Abstract: A headphone device of the invention includes a headband, a pair of joining members, a pair of holding members and a pair of sound generating modules. The headband is arc-shaped and has a first end and a second opposite to the first end. The joining members are movably disposed on the headband to approach or apart from the first end and the second end, and each of the joining members includes an upper contact portion extending towards another of the joining member. The holding members are rotatably joined to the joining members respectively, wherein each of the holding members includes a first pivot portion rotatably connected to one of the joining members and a holding portion secured to first pivot portion. The sound generating modules detachably disposed in the holding portion. The holding members rotate between a stretch position and a fold position.

Abstract: A method for assembling the electronic device is provided, including providing a band member, forming a buffer structure on the band member by overmolding, pulling the band member out of the buffer structure to form a channel in the buffer structure, providing a flexible circuit, and disposing the flexible circuit through the channel.

Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.

Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.

Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.