Patents by Inventor Kedar G. Shah
Kedar G. Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11801381Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.Type: GrantFiled: December 9, 2016Date of Patent: October 31, 2023Assignee: Lawrence Livermore National Security, LLCInventors: Satinderpall S. Pannu, Kedar G. Shah, Supin Chen, Marissa Crosetti, Timir B. Datta-Chaudhuri, Sarah H. Felix, Anna N. Ivanovskaya, Jason Jones, Kye Young Lee, Susant Patra, Vanessa Tolosa, Angela C. Tooker
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Patent number: 11357975Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.Type: GrantFiled: June 9, 2016Date of Patent: June 14, 2022Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Supin Chen, Sarah H. Felix, Satinderpall S. Pannu, Susant Patra, Vanessa Tolosa, Angela C. Tooker, Jason Jones
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Patent number: 11214048Abstract: A stiffener-reinforced microelectrode array probe and fabrication method using wicking channel-distributed adhesives which temporarily adheres a flexible device onto a rigid stiffener for insertion and extraction. Assembly is by dispensing a liquid adhesive into a narrow open groove wicking channel formed on the stiffener so that the adhesive is wicked along and fills the channel by capillary action, and adhering the adhesive-filled bonding side of the elongated section of the rigid substrate to a flexible device.Type: GrantFiled: February 25, 2019Date of Patent: January 4, 2022Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Diana George, Satinderpall S. Pannu, Sarah Felix
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Patent number: 10612153Abstract: The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.Type: GrantFiled: June 6, 2017Date of Patent: April 7, 2020Assignee: Lawrence Livermore National Security, LLCInventors: Anna Nikolaevna Ivanovskaya, Vanessa Tolosa, Dylan Dahlquist, Satinderpall S. Pannu, Kedar G. Shah, Angela C. Tooker, Fang Qian
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Publication number: 20190322094Abstract: A stiffener-reinforced microelectrode array probe and fabrication method using wicking channel-distributed adhesives which temporarily adheres a flexible device onto a rigid stiffener for insertion and extraction. Assembly is by dispensing a liquid adhesive into a narrow open groove wicking channel formed on the stiffener so that the adhesive is wicked along and fills the channel by capillary action, and adhering the adhesive-filled bonding side of the elongated section of the rigid substrate to a flexible device.Type: ApplicationFiled: February 25, 2019Publication date: October 24, 2019Inventors: Kedar G. Shah, Diane George, Satinderpall S. Pannu, Sarah Felix
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Patent number: 10342128Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.Type: GrantFiled: September 23, 2016Date of Patent: July 2, 2019Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
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Patent number: 10214001Abstract: A stiffener-reinforced microelectrode array probe and fabrication method using wicking channel-distributed adhesives which temporarily adheres a flexible device onto a rigid stiffener for insertion and extraction. Assembly is by dispensing a liquid adhesive into a narrow open groove wicking channel formed on the stiffener so that the adhesive is wicked along and tills the channel by capillary action, and adhering the adhesive-filled bonding side of the elongated section of the rigid substrate to a flexible device.Type: GrantFiled: February 4, 2013Date of Patent: February 26, 2019Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Diane George, Satinderpall S. Pannu, Sarah Felix
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Publication number: 20190054295Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.Type: ApplicationFiled: December 9, 2016Publication date: February 21, 2019Applicants: Lawrence Livermore National Security, LLC, Lawrence Livermore National Security, LLCInventors: Satinderpall S. PANNU, Kedar G. SHAH, Supin CHEN, Marissa CROSETTI, Timir B. DATTA-CHAUDHURI, Sarah H. FELIX, Anna N. IVANOVSKAYA, Jason JONES, Kye Young LEE, Susant PATRA, Vanessa TOLOSA, Angela C. TOOKER
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Patent number: 10149980Abstract: A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.Type: GrantFiled: June 24, 2015Date of Patent: December 11, 2018Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Satinderpall S. Pannu, Susant Patra
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Publication number: 20180169406Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.Type: ApplicationFiled: June 9, 2016Publication date: June 21, 2018Inventors: Kedar G. Shah, Supin Chen, Sarah H. Felix, Satinderpall S. Pannu, Susant Patra, Venessa Tolosa
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Patent number: 9999363Abstract: A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.Type: GrantFiled: April 13, 2015Date of Patent: June 19, 2018Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Sarah H. Felix, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker
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Publication number: 20170350034Abstract: The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.Type: ApplicationFiled: June 6, 2017Publication date: December 7, 2017Inventors: Anna Nikolaevna Ivanovskaya, Vanessa Tolosa, Dylan Dahlquist, Satinderpall S. Pannu, Kedar G. Shah, Angela C. Tooker, Fang Qian
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Publication number: 20170348534Abstract: An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.Type: ApplicationFiled: June 29, 2017Publication date: December 7, 2017Inventors: Vanessa Tolosa, Satinderpall S. Pannu, Heeral Sheth, Angela C. Tooker, Kedar G. Shah, Sarah H. Felix
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Patent number: 9788740Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.Type: GrantFiled: July 13, 2016Date of Patent: October 17, 2017Assignee: Lawrence Livermore National Security, LLCInventors: Angela C. Tooker, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Vanessa Tolosa
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Patent number: 9694190Abstract: An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.Type: GrantFiled: March 14, 2014Date of Patent: July 4, 2017Assignee: Lawrence Livermore National Security, LLCInventors: Vanessa Tolosa, Satinderpall S. Pannu, Heeral Sheth, Angela C. Tooker, Kedar G. Shah, Sarah H. Felix
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Publication number: 20170036012Abstract: Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.Type: ApplicationFiled: October 19, 2016Publication date: February 9, 2017Inventors: Phillipe J. Tabada, Satinderpall S. Pannu, Kedar G. Shah, Vanessa Tolosa, Angela Tooker, Terri Delima, Heeral Sheth, Sarah Felix
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Publication number: 20170013713Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.Type: ApplicationFiled: September 23, 2016Publication date: January 12, 2017Inventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
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Publication number: 20160380381Abstract: A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.Type: ApplicationFiled: June 24, 2015Publication date: December 29, 2016Inventors: Kedar G. SHAH, Satinderpall S. PANNU, Susant PATRA
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Publication number: 20160338607Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.Type: ApplicationFiled: July 13, 2016Publication date: November 24, 2016Inventors: Angela C. Tooker, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Vanessa Tolosa
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Patent number: 9504177Abstract: A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.Type: GrantFiled: June 14, 2012Date of Patent: November 22, 2016Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Satinderpall S. Pannu