Patents by Inventor Kee-Leong YU

Kee-Leong YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probing system for discrete wafer
    Patent number: 11703524
    Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: July 18, 2023
    Assignee: HERMES TESTING SOLUTIONS INC.
    Inventors: Wen-Yuan Hsu, Chi-Ming Yang, Sih-Ying Chang, Tsung-Po Lee, Kee-Leong Yu
  • PROBING SYSTEM FOR DISCRETE WAFER
    Publication number: 20220163563
    Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.
    Type: Application
    Filed: November 1, 2021
    Publication date: May 26, 2022
    Inventors: Wen-Yuan HSU, Chi-Ming YANG, Sih-Ying CHANG, Tsung-Po LEE, Kee-Leong YU