Patents by Inventor Keck C. Pathammavong

Keck C. Pathammavong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preformed thermal fuse
    Patent number: 6373371
    Abstract: A preformed thermal fuse comprising two electrodes, at least one layer of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse.
    Type: Grant
    Filed: August 17, 1999
    Date of Patent: April 16, 2002
    Assignee: Microelectronic Modules Corp.
    Inventors: Bernhard E. Doerrwaechter, Keck C. Pathammavong, Kurt M. Krachenfels
  • Preformed thermal fuse
    Patent number: 5939969
    Abstract: A preformed thermal fuse comprising two electrodes, first and second layers of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse. The melting temperatures of the first and second layers of solder are selected to allow reflow soldering of the device.
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: August 17, 1999
    Assignee: Microelectronic Modules Corporation
    Inventors: Bernhard E. Doerrwaechter, Keck C. Pathammavong, Kurt M. Krachenfels