Abstract: A wireless communication method includes determining at least one Sounding Reference Signal (SRS) resource set configured by a BS, each SRS resource set comprises at least one SRS resource; and transmitting, to the BS, an uplink transmission based on the at least one SRS resource set.

Abstract: Systems and methods are provided for excitation spectral microscopy using frame-synchronized acousto-optic scanning of fluorescent excitation wavelengths. Linear unmixing of the images of targets of components that are individually labeled with different fluorophores can be simultaneously imaged with high temporal resolution and low crosstalk and the local abundance of each fluorophore at each pixel can be quantified. Fluorophore decomposed micrographs of the sample can be obtained by rendering the abundance in each pixel as an image.

Abstract: A laser source assembly and a projection apparatus are provided. The laser source assembly includes a laser device, a combining lens group, and a polarization direction adjustment component. The laser device is configured to emit laser beams of a plurality of colors. The combining lens group is configured to combine the laser beams of the plurality of colors and propagate the combined laser beams in a first direction. The polarization direction adjustment component is configured to adjust a polarization direction of at least a portion of the laser beams of the plurality of colors to obtain a target laser beam. A laser beam of at least one color in the target laser beam satisfies that the polarization direction of a portion of the laser beam of a same color is different from the polarization direction of another portion of the laser beam of a same color.

Abstract: A chip package is provided. The chip package includes a first chip, a second chip, an electrically conductive structure to which the first chip and the second chip are mounted, at least one contact terminal for electrically contacting the first chip and/or the second chip, and encapsulation material at least partially encapsulating the first chip, the second chip, and the electrically conductive structure. The encapsulation material forms a chip package body from which the at least one contact terminal protrudes. At least a portion of the electrically conductive structure forms a portion of an outer surface of the chip package body.

Abstract: Provided are a light source module and a backlight display module. The light source module includes a flexible printed circuit board and a plurality of side-emitting LEDs. The flexible printed circuit board extends along a central axis. The plurality of side-emitting LEDs are sequentially arranged along the central axis and bonded to the flexible printed circuit board, and a light-emitting surface of one side-emitting LED of the plurality of side-emitting LEDs is perpendicular to a bonding surface of the flexible printed circuit board.

Abstract: Present implementations are directed to simultaneous uplink transmissions based on multi-TRP operation. In some arrangements, a wireless communication method includes receiving, by a wireless communication device, a first downlink signaling that is associated with a second downlink signaling, and simultaneously transmitting, by the wireless communication device, a first uplink transmission and a second uplink transmission that are scheduled by the first downlink signaling and the second downlink signaling, respectively.

Abstract: The present disclosure provides a computer-implemented method, a device, and a storage medium. The method includes inputting an image into an attention-enhanced high-resolution network (AHRNet) to extract feature maps for generating a first feature map; generating a first probability map which is concatenated with the first feature map to form a concatenated first feature map, and updating the AHRNet using the first segmentation loss; generating a second feature map, and scaling the second feature map to form a third feature map; generating a second probability map which is concatenated with the third feature map to form a concatenated third feature map, and updating the AHRNet using the second segmentation loss; generating a fourth feature map, and scaling the fourth feature map to form a fifth feature map; updating the AHRNet using the third segmentation loss and the regional level set loss; and outputting the third probability map.

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

Abstract: A laser projection apparatus includes a laser source assembly, a light modulation assembly, and a projection lens. The laser source assembly includes a laser device. The laser device includes a base plate, a frame, a first light-emitting chip, a first reflecting portion, a first collimating portion, and a light homogenizing component. The first light-emitting chip is configured to emit a first laser beam. The first collimating portion is located in a sealed space and configured to collimate the first laser beam, so as to transmit the first laser beam to the light homogenizing component in a direction perpendicular to the base plate. The light homogenizing component is disposed on a side of the frame away from the base plate and configured to homogenize the first laser beam and propagate the first laser beam out of the sealed space.

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

Abstract: Provided is a light source, comprising at least one laser array, a light combining assembly, and a fly-eye lens; wherein the at least one laser array is configured to emit at least two colors of laser light; the light combining assembly is disposed on a light-output side of the at least one laser array and is configured to guide the laser light emitted from the at least one laser array to the fly-eye lens; the fly-eye lens is disposed on a light-output side of the light combining assembly and is configured to homogenize the laser light emitted from the at least one laser array; wherein the fly-eye lens comprises: a substrate; a plurality of first microlenses disposed on a light-incident surface of the substrate; and a plurality of second microlenses disposed on a light-output surface of the substrate.

