Patents by Inventor Kee Cheong Tan

Kee Cheong Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a manifold in a substrate and printhead substructure having the same
    Patent number: 6641745
    Abstract: A method of forming a manifold through a substrate of a printhead substructure is disclosed. The substrate has an ink reservoir-facing side and an opposing transducer-supporting side. The transducer-supporting side of the substrate is introduced to an etchant. A laser beam is used to irradiate the etchant contacting side of the substrate. The irradiated areas of the substrate are thereby etched to define a first portion of the manifold therein. A second portion of the manifold is formed, preferably by sand blasting, to connect to the first portion. A printhead substructure that includes a substrate having a manifold formed according to the method is also disclosed.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: November 4, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kee Cheong Tan, Pean Lim, Kiong Chin Chng
  • Method of forming a manifold in a substrate and printhead substructure having the same
    Publication number: 20030095166
    Abstract: A method of forming a manifold through a substrate of a printhead substructure is disclosed. The substrate has an ink reservoir-facing side and an opposing transducer-supporting side. The transducer-supporting side of the substrate is introduced to an etchant. A laser bean is used to irradiate the etchant contacting side of the substrate. The irradiated areas of the substrate are thereby etched to define a first portion of the manifold therein. A second portion of the manifold is formed, preferably by sand blasting, to connect to the first portion. A printhead substructure that includes a substrate having a manifold formed according to the method is also disclosed.
    Type: Application
    Filed: November 16, 2001
    Publication date: May 22, 2003
    Inventors: Kee Cheong Tan, Pean Lim, Kiong Chin Chng