Abstract: A camera module includes a circuit board, a lens assembly, and a first board. The circuit board includes a first surface, a second surface opposite to the first surface, a first sidewall, and a second sidewall opposite to the first sidewall. Each of the first sidewall and the second sidewall connects the first surface to the second surface. The lens assembly is disposed on the first surface. The first board is connected to the first sidewall. The first board is inclined or perpendicular to the first surface. The first board is disposed on a side of the lens assembly.

Abstract: A circuit board assembly with a fully embedded photosensitive chip which does not require an increase in board width for the re-routing of wires around the photosensitive chip includes a circuit board and a reinforced plate at a lower elevation which is connected to the circuit board. The circuit board defines a through hole and a plurality of conductive lines. The conductive lines or the portion of them which are cut off by the location of the through hole accommodating the chip are repeated by connecting lines carried on the reinforced plate, the plurality of connecting lines connects to and continues the conductive lines which are cut off by the hole.

Abstract: A simple and integrated imaging device for housing motor-switchable and laterally-moving filters between a camera-lens holder and an imaging chip comprises the switchable filters in a cavity and a switching mechanism, and a driving mechanism are also in the cavity. The imaging chip is carried by a flexible printed circuit board. The driving mechanism connected to the switching mechanism drives the switching mechanism to slide back and forth underneath the camera-lens holder, so that either the first or the second switchable filter covers a through hole allowing light to fall on the imaging chip. An electronic device including the imaging device is also disclosed.

Abstract: A circuit board assembly with a fully embedded photosensitive chip which does not require an increase in board width for the re-routing of wires around the photosensitive chip includes a circuit board and a reinforced plate at a lower elevation which is connected to the circuit board. The circuit board defines a through hole and a plurality of conductive lines. The conductive lines or the portion of them which are cut off by the location of the through hole accommodating the chip are repeated by connecting lines carried on the reinforced plate, the plurality of connecting lines connects to and continues the conductive lines which are cut off by the hole.

Abstract: A simple and integrated imaging device for housing motor-switchable and laterally-moving filters between a camera-lens holder and an imaging chip comprises the switchable filters in a cavity and a switching mechanism, and a driving mechanism are also in the cavity. The imaging chip is carried by a flexible printed circuit board. The driving mechanism connected to the switching mechanism drives the switching mechanism to slide back and forth underneath the camera-lens holder, so that either the first or the second switchable filter covers a through hole allowing light to fall on the imaging chip. An electronic device including the imaging device is also disclosed.

Abstract: A camera module includes a circuit board, a lens assembly, and a first board. The circuit board includes a first surface, a second surface opposite to the first surface, a first sidewall, and a second sidewall opposite to the first sidewall. Each of the first sidewall and the second sidewall connects the first surface to the second surface. The lens assembly is disposed on the first surface. The first board is connected to the first sidewall. The first board is inclined or perpendicular to the first surface. The first board is disposed on a side of the lens assembly.

Abstract: A lens module includes a lens holder, a filter, and a metal support. The lens holder includes a groove and sidewalls surrounding to form the groove. The metal support includes a support plate, heat dissipation plates, and heat transfer plates. At least one first mounting hole is formed on the sidewalls. The support plate comprises a support portion and a connecting portion connecting to each other. The connecting portion connects the support portion and each of the heat transfer plates. An opening is formed on the support portion and passes through the support portion. The filter is located on the support portion and covers the opening. The heat transfer plates are installed in the at least one first mounting hole. The support plate is received in the groove. The heat dissipation plates are located outside the lens holder. The disclosure also provides an electronic device having the lens module.

Abstract: A camera module includes a circuit board, a mounting bracket disposed on the circuit board, an image sensor disposed on the circuit board and received in the mounting bracket, a first lens disposed in the mounting bracket, a driving mechanism disposed in the mounting bracket, and a second lens connected to the driving mechanism, and located between the image sensor and the first lens. The driving can drive the second lens to move between the first lens and the image sensor.

