Patents by Inventor Ke-Hua LIN

Ke-Hua LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for assembling an electronic device
    Patent number: 11051415
    Abstract: A method for assembling the electronic device is provided, including providing a band member, forming a buffer structure on the band member by overmolding, pulling the band member out of the buffer structure to form a channel in the buffer structure, providing a flexible circuit, and disposing the flexible circuit through the channel.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 29, 2021
    Assignee: ACER INCORPORATED
    Inventors: Sheng-Wen Wu, Yu-Cheng Huang, Ke-Hua Lin, Shao-Chi Chuang, Wen-Shu Lee
  • ELECTRONIC DEVICE AND ASSEMBLY METHOD THEREOF
    Publication number: 20190014673
    Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.
    Type: Application
    Filed: September 14, 2018
    Publication date: January 10, 2019
    Inventors: Sheng-Wen WU, Yu-Cheng HUANG, Ke-Hua LIN, Shao-Chi CHUANG, Wen-Shu LEE
  • Electronic device and assembly method thereof
    Patent number: 10123437
    Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: November 6, 2018
    Assignee: ACER INCORPORATED
    Inventors: Sheng Wen Wu, Yu-Cheng Huang, Ke-Hua Lin, Shao-Chi Chuang, Wen-Shu Lee
  • ELECTRONIC DEVICE AND ASSEMBLY METHOD THEREOF
    Publication number: 20170071068
    Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.
    Type: Application
    Filed: July 25, 2016
    Publication date: March 9, 2017
    Inventors: Sheng Wen WU, Yu-Cheng HUANG, Ke-Hua LIN, Shao-Chi CHUANG, Wen-Shu LEE