Publication number: 20220307522Abstract: A steam special effect sprayer comprises a condensation cavity, a first ejector structure, and a second ejector structure, wherein one end of the condensation cavity is connected with a steam pipeline, and the other end is connected with the second ejector structure. The first ejector structure which is built inside the condensation cavity ejects the steam from the steam pipeline into the condensation cavity, where the steam forms microdroplets, and then the second ejector structure ejects the microdroplets to the external environment.Type: ApplicationFiled: March 28, 2022Publication date: September 29, 2022Applicant: ITMation Ltd.Inventors: Eric Cheuk-Wah Tam, Ko Ke Hong
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Publication number: 20220264762Abstract: The present invention relates to a housing part, a housing and an electronic device. The housing part according to this invention comprises a first layer, said first layer being molded from a first composition comprising a1) 50-90 wt. % of a first amorphous polymer and b1) 10-50 wt. % of a first thermally conductive filler, the first composition having a thermal conductivity (TC1) of 4-40 W/(m*K), a second layer, said second layer being molded from a second composition comprising a2) 50-90 wt. % of a second amorphous polymer and b2) 10-50 wt. % of a second thermally conductive filler, the second composition having a thermal conductivity (TC2) of 0.Type: ApplicationFiled: July 13, 2020Publication date: August 18, 2022Inventors: Fan Yang, Ke Hong, Guanghui WU
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Publication number: 20210245418Abstract: The present invention relates to a thermoplastic composite article and a method of making the same. The method of preparing a thermoplastic composite article provided by the present invention comprises the steps of: a) coating a coating composition on one surface of a thermoplastic composite substrate; and b) allowing the substrate coated with the coating composition to be thermoformed in a forming mold to obtain the thermoplastic composite article. Compared with the prior art, the method of preparing a thermoplastic composite article provided by the present invention reduces the production steps such as overmolding and multiple spraying, decreases the warpage risk of the thermoplastic composite article, and simplifies the production process, thereby effectively improving the production efficiency and yield rate, in addition, it is also environmentally friendly.Type: ApplicationFiled: June 3, 2019Publication date: August 12, 2021Inventors: Yilan LI, David HARTMANN, Qinglan LIU, Wen XU, Ke HONG, Jinqi LI
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Publication number: 20210017669Abstract: Provided is a semiconductor epitaxial structure including a nucleation layer disposed on a substrate; a buffer layer disposed on the nucleation layer; a semiconductor layer disposed on the buffer layer; a barrier layer disposed on the semiconductor layer; and a cap layer disposed on the barrier layer. In a case where a bowing of the semiconductor epitaxial structure is less than or equal to +/?30 ?m, a maximum value or a minimum value of a ratio of a thickness of the buffer layer to a thickness of the semiconductor layer is represented as following formula: Y=aX1?bX2+cX3, X1?0 nm, X2?750 nm, X3?515 nm, wherein X1 is a thickness of the nucleation layer, X2 is the thickness of the buffer layer, X3 is the thickness of the semiconductor layer, a, b and c are constants respectively, and Y is a ratio of X3 to X2.Type: ApplicationFiled: July 2, 2020Publication date: January 21, 2021Applicant: GlobalWafers Co., Ltd.Inventors: Yen-Lun Huang, Ke-Hong Su, Ying-Ru Shih
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Patent number: 9923358Abstract: This document discusses, among other things, a protection system and method configured to detect a parasitic impedance between first and second pins of a standard connector and to remove a current path between a power source and a supply pin of the standard connector if a low-impedance is detected, in certain examples, without adding a current sense resistance to a return path between a ground pin of the standard connector and the power source.Type: GrantFiled: February 11, 2015Date of Patent: March 20, 2018Assignee: Fairchild Semiconductor CorporationInventors: Zhibo Tao, David Kunst, Won-Seok Kang, Ke Hong
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Publication number: 20150229119Abstract: This document discusses, among other things, a protection system and method configured to detect a parasitic impedance between first and second pins of a standard connector and to remove a current path between a power source and a supply pin of the standard connector if a low-impedance is detected, in certain examples, without adding a current sense resistance to a return path between a ground pin of the standard connector and the power source.Type: ApplicationFiled: February 11, 2015Publication date: August 13, 2015Inventors: Zhibo Tao, David Kunst, Won-Seok Kang, KE Hong
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Patent number: 8629219Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.Type: GrantFiled: June 22, 2010Date of Patent: January 14, 2014Assignee: Guangdong Shengyi Sci. Tech Co., Ltd.Inventors: Dong Wei, Ke Hong Fang
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Publication number: 20110161836Abstract: A method to synchronize file sharing in a video conference includes periodically labelling each video stream or document sharing stream with a session identifier (ID) to synchronize the conference video streams; periodically reporting to a server the session ID being streamed to the client, and comparing a received session ID with a session ID uploaded by the host client and sending a correct session ID to a client whose session ID exceeds a pre-determined synchronization tolerance.Type: ApplicationFiled: December 31, 2009Publication date: June 30, 2011Inventors: Ruicao Mu, Tingxue Huang, Tie Hu, Ke Hong