Abstract: A lens module includes a lens holder, a filter, and a metal support. The lens holder includes a groove and sidewalls surrounding to form the groove. The metal support includes a support plate, heat dissipation plates, and heat transfer plates. At least one first mounting hole is formed on the sidewalls. The support plate comprises a support portion and a connecting portion connecting to each other. The connecting portion connects the support portion and each of the heat transfer plates. An opening is formed on the support portion and passes through the support portion. The filter is located on the support portion and covers the opening. The heat transfer plates are installed in the at least one first mounting hole. The support plate is received in the groove. The heat dissipation plates are located outside the lens holder. The disclosure also provides an electronic device having the lens module.

Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket on the circuit board has the image sensor. The optical filter on the mounting bracket is above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board by a frame of adhesive. The surface of the mounting bracket facing away from the circuit board has positioning posts at corners of the surface of the mounting bracket. A surface of the lens unit connected to the mounting bracket has receiving grooves positioned at corners of the surface of the lens unit. The positioning posts are inserted into the receiving grooves.

Abstract: A lens module includes a circuit board, a photosensitive chip, a mounting bracket, a filter, a lens base, and a lens. The circuit board defines a first through hole. The photosensitive chip is mounted within the first through hole. Gold fingers are mounted on the circuit board surrounding the photosensitive chip. Metal wires are mounted on a periphery of the photosensitive chip. Each of the metal wires is coupled to a corresponding one of the gold fingers. The metal wires are encapsulated by a colloid so that the metal wires do not contact each other. The mounting bracket is mounted on the circuit board. The filter is mounted on the mounting bracket and aligned with the photosensitive chip. The lens base is mounted on the mounting bracket. The lens is mounted within the lens base and aligned with the photosensitive chip.

Abstract: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.

Abstract: A lens module includes a circuit board, a photosensitive chip, a mounting bracket, a filter, a lens base, and a lens. The circuit board defines a first through hole. The photosensitive chip is mounted within the first through hole. Gold fingers are mounted on the circuit board surrounding the photosensitive chip. Metal wires are mounted on a periphery of the photosensitive chip. Each of the metal wires is coupled to a corresponding one of the gold fingers. The metal wires are encapsulated by a colloid so that the metal wires do not contact each other. The mounting bracket is mounted on the circuit board. The filter is mounted on the mounting bracket and aligned with the photosensitive chip. The lens base is mounted on the mounting bracket. The lens is mounted within the lens base and aligned with the photosensitive chip.

Abstract: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.

Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.

Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.

Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket on the circuit board has the image sensor. The optical filter on the mounting bracket is above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board by a frame of adhesive. The surface of the mounting bracket facing away from the circuit board has positioning posts at corners of the surface of the mounting bracket. A surface of the lens unit connected to the mounting bracket has receiving grooves positioned at corners of the surface of the lens unit. The positioning posts are inserted into the receiving grooves.

Abstract: A lens holder able to equalize air pressure at all times with the ambient atmosphere includes a packaging member and a support member. The packaging member has upper and lower surfaces, and the packaging member includes a first through hole and a groove in communication with the first through hole. The support member has first and second surfaces and includes a second through hole and a vent hole in communication with the second through hole. The packaging member is mounted to the second surface of the support member, the first through hole is in communication with the second through hole, and the vent hole of the support member is in communication with the groove of the packaging member. A camera module including the lens holder is also provided.

Abstract: A method for assembling a lens module to be free of dust and other pollutants includes providing a circuit board, an image sensor, an optical filter, and a mounting frame. The image sensor is connected to the circuit board. The optical filter is glued to the top side of the mounting frame, and the bottom side of the mounting frame is connected to the circuit board. The optical filter, the mounting frame, and the circuit board define a closed space receiving the image sensor. A lens is mounted in a lens holder to form a lens unit and the lens holder is attached to the circuit board, to position the lens above the image sensor, thereby obtaining the finished lens module.