Abstract: Provided is a light source device, including a first laser light source group, a second laser light source group, a dichroic mirror, a fluorescence converter, and an emission component. The first laser light source group emits laser light of a first waveband, and the second laser light source group emits laser light of a second waveband and laser light of a third waveband. The dichroic mirror is disposed on light-output sides of the first laser light source group and the second laser light source group, and the fluorescence converter and the emission component are respectively disposed on light-output sides of the dichroic mirror. The dichroic mirror is configured to emit laser light of various wavebands, and the fluorescence converter generates target fluorescence under the excitation of the laser light of the first waveband, and the target fluorescence is reflected by the dichroic mirror to the emission component.

Abstract: A laser projection apparatus includes a laser source assembly, an optical modulator, a display control circuit, and a signal shaping circuit. The laser source assembly is configured to be turned on or turned off under driving of a target driving signal. The display control circuit is configured to: output an image display driving signal to the optical modulator, and synchronously output an initial driving signal to the laser source assembly. The initial driving signal includes an initial enable signal and an initial brightness adjustment signal. The signal shaping circuit is disposed in a path for transmitting at least one of the initial enable signal or the initial brightness adjustment signal to the laser source assembly. The signal shaping circuit is configured to output a shaping signal. The shaping signal is superimposed on the initial enable signal or the initial brightness adjustment signal to form the target driving signal.

Abstract: A laser projection apparatus includes a laser source assembly, a display control circuit, a signal shaping circuit and a laser source driving circuit. The display control circuit is configured to output a first driving signal and a second driving signal. The signal shaping circuit is coupled to the laser source driving circuit, and is configured to shape the first driving signal based on a shaping signal to obtain a target driving signal. A frequency of the target driving signal is higher than a frequency of the first driving signal. The laser source driving circuit is coupled to the laser source assembly, and is configured to receive the second driving signal and the target driving signal, and drive the laser source assembly to be turned on or turned off in response to the second driving signal and the target driving signal.

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

Abstract: A semiconductor package includes: a die pad having opposing first and second sides and lateral sides connecting the first and second sides; at least one semiconductor die arranged over the first side; an encapsulation including a first dielectric material and encapsulating the semiconductor die, the second side of the die pad being at least partially exposed from the encapsulation; and a contiguous isolation structure including a second dielectric material different from the first dielectric material and covering the second side of the die pad. The encapsulation includes at least one first trench arranged along at least a part of a contour of the second side of the die pad. The second side of the die pad includes at least one second trench arranged along at least a part of the contour of the second side of the die pad. The trenches are filled by the contiguous isolation structure.

Abstract: A battery system with a large-format Li-ion battery powers attached equipment by discharging battery cells distributed among a plurality of battery packs. The discharging of the battery cells is controlled in an efficient manner while preserving the expected life of the Li-ion battery cells. Each battery pack internally supports a battery management system and may have identical components, thus supporting an architecture that easily scales to higher power/energy. Battery packs may be added or removed without intervention with a user, where one of battery packs serves as a master battery pack and the remaining battery packs serve as slave battery packs. When the master battery pack is removed, one of the slave battery packs becomes the master battery pack. Charging and discharging of the battery cells is coordinated by the master battery pack with the slave battery packs over a communication channel such as a controller area network (CAN) bus.

Abstract: A laser device and a laser source assembly are provided. The laser device includes a base, a plurality of frames, a plurality of groups of laser chips, and a plurality of collimating lens groups. Any frame is correspondingly provided with a group of laser chips. Any group of laser chips includes a plurality of laser chips. Any collimating lens group includes a plurality of collimating lenses. The plurality of collimating lenses correspond to the plurality of laser chips, respectively. Any collimating lens is located on a laser-exit path of a corresponding laser chip.

Abstract: Disclosed is a polycyclic azide desulfurizer, including the following raw materials in parts by mass: 20-35 parts of an alcohol amine, 20-35 parts of an amide, and an aldehyde, which is 10-15 parts of a small-molecule aldehyde or 20-35 parts of a polyaldehyde. Also disclosed is a method for synthesis of the polycyclic azide desulfurizer, including: mixing an alcohol amine with an amide and stirring, heating, adding a catalyst I dropwise, and performing reaction to obtain a monocyclic triazine, heating the monocyclic triazine, mixing with a polyaldehyde and stirring, adding a catalyst II dropwise, and performing coupling while stirring; alternatively, mixing a small-molecule aldehyde with an amide and stirring, heating, adding a catalyst I dropwise, and performing reaction, adding an alcohol amine, adding a catalyst II dropwise, and performing coupling while stirring; and separating a by-product from a product obtained after the coupling out, and purifying the product.

