Abstract: Provided are an apparatus for manufacturing a compound powder, a method of manufacturing an iron-boron compound powder by using the apparatus, a boron alloy powder mixture, a method of manufacturing the boron alloy powder mixture, a combined powder structure, a method of manufacturing the combined powder structure, a steel pipe, and a method of manufacturing the steel pipe The method of manufacturing the boron alloy powder mixture includes: preparing a mixed powder including a boron iron alloy powder and a target powder; heat-treating the mixed powder to boronize at least a portion of the target powder and de-boronize at least a portion of the boron iron alloy powder, thereby de-boronizing the boron iron alloy powder to reduce the melting point of the boron iron alloy powder.

Abstract: Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).

Abstract: A plasma generator according to an embodiment of the present invention is provided to generate a high density and stable plasma at near atmospheric pressure by preventing a transition of plasma to arc. The plasma generator includes a plate-shaped lower electrode for seating a substrate; and a cylindrical rotating electrode on the plate-shaped lower electrode, wherein the cylindrical rotating electrode includes an electrically conductive body that is connected to a power supply and includes a plurality of capillary units on an outer circumferential surface of the electrically conductive body; and an insulation shield layer that is made of an insulation material or a dielectric material, exposes a lower surface of the plurality of capillary units, and shields other parts.

Abstract: A plasma generator according to an embodiment of the present invention is provided to generate a high density and stable plasma at near atmospheric pressure by preventing a transition of plasma to arc. The plasma generator includes a plate-shaped lower electrode for seating a substrate; and a cylindrical rotating electrode on the plate-shaped lower electrode, wherein the cylindrical rotating electrode includes an electrically conductive body that is connected to a power supply and includes a plurality of capillary units on an outer circumferential surface of the electrically conductive body; and an insulation shield layer that is made of an insulation material or a dielectric material, exposes a lower surface of the plurality of capillary units, and shields other parts.

Abstract: Provided are an apparatus for manufacturing a compound powder, a method of manufacturing an iron-boron compound powder by using the apparatus, a boron alloy powder mixture, a method of manufacturing the boron alloy powder mixture, a combined powder structure, a method of manufacturing the combined powder structure, a steel pipe, and a method of manufacturing the steel pipe The method of manufacturing the boron alloy powder mixture includes: preparing a mixed powder including a boron iron alloy powder and a target powder; heat-treating the mixed powder to boronize at least a portion of the target powder and de-boronize at least a portion of the boron iron alloy powder, thereby de-boronizing the boron iron alloy powder to reduce the melting point of the boron iron alloy powder.

Abstract: Disclosed are a thin film solar cell and a method of manufacturing the thin film solar cell. The thin film solar cell according to an exemplary embodiment of the present invention thin film solar cell includes a substrate: a front electrode layer formed on the substrate; an oxide layer formed on the front electrode layer: a light absorbing layer (intrinsic layer) formed on the oxide layer; and a back electrode layer formed on the light absorbing layer, wherein the oxide layer is formed of a material selected from MoO3, WO3, V2O5, NiO and CrO3.

Abstract: Disclosed are a thin film solar cell and a method of manufacturing the thin film solar cell. The thin film solar cell according to an exemplary embodiment of the present invention thin film solar cell includes a substrate: a front electrode layer formed on the substrate; an oxide layer formed on the front electrode layer: a light absorbing layer (intrinsic layer) formed on the oxide layer; and a back electrode layer formed on the light absorbing layer, wherein the oxide layer is formed of a material selected from MoO2, WO2, V2O5, NiO and CrO3.

Abstract: Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).

Abstract: Provided is a method of forming a metal interconnection line on a flexible substrate, wherein the method includes: coating a hard mask layer on at least one surface of the flexible substrate, followed by performing photolithography thereon to form a predetermined hard mask pattern; etching a portion of the flexible substrate by using the hard mask pattern as a mask to form a trench; plasma treating the inside of the trench by using a treatment gas for pre-treating the flexible substrate; coating a seed layer inside the trench; removing the hard mask pattern; and filling the inside of the trench coated with the seed layer with metal. A metal interconnection line formed by using the method may have a strong adhesion force with respect to the flexible substrate.

Abstract: Disclosed is a method for improving the wear- and corrosion-resistance of a chromium-plated steel substrate by heat-treating the chromium-plated steel substrate under optimum conditions to inhibit a drop in corrosion-resistance of a steel substrate due to fine cracks formed at a chromium layer, and to improve a hardness of the chromium layer. The heat-treating method comprises the steps of: plating the chromium layer onto the steel substrate; and heating the chromium-plated steel substrate in an oxidizing gas environment at above atmospheric pressure to form oxidized layers containing magnetite (Fe3O4) on the surface of the steel substrate, the surface of the steel substrate being partly exposed to the air through penetrating cracks formed in the chromium layer.

Abstract: Disclosed is a method for improving the wear- and corrosion-resistance of a chromium-plated steel substrate by heat-treating the chromium-plated steel substrate under optimum conditions to inhibit a drop in corrosion-resistance of a steel substrate due to fine cracks formed at a chromium layer, and to improve a hardness of the chromium layer. The heat-treating method comprises the steps of: plating the chromium layer onto the steel substrate; and heating the chromium-plated steel substrate in an oxidizing gas environment at above atmospheric pressure to form oxidized layers containing magnetite (Fe3O4) on the surface of the steel substrate, the surface of the steel substrate being partly exposed to the air through penetrating cracks formed in the chromium layer.

Abstract: Disclosed is an apparatus for generating low-temp plasma at atmospheric pressure, comprising: a couple of electrodes facing each other at a distance, one of them being connected to a power supply, the other being grounded; a couple of dielectrics with a thickness of 25 &mgr;m-10 mm, positioned on the facing surfaces of the electrodes in such a way as to face each other, one of them having at least one discharge gap therein; and a conductor electrode having at least one tip positioned within the discharge gap, in which an electric field is applied at an intensity of 1-100 KV/cm through the power supply across the electrodes by use of a pulse direct current or an alternating current in a frequency bandwidth of 50 Hz-10 GHz while a reaction gas is fed between the electrodes, so as to induce a hollow cathode discharge, a capillary discharge or the high accumulation of charges from the discharge gap.

Abstract: Disclosed is an apparatus for generating low-temp plasma at atmospheric pressure, comprising: a couple of electrodes facing each other at a distance, one of them being connected to a power supply, the other being grounded; a couple of dielectrics with a thickness of 25 &mgr;m-10 mm, positioned on the facing surfaces of the electrodes in such a way as to face each other, one of them having at least one discharge gap therein; and a conductor electrode having at least one tip positioned within the discharge gap, in which an electric field is applied at an intensity of 1-100 KV/cm through the power supply across the electrodes by use of a pulse direct current or an alternating current in a frequency bandwidth of 50 Hz-10 GHz while a reaction gas is fed between the electrodes, so as to induce a hollow cathode discharge, a capillary discharge or the high accumulation of charges from the discharge gap.