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Publication number: 20110157298Abstract: A method to provide video conferencing includes receiving at a server a plurality of video streams or audio streams from a plurality of clients; selecting a subset of video streams or audio streams to be rendered on a video conferencing display screen; providing access to the remaining participants through one or more links to one or more additional display screens; and sending only streams of the subset to a client to avoid transmissions of the remaining streams.Type: ApplicationFiled: December 31, 2009Publication date: June 30, 2011Inventors: Tingxue Huang, Tie Hu, Ruicao Mu, Ke Hong
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Publication number: 20110143618Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.Type: ApplicationFiled: June 22, 2010Publication date: June 16, 2011Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTD.Inventors: DONG WEI, Ke Hong Fang
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Publication number: 20100302346Abstract: A method to provide video conferencing includes generating at a client a high quality video stream and a low quality video stream; receiving at a server a plurality of high quality and low quality video streams from a plurality of clients; and sending from the server to each client one high quality video stream and a plurality of low quality video streams.Type: ApplicationFiled: May 27, 2009Publication date: December 2, 2010Inventors: Tingxue Huang, Tie Hu, Ruicao Mu, Ke Hong
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Publication number: 20080316660Abstract: An electrostatic discharge (ESD) avoiding circuit comprises an ESD detecting unit and a switch unit. The ESD detecting unit is coupled to a first conductive path for detecting whether the ESD happened or not. The switch unit is coupled between the first conductive path and a core circuit for switching whether the first conductive path is conducted to the core circuit or not according to a detection result of the ESD detecting unit. The ESD avoiding circuit can avoid an electrostatic current transmitting to the core circuit when the ESD is happened, and the ESD avoiding circuit can make the normal signal/voltage providing to the core circuit for operating when the ESD isn't happened.Type: ApplicationFiled: June 20, 2007Publication date: December 25, 2008Applicant: EMEMORY TECHNOLOGY INC.Inventors: Shao-Chang Huang, Ke-Hong Chen, Hsin-Ming Chen
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Patent number: 6484108Abstract: A system and method for presenting the tradeoffs among the sensitivity, false alarms and off-line operation of recovery boiler leak detection systems. For any given recovery boiler, the system and method utilizes prior data from that recovery boiler to provide the operator of that boiler with the ability to balance how sensitive the recovery boiler leak detection system can be along with how many false alarms of the recovery boiler leak detection system will be tolerated and along with how much off-line operation of the recovery boiler leak detection system will be acceptable.Type: GrantFiled: June 5, 2000Date of Patent: November 19, 2002Assignee: GE Betz, Inc.Inventors: Paul R. Burgmayer, Ke Hong, John C. Gunther
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Patent number: 6244098Abstract: Methods and apparatus are provided for detection of leaks in boilers containing a temperature control liquid which is supplemented with feedwater and removed as blowdown, main steam and sootblower steam. In a preferred embodiment, the boiler has an automatic liquid level control mechanism. The methods include measuring rates associated with feedwater supplementation and removal, correcting for the offsets between the supplementation and removal rates, determining the unaccounted for water rate, and comparing the unaccounted for water rate with zero to determine if a leak condition is present.Type: GrantFiled: March 25, 1998Date of Patent: June 12, 2001Assignee: Betzdearborn Inc.Inventors: Haiwen Chen, Paul R. Burgmayer, Ke Hong
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Patent number: 6170319Abstract: Methods and apparatus are provided for detection of leaks in boilers containing a temperature control liquid which is supplemented with feedwater and removed as blowdown. The methods include measuring rates associated with the feedwater supplementation and blowdown, adding a tracer to the temperature control liquid, determining the change in rate of the feedwater supplementation, determining the mass of the temperature control liquid, deriving the change in concentration of the chemical tracer in the temperature control liquid, calculating the unaccounted for water rate and comparing this rate with zero to determine if a leak condition is present.Type: GrantFiled: March 31, 1998Date of Patent: January 9, 2001Assignee: Betzdearborn Inc.Inventors: Haiwen Chen, Ke Hong, John C. Gunther
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Patent number: 6109096Abstract: Methods and apparatus are provided for detection of leaks in boilers containing a temperature control liquid which is supplemented with feedwater and removed as blowdown, main steam and sootblower steam. In a preferred embodiment, the boiler has an automatic liquid level control mechanism. The methods include measuring rates associated with feedwater supplementation and removal, determining the relationship between water input rate and water output rate; determining the change of mass of the temperature control liquid, determining the unaccounted for water rate, and comparing the unaccounted for water rate with zero to determine if a leak condition is present.Type: GrantFiled: September 26, 1997Date of Patent: August 29, 2000Assignee: BetzDearborn Inc.Inventors: Haiwen Chen, Ke Hong