Abstract: An image processing method is provided.

Abstract: Provided is a light source. The light source includes a laser array including a substrate, and a first row of laser chips and a second row of laser chips disposed on the substrate. The first row of laser chips includes at least one first-color laser chip and at least one second-color laser chip, the first-color laser chip and the second-color laser chip emitting laser beams of different colors, and the second row of laser chips includes at least three third-color laser chips, central wavelengths of two adjacent third-color laser chips in the second row of laser chips being different.

Abstract: A battery system with a large-format Li-ion battery powers attached equipment by discharging battery cells distributed among a plurality of battery packs. The discharging of the battery cells is controlled in an efficient manner while preserving the expected life of the Li-ion battery cells. Each battery pack internally supports a battery management system and may have identical components, thus supporting an architecture that easily scales to higher power/energy. Battery packs may be added or removed without intervention with a user, where one of battery packs serves as a master battery pack and the remaining battery packs serve as slave battery packs. When the master battery pack is removed, one of the slave battery packs becomes the master battery pack. Charging and discharging of the battery cells is coordinated by the master battery pack with the slave battery packs over a communication channel such as a controller area network (CAN) bus.

Abstract: A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.

Abstract: A laser source includes a laser device, a combining lens group, and a beam spot angle guiding component. The laser device includes a first laser device and a second laser device. The first laser device is configured to emit a first type laser beam and a second type laser beam. The second laser device is configured to emit the second type laser beam. The combining lens group includes a first combining lens group and a second combining lens group. The first combining lens group is configured to emit the laser beams emitted by the first laser device in a first direction. The second combining lens group is configured to reflect the laser beam. The beam spot angle guiding component is configured to change a divergence angle of at least one of the first type laser beam or the second type laser beam.

Abstract: A semiconductor package includes a die pad, a semiconductor die mounted on the die pad and comprising a first terminal facing away from the die pad and a second terminal facing and electrically connected to the die pad, an interconnect clip electrically connected to the first terminal, an encapsulant body of electrically insulating material that encapsulates the semiconductor die and the interconnect clip, and a first opening in the encapsulant body that exposes a surface of the interconnect clip, the encapsulant body comprises a lower surface, an upper surface opposite from the lower surface, and a first outer edge side extending between the lower surface and the upper surface, and the first opening is laterally offset from the first outer edge side.

Abstract: A laser projection apparatus includes a laser source, a light modulating engine and a projection lens. The laser source includes a laser device, a combining component, a first lens and a phosphor wheel. The combining component includes a reflecting region and two transmitting regions. The reflecting region is configured to reflect a laser beam and a fluorescent beam incident on the reflecting region. The two transmitting regions are disposed on two sides of the reflecting region respectively, and the transmitting regions are configured to transmit a plurality of laser beams emitted by the laser device. The phosphor wheel includes a first region and a second region. The first region is configured to diffuse and reflect the laser beams incident on the first region. The second region is configured to be excited to emit a fluorescent beam due to irradiation of the laser beams incident on the second region.

Abstract: A method, apparatus and device for synchronously playing audio are provided. The method includes: acquiring status information of a Bluetooth controller in the first audio playing device and Bluetooth time from the Bluetooth controller, and determining native Bluetooth time of the first audio playing device based on the status information and the Bluetooth time acquired from the Bluetooth controller; estimating, based on the native Bluetooth time of the first audio playing device and offset time of the native Bluetooth time of the first audio playing device relative to native Bluetooth time of a second audio playing device or native Bluetooth time of an audio providing device, absolute time of the second audio playing device or absolute time of the audio providing device; and playing an audio signal provided by the audio providing device synchronously with the second audio playing device based on the estimated absolute time.

Abstract: A semiconductor module includes: a dual-gauge leadframe having thicker and thinner parts, part of the thinner part forming a high voltage lead; a semiconductor die attached to the thicker part; and a molding compound (MC) encapsulating the die. The thicker leadframe part is disposed at a bottom side of the MC. A side face of the MC has a stepped region between the high voltage lead and thicker leadframe part. A first generally vertical part of the stepped region extends from the high voltage lead to the generally horizontal part, a generally horizontal part of the stepped region extends to the second generally vertical part, and a second generally vertical part of the stepped region extends to the bottom side of the MC. A linear dimension of the generally horizontal part as measured from the first generally vertical part to the second generally vertical part is at least 4.5 mm.