Patents by Inventor Kedar DHANE
Kedar DHANE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11581240Abstract: An integrated circuit package that includes a liquid phase thermal interface material (TIM) is described. The package may include any number of die. The liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader and bounded on the sides by a perimeter layer. The liquid phase TIM can be fixed in place or circulated, depending on application. A thermal conductivity of the liquid phase TIM can be at least 15 Watts/meter-Kelvin, according to some embodiments. A liquid phase TIM eliminates failure mechanisms present in solid phase TIMs, such as cracking due to warpage and uncontained flow out of the module.Type: GrantFiled: December 21, 2018Date of Patent: February 14, 2023Assignee: Intel CorporationInventors: Kedar Dhane, Omkar Karhade, Aravindha R. Antoniswamy, Divya Mani
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Publication number: 20200203254Abstract: An integrated circuit package that includes a liquid phase thermal interface material (TIM) is described. The package may include any number of die. The liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader and bounded on the sides by a perimeter layer. The liquid phase TIM can be fixed in place or circulated, depending on application. A thermal conductivity of the liquid phase TIM can be at least 15 Watts/meter-Kelvin, according to some embodiments. A liquid phase TIM eliminates failure mechanisms present in solid phase TIMs, such as cracking due to warpage and uncontained flow out of the module.Type: ApplicationFiled: December 21, 2018Publication date: June 25, 2020Applicant: INTEL CORPORATIONInventors: Kedar Dhane, Omkar Karhade, Aravindha R. Antoniswamy, Divya Mani
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Publication number: 20200203470Abstract: A conductive metal pillar is disposed within a composite material used as a die overflow material to form inductor on a module substrate. In situ fabrication of inductors on a module substrate enable customized selection of an inductance value, thus enabling inductors (and other similar peripheral devices) to be placed on a module substrate rather than on a motherboard. Furthermore, these in situ fabricated peripheral devices may also be used to remove excess heat produced by a die because the magnetic particles of the composite material are also thermally conductive. Furthermore, electrically conductive elements of the peripheral devices can be placed in contact with the die and/or integrated heat spreader.Type: ApplicationFiled: December 20, 2018Publication date: June 25, 2020Applicant: INTEL CORPORATIONInventors: Kedar Dhane, Malavarayan Sankarasubramanian, Yongki Min, William J. Lambert
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Patent number: 10461003Abstract: An electronic package that includes a substrate; a die attached to the substrate; an underfill positioned between the die and the substrate due to capillary action; a first support adjacent to the die and attached to the substrate; and a second support mounted on the first support, wherein the second support is closer to the die than the first support, wherein first support surrounds the die and the second support surrounds the die, and wherein the second support is a different material than the first support. The die may be flip chip bonded to the substrate and the underfill may secure the die to the substrate. The first support may be attached to the substrate using an adhesive and the second support may be attached to the first support using an adhesive.Type: GrantFiled: November 11, 2016Date of Patent: October 29, 2019Assignee: Intel CorporationInventors: Omkar Karhade, Kedar Dhane
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Patent number: 10290561Abstract: A thermal interface may include a wired network made of a first TIM, and a second TIM surrounding the wired network. A heat spreader lid may include a wired network attached to an inner surface of the heat spreader lid. An IC package may include a heat spreader lid placed over a first electronic component and a second electronic component. A first thermal interface may be formed between the first electronic component and the inner surface of the heat spreader lid, and a second thermal interface may be formed between the second electronic component and the inner surface of the heat spreader lid. The first thermal interface may include a wired network of a first TIM surrounded by a second TIM, while the second thermal interface may include the second TIM, without a wired network of the first TIM. Other embodiments may be described and/or claimed.Type: GrantFiled: September 28, 2016Date of Patent: May 14, 2019Assignee: Intel CorporationInventors: Edvin Cetegen, Omkar G. Karhade, Kedar Dhane, Chandra M. Jha
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Patent number: 10157860Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a stiffener on a substrate, wherein a first section of the stiffener and a second section of the stiffener are on opposite sides of an opening. At least one component may be attached on the substrate within the opening, wherein the at least one component is disposed between the first section of the stiffener and the second section of the stiffener, and wherein the stiffener comprises a grounding structure disposed on the substrate.Type: GrantFiled: December 28, 2016Date of Patent: December 18, 2018Assignee: Intel CorporationInventors: Omkar G. Karhade, Kedar Dhane, Yongki Min, William J. Lambert
