Abstract: A printed circuit board includes a first insulating layer, a wiring pattern disposed in an upper side of the first insulating layer, a second insulating layer disposed on an upper surface of the first insulating layer and having a cavity exposing the wiring pattern, and an insulating pattern disposed between the first and second insulating layers, and having a side surface partially exposed by the cavity, while having an upper surface entirely covered by the second insulating layer.

Abstract: A printed circuit board including: a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer, and including a first wiring portion and a second wiring portion; and a second insulating layer disposed on the upper surface of the first insulating layer, having a cavity exposing an upper surface of the second wiring portion, and including a first insulating portion covering the first wiring portion and a second insulating portion whose upper surface is exposed from the cavity, wherein one or more gaps are provided between the second wiring portion and the second insulating portion.

Abstract: A printed circuit board includes: a first insulating layer; a first wiring layer at least partially buried in the first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a second wiring layer at least partially buried in the second insulating layer; and a cavity penetrating through the second insulating layer and a portion of the first insulating layer and exposing a portion of the upper surface of the first insulating layer as a bottom surface of the cavity. The first wiring layer includes a wiring pattern at least partially exposed from the first insulating layer by the cavity, an upper surface of the wiring pattern has a step structure with the upper surface of the first insulating layer exposed by the cavity, and a lower surface of the wiring pattern is coplanar with a lower surface of the first insulating layer.

Abstract: A printed circuit board includes: a first insulating layer; a first wiring layer at least partially buried in the first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a second wiring layer at least partially buried in the second insulating layer; and a cavity penetrating through the second insulating layer and a portion of the first insulating layer and exposing a portion of the upper surface of the first insulating layer as a bottom surface of the cavity. The first wiring layer includes a wiring pattern at least partially exposed from the first insulating layer by the cavity, an upper surface of the wiring pattern has a step structure with the upper surface of the first insulating layer exposed by the cavity, and a lower surface of the wiring pattern is coplanar with a lower surface of the first insulating layer.

Abstract: A printed circuit board includes an insulating material with a bump pad buried in one surface, an adhesive layer stacked on the one surface of the insulating material, an insulating layer stacked on the adhesive layer, and a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad, wherein the cavity has a cross-sectional area decreasing in a direction toward the insulating material.

Abstract: A printed circuit board includes an insulating material with a bump pad buried in one surface, an adhesive layer stacked on the one surface of the insulating material, an insulating layer stacked on the adhesive layer, and a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad, wherein the cavity has a cross-sectional area decreasing in a direction toward the insulating material.

Abstract: Disclosed herein is a touch sensor, including: a window substrate; and a bezel layer formed along an edge of the window substrate, wherein the bezel layer includes a print layer and a shield layer, wherein the print layer includes titanium dioxide TiO2 of from 60 to 95 weight %. According to the present invention, titanium dioxide TiO2 of from 60 to 95 weight % is included in the print layer, which is an element of the bezel layer of the touch sensor, so that whiteness may be improved. Further, the thickness of the print layer is 20 ?m or less, so that difficulty in forming electrical connection due to a level difference may be overcome.

Abstract: Embodiments of the invention provide a touch sensor including a window substrate and a bezel layer formed on outer edges of one surface of the window substrate, wherein the bezel layer includes a printed layer formed on the window substrate, a medium layer formed on the printed layer and having a refractive index lower than that of the printed layer, and a reflective layer formed on the medium layer. According to at least one embodiment, the bezel layer formed on the window substrate is reduced in thickness and various colors are more easily implemented.

Abstract: Disclosed herein is provided with a touch sensor, including: a window substrate; a first bezel layer formed at an edge portion of the window substrate and formed of at least one layer; and a resin layer disposed on the first bezel layer and the window substrate. The touch sensor further includes a second bezel layer disposed on the resin layer, at a position corresponding to the first bezel layer and the resin layer is made of a transparent material having a refractive index lower than that of the first bezel layer and the second bezel layer. As described above, the plurality of bezel layers and the resin layer are stacked together to form a difference in refractive index, thereby implementing a clear color even by the thinner bezel layer.

