Patents by Inventor Keat Ng

Keat Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9480096
    Abstract: An improved fast wireless accessory device pairing process at a radio communication device includes initiating, via a first short-range transceiver, a pairing procedure with a wearable computing device and establishing a link with the wearable computing device. Subsequently, receiving Bluetooth device connection information for each of a plurality of wireless accessory devices associated with a wearer of the wearable computing device. The Bluetooth device connection information includes at least a hardware device identifier of the associated wireless accessory and capability information of the associated wireless accessory. Responsive to receiving the Bluetooth device connection information, and for each of the plurality wireless accessory devices, using the hardware device identifier and capability information to pair with and communicate with the wireless accessory device.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: October 25, 2016
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Kok Bee Lee, Kong Chin Chee, Sze Keat Ng, Rm Muthaiah Ramanathan, Syed Isa Syed Idrus, Ting Fook Tang
  • Publication number: 20160085498
    Abstract: A method and apparatus for muting a device is provided herein. During operation a device such as a two-way radio detects a user's voice and will mute the radio in response to the voice being detected. During the time period the device is muted, all received transmissions will be stored by the radio. These transmissions will be played back to the user when voice activity has ceased for a predetermined amount of time. In a second embodiment of the present invention, the device is only muted when a particular identified user's voice is detected.
    Type: Application
    Filed: September 24, 2014
    Publication date: March 24, 2016
    Inventors: KONG CHIN CHEE, KOK BEE LEE, SZE KEAT NG, RM MUTHAIAH RAMANATHAN, SYED ISA SYED IDRUS
  • Publication number: 20070252246
    Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
    Type: Application
    Filed: May 1, 2006
    Publication date: November 1, 2007
    Inventors: Kee Ng., Hui Koay, Chiau Lee, Kheng Tan, Wei Loo, Keat Ng., Alzar Abdul Norfidathul
  • Publication number: 20070246722
    Abstract: A light emitting diode (LED) having enhanced integrity. The light emitting source of the LED is preferably an LED chip encapsulated by a compliant material, preferably silicone. The LED chip is supported within an optical shell so that a gap exists between the compliant material and the interior surface of the shell, thereby avoiding delamination.
    Type: Application
    Filed: April 25, 2006
    Publication date: October 25, 2007
    Inventor: Keat Ng