Patents by Inventor Ke-qin Guo

Ke-qin Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting device and manufacturing method thereof
    Patent number: 10734557
    Abstract: A light-emitting device includes a package structure and a light-emitting chip. The package structure has a light exiting surface, a rear surface facing away from the light exiting surface, a groove inward recessed on the rear surface, and an outer surrounding side wall surrounding the groove. The light-emitting chip is disposed in the groove. The width of the package structure gradually decreases from the light exiting surface to the rear surface. The width of the groove gradually increases from inside to outside of the groove.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: August 4, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Liangliang Luo, Shu-yong Jia, Wen Lee, Ke-qin Guo
  • LED structure and light-emitting unit
    Patent number: 10522725
    Abstract: An LED structure includes a substrate, an LED chip disposed on the substrate, a wavelength conversion layer disposed above a light-emitting surface of the LED chip, and a cut-on optical filter disposed on a central region of the wavelength conversion layer.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: December 31, 2019
    Assignee: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
    Inventors: Ke-qin Guo, Wen Lee, Mu-qi Lee, Shu-yong Jia
  • LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20190363227
    Abstract: A light-emitting device includes a package structure and a light-emitting chip. The package structure has a light exiting surface, a rear surface facing away from the light exiting surface, a groove inward recessed on the rear surface, and an outer surrounding side wall surrounding the groove. The light-emitting chip is disposed in the groove. The width of the package structure gradually decreases from the light exiting surface to the rear surface. The width of the groove gradually increases from inside to outside of the groove.
    Type: Application
    Filed: December 26, 2018
    Publication date: November 28, 2019
    Inventors: Liangliang Luo, Shu-yong Jia, Wen Lee, Ke-qin Guo
  • LED STRUCTURE AND LIGHT-EMITTING UNIT
    Publication number: 20190058096
    Abstract: An LED structure includes a substrate, an LED chip disposed on the substrate, a wavelength conversion layer disposed above a light-emitting surface of the LED chip, and a cut-on optical filter disposed on a central region of the wavelength conversion layer.
    Type: Application
    Filed: January 26, 2018
    Publication date: February 21, 2019
    Inventors: Ke-qin Guo, Wen Lee, Mu-qi Lee, Shu-yong Jia