Abstract: Systems, computer program products, and methods are described herein for implementing a code debugger platform in a virtual environment. The system is configured to authenticate a plurality of users via an authentication portal and initialize an instance of a virtual environment for each of the plurality of users. The system is configured to extract a plurality of computer instructions, and display, in the virtual environment, a debugging platform of an integrated development environment, the debugging platform configured to receive the plurality of computer instructions and receive input from at least one of the plurality of users, and initiate a debugging protocol. The debugging protocol may include a breakpoint in at least one of the plurality of computer instructions, wherein the breakpoint is received as an input from the at least one of the plurality of users.

Abstract: The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

Abstract: The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly further includes an interface formed on the supporting structure at the distal end of the cable. The interface includes electrodes and/or sensors in electrical connection with the conductive traces, and the supporting structure has at least one curved portion disposed between a first set of electrodes and a second set of electrodes, and/or between a first set of sensors and a second set of sensors.

Abstract: The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

Abstract: An implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

Abstract: The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

Abstract: The present disclosure relates to thin-film lead assemblies and neural interfaces, and methods of microfabricating thin-film lead assemblies and neural interfaces. Particularly, aspects of the present disclosure are directed to a thin-film neural interface that includes a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, one or more of conductive traces formed on a portion of the supporting structure, one or more electrodes formed on the front side of the supporting structure in electrical connection with the one or more conductive traces, and a backing formed on the back side of the supporting structure. The supporting structure comprises one or more features to facilitate mechanical adhesion between the supporting structure and the backing.

Abstract: An electrical cable assembly amenable to implantation into a body includes a flexible cable. The flexible cable includes a dielectric substrate, a conductor lead for conducting an electrical signal, a conductive barrier layer, and an overmold layer. The conductor lead is embedded within and surrounded by the dielectric substrate. The conductive barrier layer surrounds the dielectric substrate and encases the dielectric substrate and conductor lead in a cavity. The conductive barrier layer is a continuous material layer that is neither braided nor spiral wrapped and provides a hermetic barrier formed of a metallic or inorganic material. The overmold layer provides one or more of mechanical protection or strain relief to the conductive barrier layer.

Abstract: Ophthalmic systems and methods of changing an optical power of an ophthalmic system are described. In an example, the ophthalmic system includes an accommodating intraocular device shaped to be implantable in an eye and an extraocular device separate from the accommodating intraocular device shaped to be removably mountable to a portion of the eye outside a bulb of the eye, such as an underlid portion of the eye. In an example, the method includes wirelessly transmitting power from a power source of an extraocular device removably mounted outside a bulb of an eye to an accommodating intraocular device implanted in the eye.

Abstract: The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

Abstract: The present disclosure relates to systems and methods for packaging a solid-state battery. Consistent with some embodiments, a package for a solid-state battery includes a substrate, a cap disposed over the substrate and forming an enclosure with the substrate, and a solid-state battery disposed inside the enclosure. The solid-state battery includes a first electrode that is disposed over the substrate, an electrolyte that is disposed over the first electrode, and a second electrode that is disposed over the electrolyte. The package further includes a compressible component disposed inside the enclosure and between the cap and the second electrode of the solid-state battery. The compressible component applies a pressure to at least one of the electrodes of the solid-state battery in a direction substantially perpendicular to the electrode(s) of the solid-state battery.

Abstract: An electrode cuff for placement around a peripheral nerve can include one or more protrusions extending from a tissue-contacting surface of the electrode cuff. A protrusion can include one or more electrodes and can have a blunt distal end. The protrusion(s) can be driven into the nerve using a driving tool designed to apply mechanical oscillations and/or swift mechanical force to the electrode cuff. The mechanical oscillations and/or swift mechanical force can insert the blunt distal ends of the protrusions into the nerve without damaging fascicles within the nerve. During implantation, a sensor associated with the driving tool and/or the electrode cuff can provide dynamic feedback to a controller for controlling the driving tool. The sensor may detect pressure, temperature, acoustic activity, and/or electrical activity to indicate when the protrusions have pierced the epineurium, allowing the controller to cease the driving tool and thus avoid damage to the fascicles.

Abstract: An example implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

Abstract: A hybrid connector for connecting a bulk conductor to a planar strand of a flexible circuit is described. The hybrid connector can include a connector body, a first connector end, and a second connector end. The first connector end can be attached to the connector body and can define a first opening having a first cross-sectional shape that corresponds to a first distal end of the strand. The second connector end can be attached to the connector body opposite the first connector end and can define a second opening having a second cross-sectional shape that corresponds to a second distal end of the bulk conductor.

Abstract: A device includes a neural interface and a lead body. The lead body includes a bulk conductor and the neural interface includes a flexible circuit. The flexible circuit includes a microfabricated substrate and an exposed electrode. An interconnect region disposed between the electrode and the bulk conductor provides electrical connection between the electrode and the bulk conductor such that electrical signals can be communicated relative to the electrode via the bulk conductor. The interconnect region can be respectively connected to the electrode and bulk conductor by wire-bonding, welding, or other suitable connection methods.

Abstract: A device is described that includes a neural interface and a lead body. The lead body and the neural interface are formed from a flexible circuit. The flexible circuit includes an exposed electrode. The lead body includes an elongate planar strand that is coiled about a central axis of the lead body. The elongate planar strand includes a conductive trace extending between the exposed electrode and a distal end of the elongate planar strand.

Abstract: The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

Abstract: Ophthalmic systems and methods of changing an optical power of an ophthalmic system are described. In an example, the ophthalmic system includes an accommodating intraocular device shaped to be implantable in an eye and an extraocular device separate from the accommodating intraocular device shaped to be removably mountable to a portion of the eye outside a bulb of the eye, such as an underlid portion of the eye. In an example, the method includes wirelessly transmitting power from a power source of an extraocular device removably mounted outside a bulb of an eye to an accommodating intraocular device implanted in the eye.

Abstract: An example implantable connector for connecting an electronics package and a neural interface is made by way of a set of compressible contacts (e.g., springs) that physical contact a set of corresponding exposed bond pads. The compressible contacts are held in compression with the exposed bond pads using a mechanical coupler. The compressible contacts are physically separated and electrically isolated from each other by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

Abstract: The present invention relates to implantable neuromodulation systems and methods, and in particular to modular neuromodulation systems suitable for implantation in a minimally invasive manner, methods of manufacturing the modular neuromodulation systems, and methods of treating rheumatoid arthritis using the modular neuromodulation systems. Particularly, aspects of the present invention are directed to a medical device that includes an implantable neurostimulator including a housing having a width of less than 10 mm and a height of less than 10 mm, one or more feedthroughs that pass through the housing, and an electronics module within the housing and connected to the one or more feedthroughs. The medical device further includes a lead assembly including a lead body including a conductor material, a lead connector that connects the conductor material to the one or more feedthroughs, and one or more electrodes connected to the conductor material.