Patents by Inventor Kee Leong Cheah

Kee Leong Cheah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages with stiffening support for power delivery
    Patent number: 7884470
    Abstract: Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: February 8, 2011
    Assignee: Intel Corporation
    Inventors: Kee Leong Cheah, Eu Soon Lee
  • Semiconductor packages with stiffening support for power delivery
    Publication number: 20100155927
    Abstract: Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.
    Type: Application
    Filed: December 23, 2008
    Publication date: June 24, 2010
    Inventors: Kee Leong Cheah, Eu Soon Lee