Abstract: This invention relates to a photo-sensitive resin composition for a bezel of a touch screen module, including a colorant composed of surface-modified TiO2, a binder resin, a dispersing agent, a photopolymerizable compound, a photoinitiator, and a solvent, and having a viscosity of 2˜30 cps and a solid content of 50˜90 mass %, and to a bezel for a touch screen module using the same. The photo-sensitive resin composition can exhibit superior dispersion stability, and even when a thin pattern layer is formed therefrom, whiteness represented by L* can be 85% or more, and thus the photo-sensitive resin composition can be effectively utilized in a bezel for a touch screen module.

Abstract: Disclosed herein is a touch sensor including: a window substrate; bezels formed along an edge of the window substrate; a first insulating layer stacked while being filled between the bezels to be formed on the window substrate; a second insulating layer applied or adhered onto the bezel and the first insulating layer; and an electrode pattern formed on the second insulating layer.

Abstract: This invention relates to a photo-sensitive resin composition for a bezel of a touch screen module, including a colorant composed of surface-modified TiO2, a binder resin, a dispersing agent, a photopolymerizable compound, a photoinitiator, and a solvent, and having a viscosity of 2˜30 cps and a solid content of 50˜90 mass %, and to a bezel for a touch screen module using the same. The photo-sensitive resin composition can exhibit superior dispersion stability, and even when a thin pattern layer is formed therefrom, whiteness represented by L* can be 85% or more, and thus the photo-sensitive resin composition can be effectively utilized in a bezel for a touch screen module.

Abstract: Disclosed herein is a touch panel, including: a transparent substrate divided into an active area and a non-active area, which is an outer region of the active area; electrodes formed on one surface of the transparent substrate; and a bezel formed in the non-active area of one surface of the transparent substrate, wherein the bezel is formed of a bezel composition containing silane and a pigment.

Abstract: There is provided a touch screen module including a glass substrate, a first photosensitive resin layer formed on the glass substrate and a bezel including a second photosensitive resin layer formed on the first photosensitive resin layer, and transparent electrodes simultaneously formed on both the glass substrate and the bezel. A residue phenomenon in which pigment particles included in the bezel remain on a surface of the glass substrate after exposure and development may be prevented.

Abstract: There is provided a touchscreen panel, including: a transparent substrate including a first area having a first surface roughness and a second area having a second surface roughness; and an ink layer formed on the second area, wherein the degree of second surface roughness is higher than the degree of first surface roughness.

Abstract: The present invention relates to an interlayer insulating composition for a multilayer printed wiring board including: an epoxy resin including a naphthalene-modified epoxy resin, a cresol novolac epoxy resin, and a rubber-modified epoxy resin; a thermoplastic resin; a curing agent; and an inorganic filler and a multilayer printed wiring board including the same as an insulating layer. The present invention can provide an insulating composition excellent in adhesion between an insulating layer and a Cu layer to secure normal operation and reliability of a final substrate. Further, since the present invention properly includes an epoxy resin and a thermoplastic resin regardless of an increase in the content of an inorganic filler, it is possible to secure the reliability of the substrate by preventing an insulating film from being brittle and improving toughness of the insulating film while maintaining a low thermal expansion rate.

Abstract: Disclosed herein are an insulating resin composition, an insulating film manufactured therefrom, and a multilayer printed circuit board, and more specifically, in a build-up manner of multilayer printed circuit board, an insulating epoxy resin composition including a liquid crystal oligomer or the like capable of decreasing a dissipation factor, a dielectric constant, and a coefficient of thermal expansion, an insulating film manfuactured by using the insulating epoxy resin composition, and a multilayer printed circuit board having multiple layers obtained by allowing inner circuits formed of copper (Cu) to be insulated by using the insulating film.

Abstract: Disclosed herein are an adhesive member for manufacturing a printed circuit board, a printed circuit board, and a method of manufacturing the same. The printed circuit board includes a base substrate, an insulating layer formed on the base substrate, a primer layer formed on the insulating layer, and a circuit layer formed on the primer layer.