Patents by Inventor Kean Huat Leong

Kean Huat Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same
    Patent number: 10636749
    Abstract: A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: April 28, 2020
    Assignee: Intel Corporation
    Inventors: Kean Huat Leong, Chun Kit See, Sheng Jian Darren Tan, Paik Wen Ong, Eng Huat Goh
  • SEMICONDUCTOR PACKAGE SUBSTRATE SUPPORT STRUCTURES FOR BALL-GRID ARRAY CAVITIES, AND METHODS OF ASSEMBLING SAME
    Publication number: 20190148310
    Abstract: A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.
    Type: Application
    Filed: June 26, 2018
    Publication date: May 16, 2019
    Inventors: Kean Huat Leong, Chun Kit See, Sheng Jian Darren Tan, Paik Wen Ong, Eng Huat Goh