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Publication number: 20180358274Abstract: An electronic package that includes a substrate; a die attached to the substrate; an underfill positioned between the die and the substrate due to capillary action; a first support adjacent to the die and attached to the substrate; and a second support mounted on the first support, wherein the second support is closer to the die than the first support, wherein first support surrounds the die and the second support surrounds the die, and wherein the second support is a different material than the first support. The die may be flip chip bonded to the substrate and the underfill may secure the die to the substrate. The first support may be attached to the substrate using an adhesive and the second support may be attached to the first support using an adhesive.Type: ApplicationFiled: November 11, 2016Publication date: December 13, 2018Inventors: Omkar Karhade, Kedar Dhane
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Publication number: 20180182718Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a stiffener on a substrate, wherein a first section of the stiffener and a second section of the stiffener are on opposite sides of an opening. At least one component may be attached on the substrate within the opening, wherein the at least one component is disposed between the first section of the stiffener and the second section of the stiffener, and wherein the stiffener comprises a grounding structure disposed on the substrate.Type: ApplicationFiled: December 28, 2016Publication date: June 28, 2018Applicant: Intel CorporationInventors: Omkar G. Karhade, Kedar Dhane, Yongki Min, William J. Lambert
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Publication number: 20180090411Abstract: A thermal interface may include a wired network made of a first TIM, and a second TIM surrounding the wired network. A heat spreader lid may include a wired network attached to an inner surface of the heat spreader lid. An IC package may include a heat spreader lid placed over a first electronic component and a second electronic component. A first thermal interface may be formed between the first electronic component and the inner surface of the heat spreader lid, and a second thermal interface may be formed between the second electronic component and the inner surface of the heat spreader lid. The first thermal interface may include a wired network of a first TIM surrounded by a second TIM, while the second thermal interface may include the second TIM, without a wired network of the first TIM. Other embodiments may be described and/or claimed.Type: ApplicationFiled: September 28, 2016Publication date: March 29, 2018Inventors: Edvin Cetegen, Omkar G. Karhade, Kedar Dhane, Chandra M. Jha
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Patent number: 9799610Abstract: Creating surface variations on a stiffener in a stack reduces inter-stiffener sticking and stiffener stack tilt in pick and place media. The surface variations provide one or more airgaps that reduce inter-stiffener surface contact, provide space for contaminants and/or provide an averaged surface height due to surface roughness.Type: GrantFiled: December 18, 2015Date of Patent: October 24, 2017Assignee: INTEL CORPORATIONInventors: Mingjie Xu, Suzana Prstic, Kedar Dhane
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Publication number: 20170179043Abstract: Creating surface variations on a stiffener in a stack reduces inter-stiffener sticking and stiffener stack tilt in pick and place media. The surface variations provide one or more airgaps that reduce inter-stiffener surface contact, provide space for contaminants and/or provide an averaged surface height due to surface roughness.Type: ApplicationFiled: December 18, 2015Publication date: June 22, 2017Applicant: INTEL CORPORATIONInventors: Mingjie Xu, Suzana Prstic, Kedar Dhane
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Publication number: 20170170087Abstract: An electronic package that includes a substrate; a die attached to the substrate; an underfill positioned between the die and the substrate due to capillary action; a first support adjacent to the die and attached to the substrate; and a second support mounted on the first support, wherein the second support is closer to the die than the first support, wherein first support surrounds the die and the second support surrounds the die, and wherein the second support is a different material than the first support. The die may be flip chip bonded to the substrate and the underfill may secure the die to the substrate. The first support may be attached to the substrate using an adhesive and the second support may be attached to the first support using an adhesive.Type: ApplicationFiled: December 14, 2015Publication date: June 15, 2017Inventors: Omkar Karhade, Kedar Dhane
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Publication number: 20160268213Abstract: An apparatus including a package including a die and a package substrate, the package substrate including a conductor; and a stiffener body electrically coupled to the conductor of the package substrate. An apparatus including a package including a die and a package substrate; a stiffener body coupled to the package substrate; and an electrically conductive path between the stiffener body and the package substrate. A method including electrically coupling a stiffener body to a conductor of a package substrate.Type: ApplicationFiled: March 9, 2015Publication date: September 15, 2016Inventors: Hongjin JIANG, Robert STARKSTON, Digvijay A. RAORANE, Keith D. JONES, Ashish DHALL, Omkar G. KARHADE, Kedar DHANE, Suriyakala RAMALINGAM, Li-Sheng WENG, Robert F. CHENEY, Patrick N. STOVER