Abstract: A light source and a laser projection device are provided. The light source includes a laser array, a light combining mirror group, and a light spot shaping component. The laser array includes a first row of laser chips and a second row of laser chips. The first row of laser chips includes at least one first-color laser chip and at least one second-color laser chip, and the second row of laser chips includes at least two red laser chips. The light combining mirror group is configured to combine laser beams emitted by the laser array. The light spot shaping component is configured to receive and adjust a light beam coming from the light combining mirror group to increase the difference between the length of a light spot of the light beam in a long side direction and the length thereof in a short side direction.

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

Abstract: A laser projection apparatus includes a laser source assembly, a light modulation assembly, and a projection lens. The laser source assembly includes a laser device, a combining lens group, and a fly-eye lens. The laser device is configured to emit laser beams of three colors. The laser beams of the three colors includes a blue laser beam, a green laser beam, and a red laser beam. The combining lens group is located on a laser-exit side of the laser device and configured to combine the laser beams emitted by the laser device. The fly-eye lens is located on a laser-exit side of the combining lens group and configured to homogenize the laser beams emitted by the laser device.

Abstract: An interconnect clip includes a die attach pad that comp includes rises a die attach surface at an inner side of the interconnect clip, a heat dissipation pad that includes a heat dissipation surface at an outer side of the interconnect clip, and a lead contact pad that includes a lead contact surface at an inner side of the interconnect clip or at an outer side of the interconnect clip. The outer side of the interconnect clip in the lead contact pad faces and is spaced apart from the inner side of the interconnect clip in the heat dissipation pad, and the inner side of the interconnect clip in the lead contact pad faces and is spaced apart from the outer side of the interconnect clip in the die attach pad.

Abstract: A package is disclosed. In one example, the package comprises a carrier having a front side and a back side, an electronic component mounted on the front side of the carrier, and an encapsulant at least partially encapsulating the electronic component and partially encapsulating the carrier so that the back side is at least partially exposed with respect to the encapsulant. The back side of the carrier has at least one vacuum suction enhancing indentation for enhancing vacuum suction of the carrier during encapsulation.

Abstract: Provided is a laser device. The laser device includes a plurality of light-emitting components and a diffractive optical element. The plurality of light-emitting components are configured to emit laser beams of various colors. The diffractive optical element is disposed on light-output paths of the plurality of light-emitting components, wherein the diffractive optical element includes a plurality of diffractive areas, each of the plurality of diffractive areas corresponding to one color laser beam; and the diffractive optical element is configured to shape incident laser beams.

Abstract: A laser source assembly and a projection apparatus are provided. The laser source assembly includes a laser device, a combining lens group, and a polarization direction adjustment component. The laser device is configured to emit laser beams of a plurality of colors. The combining lens group is configured to combine the laser beams of the plurality of colors and propagate the combined laser beams in a first direction. The polarization direction adjustment component is configured to adjust a polarization direction of at least a portion of the laser beams of the plurality of colors to obtain a target laser beam. A laser beam of at least one color in the target laser beam satisfies that the polarization direction of a portion of the laser beam of a same color is different from the polarization direction of another portion of the laser beam of a same color.

Abstract: A chip package is provided. The chip package includes a first chip, a second chip, an electrically conductive structure to which the first chip and the second chip are mounted, at least one contact terminal for electrically contacting the first chip and/or the second chip, and encapsulation material at least partially encapsulating the first chip, the second chip, and the electrically conductive structure. The encapsulation material forms a chip package body from which the at least one contact terminal protrudes. At least a portion of the electrically conductive structure forms a portion of an outer surface of the chip package body.

Abstract: The present disclosure provides a computer-implemented method, a device, and a storage medium. The method includes inputting an image into an attention-enhanced high-resolution network (AHRNet) to extract feature maps for generating a first feature map; generating a first probability map which is concatenated with the first feature map to form a concatenated first feature map, and updating the AHRNet using the first segmentation loss; generating a second feature map, and scaling the second feature map to form a third feature map; generating a second probability map which is concatenated with the third feature map to form a concatenated third feature map, and updating the AHRNet using the second segmentation loss; generating a fourth feature map, and scaling the fourth feature map to form a fifth feature map; updating the AHRNet using the third segmentation loss and the regional level set loss; and outputting the third probability map.

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

Abstract: A laser projection apparatus includes a laser source assembly, a light modulation assembly, and a projection lens. The laser source assembly includes a laser device. The laser device includes a base plate, a frame, a first light-emitting chip, a first reflecting portion, a first collimating portion, and a light homogenizing component. The first light-emitting chip is configured to emit a first laser beam. The first collimating portion is located in a sealed space and configured to collimate the first laser beam, so as to transmit the first laser beam to the light homogenizing component in a direction perpendicular to the base plate. The light homogenizing component is disposed on a side of the frame away from the base plate and configured to homogenize the first laser beam and propagate the first laser beam out of the sealed space.

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.