Abstract: A heat sink apparatus for use with electronic components comprises a base portion and at least a securing portion. The base portion and the securing portion are of unitary construction. The base portion is configured to have at least one receiving aperture and one heat-conducting surface with fins extended from or attached to its opposite surface. The securing portion is a unitary construction which comprises a cam element and spring clip with auto-align and camming mechanism features. The securing portion is configured to have partially constrained with the base portion, and to be slide along the length direction for dynamic location of electronic device on heat sink. The cam element can be rotated about its cylindrical feature axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with heat-conducting surface.

Abstract: A heat sink apparatus for use with electronic components comprises a base member and an integral spring clip. The base member and the integral spring clip(s) are of unitary construction. The base member is configured to have at least one receiving aperture and one heat-conducting surface with fins extended from or attached to its opposite surface. The integral spring clip comprises solderable elements, i.e. leads and surfaces, and auto-align mechanism feature. The integral spring clip is configured to have fully constrained with the base member, and to flex about an axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with heat-conducting surface. The heat sink apparatus can be mounted onto a print circuit or wiring board via either through-hole or surface mounting technology to meet the circuit design and space requirements.

Abstract: A heat sink apparatus for use with electronic components comprises a base frame, a clipping system and a plurality of supporting members. The base frame and the clipping system and the supporting members are of unitary construction. The base frame is configured to have “i” repeatable channels with fins extended from or attached to its outside surfaces. The clipping system comprises a matrix [i, j] set of i×j spring clips. Each spring clip is configured to have partially constrained with the base frame, and to flex about an axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with the inside walls of the channel. The supporting members are configured to have fixed connection with the base frame and be solderable. The heat sink apparatus's capacity of holding electronic components is scalable to accommodate upgrades and design changes of electronic products.

Abstract: An optical connector cleaning device for cleaning a ferrule end surface of an optical or fiberoptic connector is described. The device includes a cleaning rod, a drive mechanism, and a cleaning media, such as a swab, a brush, a pad, or a foam, connected to an end of the cleaning rod and having a thickness past the end of the cleaning rod of at least about 0.125 inches. A mating connector housing the cleaning rod may be provided for connecting with the optical connector. The drive mechanism may be housed in a handheld body or may be mounted on a dummy card connector physically compatible with a slot in a card-cage. The dummy card connector may include an adjustable frame which can be adjusted to modify card size in order for the same dummy card connector to be physically compatible with more than one physical slot configuration.

Abstract: A system for fixing two components together includes: (a) a boss integrally formed from one component about a boss axis; and (b) a latch integrally formed from the other component in a depending extension facilitating latch movement in an engaging plane and exerting a spring force urging the latch toward a first position. The latch is oriented about a latch axis in the engaging plane. The latch is in the first position when the components are situated in an initial position with the latch axis and the boss axis separated a first distance. The latch axis and the boss axis are separated a second distance less than the first distance when the components are urged together to an installed orientation with the latch held from the first position by the boss bearing against the latch with the engaging plane crossing the boss axis.

Abstract: A system for fixing two components together includes: (a) a boss integrally formed from one component about a boss axis; and (b) a latch integrally formed from the other component in a depending extension facilitating latch movement in an engaging plane and exerting a spring force urging the latch toward a first position. The latch is oriented about a latch axis in the engaging plane. The latch is in the first position when the components are situated in an initial position with the latch axis and the boss axis separated a first distance. The latch axis and the boss axis are separated a second distance less than the first distance when the components are urged together to an installed orientation with the latch held from the first position by the boss bearing against the latch with the engaging plane crossing the boss axis.

Abstract: An improved heat sink apparatus for use with an electronic component comprises a base portion and a securing portion. The base portion and the securing portion are of unitary construction. The securing portion is configured to flex about an axis to effect an engaged relation with the base portion at a locus distal from the axis. The base portion and the securing portion cooperate in the engaged relation to substantially fixedly maintain the electronic component in abutting relation with the base portion.