Abstract: A photovoltaic module includes front and back sealing layers and at least one photovoltaic cell positioned located therebetween. A moisture resistant layer provided between the first and second sealing layers extends around a portion of a perimeter of the at least one photovoltaic cell. A moisture barrier structure including moisture barrier particles is operatively connected to the sealing layers. The moisture barrier structure improves the moisture resistance of the sealing layer and decreases the water vapor transmission rate into the photovoltaic module.

Abstract: A photovoltaic module includes front and back sealing layers and at least one photovoltaic cell positioned located therebetween. A moisture resistant layer provided between the first and second sealing layers extends around a portion of a perimeter of the at least one photovoltaic cell. A moisture barrier structure including moisture barrier particles is operatively connected to the sealing layers. The moisture barrier structure improves the moisture resistance of the sealing layer and decreases the water vapor transmission rate into the photovoltaic module.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Mounting clamps and rail/clamp spacing configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Cable clamps and cable spacing configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: A method and apparatus for forming a sputtering target are provided that includes a copper indium gallium sputtering target material on a backing structure. The sputtering target is formed by compressing pre-alloyed and atomized powders of Cu, In, and Ga at pressures below 35,000 psi. In some embodiments the sputtering target material contains Na, S, or Se. In other embodiments the sputtering target is formed by isothermal compression.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Mounting clamps and rail/clamp spacing configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell and a transparent and abrasion resistant film which includes an organic-inorganic hybrid material formed over the glass layer.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell, and a transparent planarizing hardcoat formed on the glass layer. The planarizing hardcoat may be in compressive stress and the glass layer may be in tension.

Abstract: A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive and tensile forces by providing at least one interior shielding element are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized shielding element may be used to shield the diode assembly.

Abstract: Multilayer articles such as thin-film solar cells can be effectively tested under thermal load in a mini-module that includes a chamber or enclosure in which one or more laminated multilayer articles are housed. The inner dimensions of the chamber, at least along the axis that is perpendicular to the plane defined by the laminated solar cells, are configured to remain substantially constant during testing. Cooling the laminated solar cells in the mini-module device causes the encapsulant material to shrink and thereby induces accelerated failures in the laminated solar cells and associated structures. A technique of detecting the presence of defects or failures is near infrared radiation thermography wherein NIR images of the laminated solar cells are taken during the cooling process. The color patterns manifested from the cooled laminated solar cells can reveal the location, nature and extent of the defect or failure.

Abstract: Process chamber shields having specially profiled edges exhibit increased lifetime in PVD and CVD deposition chambers. Edge profiling reduces flaking and delamination of materials deposited onto the shields, thereby prolonging shield life, and, consequently, reducing costs associated with deposition. In one embodiment, a shield having an edge portion terminating in a rounded tip, where the tip has high curvature and a small thickness, is provided. In another aspect, a shield having a concave portion connecting with an edge portion, where an upper (inner) surface of the edge portion forms a tangent plane to the upper (inner) concave surface of the concave surface, is provided. In yet another aspect, a shield with a tapered edge portion is provided. Shields, having profiled edges in accordance with these aspects and in accordance with combinations of these aspects, can better support deposited films, particularly films containing compressively stressed materials, such as metal nitrides.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Mounting clamps and rail/clamp spacing and spacers configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Mounting clamps and rail/clamp spacing configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Cable clamps and cable spacing configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell and a transparent and abrasion resistant film which includes an organic-inorganic hybrid material formed over the glass layer.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell, and a transparent planarizing hardcoat formed on the glass layer. The planarizing hardcoat may be in compressive stress and the glass layer may be in tension.

Abstract: A photovoltaic device includes at least one photovoltaic cell and a flexible glass layer formed over the at least one photovoltaic cell. The flexible glass layer having a first major surface facing the at least one photovoltaic cell and a second major surface facing away from the at least one photovoltaic cell. A first encapsulant layer is formed over the first major surface of the flexible glass layer, the first encapsulant layer having a modulus of less than 100 MPa at room temperature. A second encapsulant layer is formed over the second major surface of the flexible glass layer, the second encapsulant layer includes a composite material including a polymer matrix containing a filler material.

Abstract: A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive and tensile forces by providing at least one interior shielding element are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized shielding element may be used to shield the diode assembly.

Abstract: A photovoltaic module having a light transmissive front layer, a back layer, and a plurality of interconnected photovoltaic cells disposed between the light transmissive front layer and the back layer has a CTE-modified composite encapsulant is interposed between the plurality of solar cells and the light transmissive front layer. The composite encapsulant includes a bulk encapsulant transmissive to visible and near visible wavelengths of the solar spectrum and having a base coefficient of thermal (CTE) expansion, and an encapsulant CTE modifier in the bulk encapsulant. The encapsulant CTE modifier is substantially evenly distributed through the composite encapsulant thickness and interacts with the bulk encapsulant to reduce the effective CTE of the composite encapsulant below that of the bulk encapsulant.